OSP ENTEK PLUS CU106 A Organic Solderability Preservatives

印刷電路板銅面有機 保焊劑(OSP)介紹 ENTEK PLUS CU-106 A 有機保焊劑 (Organic Solderability Preservatives; OSP) (Organic Surface Protectant; OSP) PAGE : 0 / 31 REVISION : B DATE : Jan. 12, 1999

有機保焊劑之種類 類別 ＊ 防止氧化劑(Anti-Oxidants) - ENTEK CU-56 ＊ 松香樹脂類有機預焊劑(Rosin/Resin Pre. Fluxes) ＊ 水溶性預焊劑 - 有機保焊劑 (OSP) - ENTEK PLUS CU-106 A PAGE : 8 / 31 REVISION : B DATE : Jan. 12, 1999

Cu-56 與 Cu-106 A比較 Cu-56為 Mono Layer Cu-106 A為Multi-Layer Cu Cu 只適合單次reflow 適合多次reflow(3~5次) PAGE : 9 / 31 REVISION : B DATE : Jan. 12, 1999

COMPARISON IN DIFFERENT FINISH TYPE Finish ENTEK Cu-106 A ENTEK Cu-56 properties Organic Good Immersion Gold Selective Solder HAL Fusing EL-Ni/Au Plating Sn/Pb reflow Fusing Sn/Pb alloy Plating Sn/Pb reflow Good Fair Bad flatness 1. Shelf life half year Concern Point 1. Shelf life half year 2. Easy scratch 3. Only single soldering 1. High cost 2. Solder pot contamination 2. Long process 3. Can not baking and aging 3. Difficulty control 1. Uneven 2. IMC 3. Thermal Shock Fair 1. S/M fold 2. S/M peeling 3. Excess solder 4. Insutable fine pitch 4. IMC 5. Organic solvent IPA 5. Insuitable fine line PAGE : 15 / 31 REVISION : B DATE : Jan. 12, 1999

COMPARISON IN DIFFERENT FINISH TYPE Finish Characteristic feature Application ENTEK Cu-106 A ENTEK Cu-56 Immersion Gold Selective Solder 1. Sn/Pb thick & flat HAL 1. Flatness 2. No IMC 2. COB 3. Low cost 2. Popular 2. Thin IMC 3. Good 3. Free solder paste printing solderability 1. Double SMT 1. One time IR or wave soldering 1. COB 1. Fine pitch 2. Fine pitch Wave soldering 1. Low cost Fusing 1. Heavy board Back panel 2. TAB PAGE : 16 / 31 REVISION : B DATE : Jan. 12, 1999

ENTEK Process Sequence Process Step Cleaner Characteristic Concentration Temperature Measurement Method Lab Titration Digital Readout Water Rinse Microetch Etch rate Concentration Cu Content Temperature Weight loss Lab Titration Digital Readout Water Rinse PAGE : 17 / 31 REVISION : B DATE : Jan. 12, 1999

ENTEK Process Sequence Process Step H 2 SO 4 Characteristic Measurement Method H 2 SO 4 Concentration Lab Titration Water Rinse ENTEK Water Rinse Concentration Total Acidity PH Temperature Deposition Thickness Lab Titration PH meter Digital Readout Lab Titration Dry PAGE : 18 / 31 REVISION : B DATE : Jan. 12, 1999

ENTEK 產品Assembly注意事項 1. 最好 6 個月內上件完畢. 2. Fiducial Mark 為裸銅, CCD對比需調整. PAGE : 23 / 31 REVISION : B DATE : Jan. 12, 1999

ENTEK 產品Assembly注意事項 4. Assembly 後露出之裸銅部份, 最好噴上一 層Epoxy或印Solder paste (Test pad, Test via , Tooling hole ). PAGE : 25 / 31 REVISION : B DATE : Jan. 12, 1999

Entek Plus Cu-106 A Thickness vs Heat Treatment Time at 150℃ 0. 35 Thickness (microns) 0. 30 0. 25 0. 20 0. 15 0. 10 0. 05 0 2 4 6 8 Heat Treatment Time (hours) PAGE : 27 / 31 REVISION : B DATE : Jan. 12, 1999

Entek Plus Cu-106 A COATING THICKNESS ON COPPER AND GOLD Microns 0. 5 0. 4 Copper 0. 33 Gold 0. 3 0. 28 0. 3 0. 2 0. 1 0 0. 02 0 0 1 0 3 # OF SMT Reflows PAGE : 28 / 31 REVISION : B DATE : Jan. 12, 1999

Entek Plus Cu-106 A Mili-ohms CONTACT RESISTANCE VS. ENTEK PLUS THICKNESS 2 1. 8 1. 6 1. 4 1. 2 1 0. 8 0. 6 0. 4 0. 2 0 1. 2 1. 1 0. 85 0. 38 0. 03 0. 5 0. 32 0. 04 0. 08 0. 9 0. 42 0. 17 0. 2 0. 3 0. 55 ENTEK THICKNESS(MICRONS) PAGE : 29 / 31 REVISION : B DATE : Jan. 12, 1999

Preferred Acceptable Not Acceptable PAGE : 31 / 31 REVISION : B DATE : Jan. 12, 1999