Outline Project overview Projectspecific success criteria Block diagram

Outline Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout Software design/development status Project completion timeline Questions / discussion

Project Overview Piano Glove: Play virtual keyboard on any flat surface 2 Components: Glove and Base Station Glove collects finger pressure and stretch data, preprocesses data, transmits wirelessly to base Base receives data, tracks position of glove on keyboard, outputs sounds for keys pressed

Project Specific Success Criteria 1) An ability to quantify the position of the glove relative to the processing unit. 2) An ability to combine finger press data and glove position to determine which virtual key has been pressed. 3) An ability to utilize Speak. Jet from GPIOs to produce various sounds. 4) An ability to collect analog data from force and stretch sensors, digitize it, and correctly format packets for wireless transmission. 5) An ability to detect different pressure levels to control volume.

Block Diagram

Component Selection Rationale Overview of Design Constraints User Interface Perform pressure measurements on fingertips Perform spacing measurements between each finger Perform distance measurements to locate position of glove Digitize the measured analog signals Transmit digitized data to Base Station via RF wireless signals Microcontrollers Fast clock speed to perform real time data processing ( ≤ 50 ms ) Memory for programming application Convenience Energy efficient to maximize battery life on Glove Unit Minimize package size and weight for player comfort

Component Selection Rationale Sensing & Positioning Force Sensors Interlink FSR 400 Able to detect pressure from 0. 2 N to 20 N Continuous resolution Stretch Sensors Images SI Flexible Stretch Sensor 60 -70 mils diameter Initial release brings sensor to +10% of its resting value Ultrasonic Beacon Parallax PING))) Detection range from one inch to ten feet Resolution of one centimeter Narrow acceptance angle

Component Selection Rationale Microcontrollers Glove Microcontroller PIC 24 FJ 64 GA 306 16 ATD converters 2 SPI Ultra low power operation Maximum operating speed: 32 MHz Operating voltage: 2. 0 V to 3. 6 V Flash programmable memory: 64 KB Base Station Microcontroller PIC 18 F 87 K 90 2 SPI Maximum operating speed: 64 MHz Operating voltage: 1. 8 V to 5. 5 V Flash programmable memory: 128 KB

Component Selection Rationale Wireless Transceivers Wireless Transmitter & Receiver Nordic n. RF 2401 A Single chip transceiver with small footprint Ultra low power operation Data transmission up to 1 Mbps Operating voltage: 1. 9 V to 3. 6 V

Packaging Design Small, Thin Circuit Board Light Weight Comfortable to Player Stay attached during Quick Movement

Packaging Specifications Gloves (without parts) Weight 25 g Gloves (with Parts) Weight 80 g Includes sensors, battery, microcontroller, Bluetooth module HUB Weight ~150 g Length 7 inches Width 3 inches Height 5 inches

Packaging Design Forehand View Backhand View

Packaging Design Base Station Package

Schematic Base Station

Base Station

To 5 V DC Wall Wart Base Station LEDs Optic Isolator Power Supply 3. 5 mm Audio Jack Amplifier

Base Station To 5 V DC Wall Wart LEDs 3. 3 V Voltage Regulator Power Supply 5 V Voltage Regulator

Base Station Wireless Receiver Reset Microcontroller Speak. Jet

Base Station Microcontroller LCD Ultrasonic Beacon

Base Station Microcontroller Speak. Jet

Base Station 3. 5 mm Audio Jack Optic Isolator Amplifier

Schematic Glove

Glove Unit

Glove Unit Power Supply LEDs Sensors

Glove Unit 4. 5 V Battery Supply LEDs 3. 3 V Voltage Regulator

Glove Unit Wireless Transmitter Reset Programming Microcontroller To Optic Isolators

Glove Unit Sensors & Optic Isolators

Glove Unit Optic Isolators To Sensor To PIC

Theory of Operation Interlink FSR 400 Able to detect pressure from 0. 2 N to 20 N Continuous resolution Resistance vs. Force

Theory of Operation Images SI Stretch Sensor 1000 ohm per linear inch 60 – 70 mils diameter Stretched 50% 2 × initial R Initial release +10% resting R

Theory of Operation Parallax PING))) One GPIO Signal from microcontroller to release chirp Sound is reflected off player’s hand Listens for echo, when echo is heard, pulse is set low Range from one inch to ten feet

PCB Layout Overall Considerations Keep analog outputs/inputs separate from digital circuitry Transceivers and Ultrasonic sensor on edge of board Glove: Fit on back of hand 3. 8 in x 2. 6 in Base: 3. 5 mm jack on edge of board, needs cutout Base: components mounted on box top need connections

Base Station

Analog Base Station Digital Power Supply

Base Station Wireless Receiver

Glove Unit

Analog Digital Power Supply Glove Unit

Analog Digital Glove Unit

Glove Unit Wireless Transmitter

PCB Layout Microcontroller Considerations Decoupling Caps < 6 mm (0. 25 in) from micro Supply voltage traces should pass through caps before pins Signals to header routed on underside of board to reduce congestion around micro Keep paths to critical components (transceivers, ultrasonic beacon) short

Base Station PIC 18 F 87 K 90

Glove Unit PIC 24 FJ 64 GA 306

PCB Layout Power Supply Considerations Traces wider more current in this portion of circuit Input and output filtering caps placed near power supplies

Base Station

60 mils Glove Unit 10 mils 80 mils Distance between Traces ≥ 12 mils 40 mils

Software Design Glove Main Loop Will be interrupt driven Constantly checking A to D Send finger press and stretch data Base Main Loop Will be interrupt driven Constantly checking distance of glove Interpret data into the keys pressed Use Speakjet to generate appropriate sounds

Flowchart for Glove Start No Has a key been pressed? Yes Transmit data to base

Flowchart for Base Start Find Glove Position No Data packet received? Yes Decode data into notes pressed Output data to Speakjet

Projected Completion Timeline Parts Received Oct. 16 PCB Complete/Submitted Oct. 19 Preliminary Software Written Oct. 26 Preliminary Packaging Parts Arrive Hardware/Software Interface using Dev Board Oct. 31 PCB Assemble Complete Nov. 16 Project Complete Nov. 30 Nov. 9

Questions?