Overview and update of LHCb Upgrade Preamble Excellent
Overview and update of LHCb Upgrade “Preamble” Excellent performance of current detector in hadronic environment demonstrated! Ø excellent vertexing performance Ø excellent mass resolution world best measurements in Ø excellent particle identification flavour physics and rare decays Ø high selectivity and low background Ø very efficient trigger Note: seminar today at 11: 00 on First evidence of direct CP violation in D 0 K+K-, π+π- charm decays ΔACP=[-0. 82± 0. 21(stat)± 0. 11(sys)]% @HCP 2011 Why upgrading LHCb? LHCC Upgrade Session Dec 2011 1 Andreas Schopper
Why upgrading LHCb? Level -0 40 MHz L 0 e, g L 0 had L 0 m main limitation of current detector: Ø bandwidth & rate limitation of L 0 trigger Ø trigger yield for hadronic channels flattens out at L ~ 2 -3∙ 1032 cm-2 s-1 (ET - cut!) HLT 1 High p. T track with nonzero Impact Parameter 30 k. Hz Global reconstruction HLT 2 High-Level Trigger ≤ 1 MHz Inclusive selections m, m+track, mm, topological, charm, ϕ ~3 nominal & Exclusive selections k. Hz Storage: “nominal” event size ~35 k. B LHCC Upgrade Session Dec 2011 allows to accumulate ~1 -1. 5/fb per year ~5 -7/fb in 5 years up to LS 2 2 Andreas Schopper
LHC schedule Not yet approved! 2022 LS 3 LHCb upgrade Shown by Steve and by DG at EPS 2011 in Grenoble! LHCC Upgrade Session Dec 2011 3 Installation of the HL-LHC hardware (accelerator and detector) Plan to continue until around 2030 Andreas Schopper
Upgrade of LHCb ü flexible software trigger with up to 40 MHz input rate and 20 k. Hz output rate ü run at ~ 5 -10 times nominal LHCb luminosity → L ~ 1 -2 ∙ 1033 cm-2 s-1 Ø big gain in signal efficiency (up to x 7 for hadron modes) Ø upgrade electronics & DAQ architecture Ø collect ≥ 5/fb per year and ~ 50/fb in 10 years LLT custom electronics CPU Event Filter Farm LHCC Upgrade Session Dec 2011 4 Andreas Schopper
Sensitivities to key quark flavour channels LHCb LHCC Upgrade Session Dec 2011 5 Upgrade Andreas Schopper
Common 40 MHz electronics architecture Front-end electronics: transmit data from every 25 ns BX Current Readout Supervisor L 0 Hardware Trigger HLT Upgrade LHCC Upgrade Session Dec 2011 Readout Supervisor 6 Low-level Trigger HLT++ Andreas Schopper
Architecture Overview Tell 40 board LHCC Upgrade Session Dec 2011 7 Andreas Schopper
Generic TELL 40 board Ø generic board covers all functionalities required by the timing, control, low level trigger and data acquisition Ø first prototype to be fully tested by end 2012 LHCC Upgrade Session Dec 2011 8 Andreas Schopper
Detector upgrade to 40 MHz R/O VELO Si strips (replace all) Silicon Tracker Si strips (replace all) Outer Tracker Straw tubes (replace R/O) RICH HPDs (replace HPD & R/O) LHCC Upgrade Session Dec 2011 Muon MWPC (almost compatible) Calo PMTs (reduce PMT gain, replace R/O) 9 Andreas Schopper
Detector upgrade to luminosity of 1 -2 ∙ 1033 cm-2 s-1 Main limitation: increased occupancy in Outer Tracker 2∙ 1032 cm-2 s-1 at 25 ns μ = 0. 4 10∙ 1032 cm-2 s-1 at 25 ns μ=2 Note: Ø have been running already at μ~2. 5 Ø current geometry limiting to L ≤ 10∙ 1032 cm-2 s-1 Ø no safety margin OT IT LHCC Upgrade Session Dec 2011 10 Andreas Schopper
Detector upgrade to luminosity of 1 -2 ∙ 1033 cm-2 s-1 Two scenarios in Lo. I for new tracker geometry 10∙ 1032 cm-2 s-1 at 25 ns 20∙ 1032 cm-2 s-1 at 25 ns OT OT “IT+20 cm” “IT+30 cm” IT IT designing detector to cope with 20∙ 1032 cm-2 s-1 LHCC Upgrade Session Dec 2011 11 Andreas Schopper
Status of LHCb Upgrade submitted upgrade LOI to LHCC beginning of March: [CERN-LHCC-2011 -001] ü physics case fully endorsed, 40 MHz architecture reviewed ü recommendation in June 2011 to proceed to “framework TDR” and detector TDRs Ø now proceeding to TDRs in time for installing the detectors & electronics in 2018 Towards a “frame work TDR” ( “Addendum to the Lo. I”) in 2012 ü review status of possible technical options and R&D activities ü define sub-system milestones towards TDRs (in particular those for technical reviews to decide between options) ü provide cost estimate of upgrade for different options ü clarify and substantiate interest of collaborating institutes ü start discussion with LHCb funding representatives “LHCb Upgrade Resource Board”, set-up by management/CB ü define splitting between common items and individual sub-system TDRs & Mo. Us LHCC Upgrade Session Dec 2011 12 Andreas Schopper
Organizational aspects LHCb Upgrade Organization The overall coordination is provided by the Upgrade Coordinator (Andreas Schopper) with the help of a Steering Panel, covering three domains: 1. Tracker & Tracking – all tracking detectors: upgrade of VELO, TT, IT, OT, with two representatives, one focusing on technical issues (Massimiliano Ferro-Luzzi) and one on tracking performance (Stephanie Hansmann-Menzemer) 2. Particle identification – both hadronic and leptonic, involving the upgrade of RICH&Torch, the Calorimeter and Muon systems (Guy Wilkinson) 3. Data processing – the full chain, from detector readout to offline: upgrade of Front-End, TELL 40, Trigger (LLT+HLT), data acquisition and computing (Renaud Le Gac) nb: The upgrade activities are driven by the current subprojects (no duplication of existing projects) and involve the Technical, Physics, Electronics, Simulation, etc. Coordinators to coordinate the upgrade effort in their domains. LHCC Upgrade Session Dec 2011 13 Andreas Schopper
Review of sub-system activities Review baseline upgrade with following criteria: ü detector is read out at 40 MHz ü HLT runs at a rate of at least 10 MHz ü sustain a instantaneous luminosity of L~2∙ 1033 cm-2 s-1 with 25 ns spacing ü sustain an integrated luminosity ~50/fb over 10 years ü detector ready for installation in 2018 (LS 2) Detailed review of R&D activities and future plans in various workshops: Ø 15 -16 Sep. Tracker (OT, IT, TT) workshop Ø 24 -25 Oct. PID (RICH, calo, muon) workshop Ø 2 Nov. Scintillating Fiber Tracker Meeting Ø 09 -10 Nov. VELO workshop Ø 16 -17 Nov. Data Processing workshop (FE, TELL 40, DAQ, trigger, computing) Ø 5 Dec. Simulation kick-off meeting a lot of progress in R&D, planning, declaration of interests by institutes, costing LHCC Upgrade Session Dec 2011 14 Andreas Schopper
Agreed on overall generic milestones, to be fine-tuned to specific sub-system: Ø in 2018: installation Ø 2016 -17: quality control & acceptance tests Ø 2014 -16: tendering & serial production Ø 2013: TDR & prototype validation Ø 2012: technical review & choice of technology ü 2011 -12: continue R&D towards technical choices ü End 2011: progress towards an “Addendum to the Lo. I” (in 2012) v Early 2011: Lo. I (fully endorsed in June) Several technical choices & decisions before TDRs few more info on these Ø VELO: pixel vs. strips major ones… Ø Large IT (and shorter OT straw tubes) vs. fiber CT Ø Optimized tracker geometry (# u, v, x planes OT, CT, IT, TT) Ø Back-End R/O board (TELL 40) technology (ATCA /backplane free) Ø… identified also need for major simulation effort! LHCC Upgrade Session Dec 2011 15 Andreas Schopper timeline Sub-System Milestones towards TDR
VELO options LOI pixel layout pixel detector: Ø VELOPIX based on Timepix chip with 55 μm x 55 μm pixel size, advantageous for pattern recognition Ø L-shaped half modules with two blocks of 6 chips Ø several sensor options being investigated strip detector: Ø based on proven design, but with reduced strip pitch and increased number of strip Ø prototypes in production (Hamamatsu & Micron) Ø same chip as other silicon strip detectors LHCC Upgrade Session Dec 2011 Layout of R and Ф strip sensor prototypes (every 5 th strip plotted) 16 Andreas Schopper
VELO challenges @ 40 MHz & 2 x 1033 Ø New modules and FE electronics ü must be able to withstand radiation levels of ~ 370 MRad or 8 x 1015 neq/cm 2 ü two options: pixels and strips ü capable of dealing with huge data rate • Pixel: > 12 Gbit/s for hottest pixel chip • Strip: on-chip zero suppression and CM algorithms Ø New module cooling interface Ø New RF foil Ø All without sacrifices in material budget a lot of R&D ongoing with much progress in all areas Strip sensors Number of tracks per event per chip for pixels per sensor for strips Pixel sensors LHCC Upgrade Session Dec 2011 17 Andreas Schopper
VELO module building activities R&D phase Pixels: Finalise ASIC Chip attachments to diamond heat spreader Conservative design: 55 um pixel pitch bump bonding is well established technology sensor and wafer thinning accomplished routinely for 10 M ALICE pixel system Construction phase Strips: Large, thin sensors: Handling, irradiation ASIC design Pixels: Chip Production Wafer Testing Metal deposition Wafer thinning and dicing Flip Chip assembly and probing Items in common: R/O development for testing CVD diamond as support Hybridisation options Cooling within module Cooling integration Fast flex development Connectors Irradiation tests Sensor choice Strips: Sensor QA ASIC production High density sensor wire bonding Items in common: Bonding and assembly jigs Common DAQ systems Cooling plane attachment Flex attachment Module wire bonding Quality Control Burn-in a lot of items in common LHCC Upgrade Session Dec 2011 18 Andreas Schopper
Tentative VELO milestones 2018: 2017: 2016: 2015: early 2014: end 2013: Installation Production, integration Production readiness reviews, module production launch readout chain prototype, module prototype, final FE chip TDR 12 -chip demonstrator module decision on thermal management of module FE chip prototype Ø pixel Chip => 2012: Timepix 3, 2013: VELOpix Ø strip Chip => 2012: ADC submission, 2013: 1 st multichannel 2012: demonstrator module 0 LHCC Upgrade Session Dec 2011 19 Andreas Schopper
Tracker options “large-area Silicon Strip Inner Tracker” (with short OT straws) or “ 250 μm Scintillating Fiber Central Tracker” OT: Straws “Central Tracker” with 250 μm Sci. Fi “large area” IT with Silicon Strips both compatible with 2*1033 luminosity LHCC Upgrade Session Dec 2011 20 Andreas Schopper
OT: Straws Light & large area IT with silicon strips light IT: Silicon Strips Current IT Light & large area IT Tape Automated Bond Effort started Ø strip chip design Ø cooling proof of concept (air flow) Ø received 10 sensors for testing TAB, module assembly, HV, etc. Ø light: reduce X/X 0 ~ 2 Ø large: increase area by ~ 3. 3 -4 : from 126 x 22(42)cm to 255 x 42(63)cm Ø optimise station layout: now 3 x(xuvx)=12 layers in-front of T 3 to 2 x(xuxvx)=10 layers behind T 1 & T 3 LHCC Upgrade Session Dec 2011 21 Andreas Schopper
Central Tracker (CT) made from 250μ fibers (Evolution of scintillating fiber Inner Tracker to Central Tracker) CT: OT: Straws Scintillating Fibers “Central Tracker” Ø 5 layers of densely packed 250μm diameter fibers Ø readout with 128 -channel Silicon Photomultipliers (Si. PM) Ø 2× 2. 5 m long fibers, readout on top and at bottom of stations Advantages: ü only sensitive material in acceptance (no cables, no cooling, . . . ) ü uniformity in material distribution ü 50 -60 μm resolution (to be demonstrated with test beam data) LHCC Upgrade Session Dec 2011 22 Andreas Schopper
Central Tracker (CT) Challenges: ü long fibers => multiple hits per channel (occupancy) in principle not a problem with existing tracking strategy (to be demonstrated with simulation data) ü building and alignment of 2. 5 m-long modules ü develop, test, and produce front-end electronics in tight schedule ü Si. PM radiation hardness => shielding & cooling needed a lot of R&D ongoing in all areas Si. PM investigations: ü integrated neutron flux at the level of ~1012/cm 2 ü various studies showed significant deterioration at ~1011/cm 2 Ø radiation tolerance is actively studied: ü in situ Si. PM samples with and without shielding ü irradiation with neutrons and with protons ü testing effect of shielding (Polyethylene, Cd, Pb) ü testing effect of cooling Ø solution is taking shape, as a combination of: 1. improved technology (with manufacturer) 2. shielding (factor ~2) 3. active cooling of Si. PM (factor 2 every 8 -10°C) 4. . and S/N performance as function of accumulated dose LHCC Upgrade Session Dec 2011 23 Andreas Schopper
Tentative milestones Central Tracker (CT) LHCC Upgrade Session Dec 2011 24 Andreas Schopper
Declaration of Interests, Common Projects and Cost Interests for participation to sub-systems, as declared at the upgrade workshops: (still evolving!) Baseline upgrade: Ø detector R/O at 40 MHz Ø L ~ 2∙ 1033 cm-2 s-1 ; 25 ns Ø HLT at ≥ 10 MHz rate Total re-estimated investment cost ~ 52 MCHF (does not include R&D and MP) Common Fund part ~ 30% (= investment to Common Projects) Common Projects Ø First “LHCb Upgrade Resources Board” took place to discuss manpower and funding situation Ø For the R&D phase manpower is an issue in particular for simulation and Common Projects Ø New Collaborators welcome to join LHCb upgrade effort! LHCC Upgrade Session Dec 2011 25 Andreas Schopper
Conclusions Ø LHCb is planning to upgrade to 40 MHz R/O and for a luminosity of up to L ~ 2∙ 1033 cm-2 s-1 for installation in LS 2 (2018) Ø Lo. I endorsed aiming at ü addendum to Lo. I in 2012 ü detector TDRs in ~2013 Ø reviewing and monitoring progress in the various R&D activities, simulation efforts, planning and cost Ø clarifying interests by collaborating institutes and funding Ø Requirements to the LHC ü IP 8 to be compatible with HL-LHC after LS 3 (shielding!? ) ü 25 ns bunch spacing essential (pile-up!) ü keep possibility of swapping B-field (systematic errors!) LHCC Upgrade Session Dec 2011 26 Andreas Schopper
Spare slides LHCC Upgrade Session Dec 2011 27 Andreas Schopper
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TORCH • Time Of internally Reflected CHerenkov light • TORCH could provide positive identification of kaons up to p ~ 10 Ge. V/c and beyond • Cherenkov light production is prompt → use quartz as source of fast signal ~ 70 ps resolution required per detected photon • Focusing element currently designed around commercial micro-channel plate (MCP) device: the Planacon [Burle/Photonis] available in 1024 channel (32× 32) version LHCC Upgrade Session Dec 2011 • R&D on photodetector performance progressing well • Excellent timing resolution achieved for single photons using Planacon: σ(t) = 47 ps (singlechannel readout) Andreas Schopper 32
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