Packaging and MEMS for RF microwave Packaging and

Packaging and MEMS for RF/ microwave

Packaging and MEMS for RF/ microwave Program: 09: 00 Registration, coffee 09: 30 Opening/Introduction 09: 45 Wolfgang Heinrich: “Flip-chip for Millimeter-Wave and Broadband Packaging” 11: 00 W. Heinrich: “Modeling the package of a Ga. N power transistor” 11: 45 Lunch 12: 45 Kari Kautio, “LTCC – packaging & smart system integration” 14: 00 Coffee break 14: 30 Héctor J. De Los Santos, “Applications and Trends in RF - MEMS” 15: 45 General discussion / Concluding remarks 16: 00 – 16: 30 Seminar closing

Vestfold University College VUC Administration Health and Nursing Electronics Teaching Education Electro automation Maritime Education Data Science and Engineering Social Sciences Product design

Micro- and nanotechnology at VUC • Close to 20 Ph. D. students • International master study (taught in English) § Up to 20 students admitted per year • Bachelor study (in Norwegian) • Research § Building methods for MNT w Interconnection w Packaging w 3 D integration 44 34 § Micro- and nano-systems for: w w w Energy harvesting Biomedical applications RF applications Optical applications Maritime applications. . . 19 9 5 23

Norwegian Center of Expertise – Microand Nanotechnology • Vestfold UC / IMST and the local industry cluster has national status as Norwegian Center of Expertise in micro- and nanotechnology

Electronic Coast • Organisation for ICT and Electronics companies in Vestfold • 34 member companies/ institutions • Team packaging: § Individual members from the companies/ institutions § Meetings for open-minded discussions on challenges in packaging § Network of colleagues § Seminars

More information – VUC/ IMST • http: //imst. hive. no/ • Research Summary § Select ”Research” and ”Research Summary 2008”