o The ATLAS IBL Project The 5 th
o The ATLAS IBL Project The 5 th "Trento" Workshop on Advanced Silicon Radiation Detectors Manchester, 24 -26 February 2010 G. Darbo - INFN / Genova Conference Site: • http: //www. hep. man. ac. uk/Radiation-Detectors 2010/agenda. html G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010
ATLAS Pixel Detector • • 3 Barrel + 3 Forward/Backward disks 112 staves and 48 sectors 1744 modules 80 million channels G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 2
The ATLAS Pixel Module • 16 -frontend chips (FE-I 3) modules with a module controller chip (MCC) • 47232 pixels (46080 R/O channels), 50 x 400 µm 2 (50 x 600 µm 2 for edge pixel columns between neighbour FE-I 3 chips) • Planar n-on-n DOFZ silicon sensors, 250 µm thick • Designed for 1 x 1015 1 Me. V fluence and 50 Mrad • Opto link R/O: 40÷ 80 Mb/link G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 3
Pixel Integration and Installation G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 4
IBL: Project History The ATLAS Pixel B-Layer initially designed for replacement • September 2007 B-Layer replacement Workshop outcome: replacement not possible in 1 year shutdown. • January 2008: ATLAS Task Force (A. Clark & G. Mornacchi) Report July 2008 (Bern): preferred (only) option Insertable B-Layer (IBL) • February 2009: project approved by ATLAS May 2009 IBL management organization in place. • Now: design fast advancing, IBL Technical Design Report (TDR) draft, interim Memorandum of Understanding (i-Mo. U) in discussion. Existing B-Layer Iourii Gusakov IBL Mission impossible… fit an additional layer in between Pixel and beam-pipe: • Reduce beam-pipe by 4 mm in radius… and make it possible! G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 5
Motivation for IBL The existing B-Layer cannot be replaced in a long LHC shutdown (8 -months): • This was a major finding of the B-Layer task force. Many reasons make it very difficult: • Extraction, moving to surface and opening the whole Pixel Detector package. • Work on an activated material. • Risk of damage (many last moment operations made the process “irreversible” in the final phase of the detector integration). Reasons for an IBL to back-up existing B-Layer: Radiation damage • Sensor and electronics degradation of the existing B-Layer reduce detector efficiency after 300÷ 400 fb-1 (last forecast of LHC integrated luminosity move it more far away) Insurance for hard failures in the Pixel B-Layer • The Pixel Detector cannot be repaired in case of cooling, opto-links, module hard failure. Inefficiencies of the B-layer have high impact on many Physics channels. Improve existing B-Layer Physics performance • A low mass detector (~50% of existing B-Layer) improves Physics performance. G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 6
IBL Layout Beam-pipe reduction: • Inner R: 29 25 mm Very tight clearance: • “Hermetic” to straight tracks in Φ (1. 8º overlap) • No overlap in Z: minimize gap between sensor active area. Layout parameters: • • • IBL envelope: 9 mm in R 14 staves. <R> = 33 mm. Z = 60 cm (active length). η = 2. 5 coverage. G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 7
BP Extraction & IBL+BP Insertion Ref. : Y. Gusakov, N. Hartman, R. Vuillermet Material Raphael/Neal The present from 7 m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ: The new beam-pipe with the IBL will be inserted at its place: • A carbon tube (IST) is inserted before the IBL: to support the new detector and to simplify the insertion procedure. PP 1 Collar Sealing service ring Alignment wirers IST IBL Support Tube Stave Insert To fix to support, survey reference G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 8
B-Layer Scenarios Physics performance studies ongoing for the IBL TDR (ATHENA/GEANT 4). Preliminary studies (ATLSIM/GEANT 3) show improved performance with the addition of IBL (see low mass Higgs b-jet tagging plot on the right). Performance improvement due to low mass and smaller radius: WH(120 Gev) Light jets rejection SV 1 εb=60% • Aggressive reduction of material budget is a must! Component % X 0 (*) beam-pipe 0. 6 New BL @ R=3. 5 cm 1. 5 Old BL @ R=5 cm 2. 7 L 1 @ R=8 cm 2. 7 L 2 + Serv. @ R=12 cm 3. 5 Total 11. 0 (*) Material budget used in the simulation G. Darbo – INFN / Genova SV 1 εb=70% ATLAS b-inserted as 4 -layer R=3. 5 cm The ATLAS IBL Project – 5 th Trento Workshop 2 -layers R=3. 5 cm and 8 cm 2 -old layers b-replaced Ref. : A. Rozanov Manchester, 24 -26 February 2010 9
Requirements for Sensors/Electronics Requirements for IBL • IBL design peak luminosity = 3 x 1034 cm-2 s-1 FE-I 4 architecture & R/O bandwidth: must be understood after Chamonix • Integrated luminosity seen by IBL = 550 fb-1 Survive to s. LHC phase II • Design sensor/electronics for total dose: • NIEL dose = 3. 3 x 1015 ± (“safety factors”) ≥ 5 x 1015 neq/cm 2 • Ionizing dose ≥ 250 Mrad • Fit made for 2 < r < 20 cm for L=550 fb-1 • Gives for IBL @ 3. 2 cm (550 fb-1): Φ 1 Me. V=3. 3 x 1015 neq/cm 2 (1. 6 MGy) • Safety factors not included in the computation (σpp event generator: 30%, damage factor for 1 Me. V fluences: 50%) Ref. : Ian Dawson G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 10
>99% or hits will not leave the chip (not triggered) • So don’t move them around inside the chip! (this will also save digital power!) This requires local storage and processing in the pixel array Ref. : M. Barbero et al. FE-I 4 Architecture: Obvious Solution to Bottleneck FE-I 3 @ R = 5 cm • Possible with smaller feature size technology (130 nm) Large chip - design methodology: • Custom digital layout substituted by automatic place & route of synthesized design. • Chip verification is the challenge: analog/digital and mix-mode test bench simulation. G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 11
FE-I 3 FE-I 4 FE-I 3 50 x 400 50 x 250 Pixel array 18 x 160 80 x 336 7. 6 x 10. 8 20. 2 x 19. 0 74% 89% Analog current [µA/pix] 26 10 Digital current [µA/pix] 17 10 Analog Voltage [V] 1. 6 1. 5 Digital Voltage [V] 2. 0 1. 2 Pseudo-LVDS out [Mb/s] 40 160 Chip size [mm 2] Active fraction 20. 2 mm The first version of full FE-I 4 chip will be submitted by end of March 2010 ~70 million transistors, 0. 13 µm CMOS technology 6 Cu and 2 Al routing layers. ~200μm 7. 6 mm 8 mm active 2. 8 mm FE-I 3 74% G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop IBM reticule Bonn: D. Arutinov, M. Barbero, T. Hemperek, A. Kruth, M. Karagounis. CPPM: D. Fougeron, M. Menouni. Genova: R. Beccherle, G. Darbo. LBNL: S. Dube, D. Elledge, M. Garcia - Sciveres, D. Gnani, A. Mekkaoui. Nikhef: V. Gromov, R. Kluit, J. D. Schipper FE-I 4 Pixel size [µm 2] Chartered reticule (24 x 32) FE-I 4 Collaboration: active ~19 mm 16. 8 mm ~2 mm FE-I 4 ~89% Manchester, 24 -26 February 2010 12
The Way to FE-I 4: Test Chips FE-I 4 -P 1 3 mm SEU test IC LDO Regulator 61 x 14 array Control Block Shu. LDO+trist Capacitance Measurement Charge Pump 4 -LVDS Rx/Tx low power discriminator DACs G. Darbo – INFN / Genova LVDS/LDO/10 b-DAC 4 mm Current Reference The ATLAS IBL Project – 5 th Trento Workshop CLKGEN proto: PLL core + PRBS + 8 b 10 b coder + LVDS driv Manchester, 24 -26 February 2010 13
FE-I 4 4 -pixel region analog 1 -pixel array 336× 80 pixels digital 4 -pixel region periphery G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 14
FE-I 4: Sensor Related Specs Specifications Value Unit 50 x 250 µm 2 Bump pad opening 12 µm Input -Q Pixel size Maximum charge e 100 n. A 80 x 320 Col x Row ≤ 100 µm Normal pixel input capacitance range 100÷ 500 f. F Edge pixel input capacitance 150÷ 700 f. F 250 Mrad ≤ 5000 e Pixel array size Last bump to physical edge Radiation tolerance In-time discriminator threshold with 20 ns gate and 400 f. F load G. Darbo – INFN / Genova diameter DC coupled 100, 000 DC leakage current tolerance Conditions/comments The ATLAS IBL Project – 5 th Trento Workshop Sides for long pixels and top for ganged Specs met at this dose Region can still assign small hits below in-time threshold to correct time bin Manchester, 24 -26 February 2010 15
FE-I 4: Discriminator & R/O Specs Specifications Value Unit Hit-trigger association resolution 25 ns Same pixel two-hit discrimination 400 ns At 5000 e in-time threshold and when both hits are 20 ke Single channel ENC sigma <300 e 400 f. F load, nominal current Tuned threshold dispersion <100 e sigma 4 bits Charge resolution ADC method To. T Average hit rate with 1% data loss 400 Max number consecutive triggers 16 Trigger latency (max) 6. 5 µs Maximum sustained trigger 200 k. Hz Serial command/clock input 40 Serial data output 160 Output data encoding 8 b/10 b I/O signals ~LVDS G. Darbo – INFN / Genova MHz/cm 2 Conditions/comments 3. 2 µs trigger latency, 100 k. Hz trigger rate Mb/s - MHz 1 + 1 input per chip Mb/s The ATLAS IBL Project – 5 th Trento Workshop 1 output per chip Current balanced differential Manchester, 24 -26 February 2010 16
FE-I 4: The Pixel Cell Ref. : A. Mekkaoui 2 -stage architecture optimized for low power, low noise, fast rise time. • regular cascode preamp. NMOS input. • folded cascode 2 nd stage PMOS input. • Additional gain, Cc/Cf 2 ~6. • 2 nd stage decoupled from leakage related DC voltage shift. • Cf 1 ~17 f. F (~4 MIPs dynamic range). 150 µm 13 -bit memory/pixel: 4 FDAC, 5 TDAC, 2 cap, 1 Hit. EN, 1 Hit. OR G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 17
Noise and Radiation Results a) b) c) c) ENC[e-] 150 200 Mrad, Cload~400 f. F a) ENC=160 e- @ Cd=0. 4 p. F & IL=100 n. A t. LE[s] 20 n ENC @ Low Current (10µA) ENC on “Collaboration Proto 1” before and after irradiation (200 Mrad) Measured ENC for pixels with and without Cload Simulated ENC and time-walk @ 10 µA/pixel (preamp + amp 2 + comparator) (10 µA) IL=100 n. A b) 100 IL = 0 n. A 60 100 f 10 n 200 f 300 f Cd[F] 20 ns timewalk for 2 ke- < Qin < 52 ke& threshold @ 1. 5 ke 0 10 k G. Darbo – INFN / Genova 20 k 30 k 40 k (loaded ~400 f. F) <ENC> ~ 90 e <ENC> ~ 65 e Qin[C] The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 18
Module Design: Sensor Technology Independent Decision on sensors after TDR • Need module prototypes with FE-I 4 (second half 2010) Common sensor baseline for engineering and system purposes • 3 D / Diamond sensors – single chip modules / Planar sensors – 2 chip modules Sensor/module prototypes for ~10% of the detector in 2010 • Stave prototype tested with modules and cooling Single chip module: Edge < 325 µm Double chip module: Edge < 450 µm Credits: M. Garcia-Sciveres – F. Hügging G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 19
Sensors 3 sensor technologies considered for IBL • Planar, 3 D and Diamonds • Full scale prototypes with FE-I 4 – Decision on spring 2010 Some specifications agreed: • • Max fluence > 5 x 1015 1 Me. V neutrons / cm 2 Max power after full life dose < 200 m. W/cm 2 Low dead area in Z: slim or active edge Maximum bias voltage (system issue) : 1000 V Sensor R&D and prototype work for IBL are presented in many talks in the Workshop… G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 20
Bump Bonding Large volume bump-bonding experience from Pixel Detector (see table): • Pb. Sn and Indium bumps: Pb. Sn Ag. Sn Program to qualify for the larger FE-I 4 and different sensor technologies. • Setting up with mechanical/electrical dummies, but finally real parts needed: thermo-mechanical process strongly dependent on actual metal layers of electronic chip and sensor. • Goal to go below 190 µm of the Pixel Detector: target to 90 µm. “dummy – sensor” (monitor wafer) Prototype test of advanced Ag. Sn bumping with 90µm FE-I 4 size dummies. ATLAS Pixel bump-bonding production – Ref: Jinst 3 P 07007 (2008) G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 21
Thermal Figure of Merit and Thermal Run-away Thermal Runaway Plot Evaporation T = -40 ºC = 30. 0 C • cm 2/W = 18. 5 C • cm 2/W Thermal runaway happens in sensors if not adequately cooled • Leakage current shows exponential behavior. = 3. 2 C • cm 2/W IBL including safety Stave thermal figure of merit (Γ = [ΔT • cm 2/W]) main parameter for thermal performance. Power design requirements for IBL: Sensor Power FE power 200 m. W/cm 2 @ -15 C 400 m. W/cm 2 Stave prototype qualification program: Titanium / carbon fiber pipes (D = 2÷ 3 mm) Cooling CO 2 and C 3 F 8 Carbon foam density: 025÷ 0. 5 g/cm 3 Radiation length: 0. 36÷ 0. 66 %X/X 0 Pipe + stave structure + coolant Ref. : D Giugni, H. Pernegger, M. Gilchriese G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 22
Stave Structure Stave structure made of carbon foam + cooling pipe (carbon fiber or titanium boiling channel) The stiffness is provided by a carbon fiber laminate: Fiber YS-80 A; resin EX-1515; lay-up (0/60/-60)S 2 Carbon foam diffuses the heat from the module to the cooling pipe Poco Foam OR Kopers KFOAM L 1 -250 r=0. 55 g/cm 3; K=135/45 W/m. K r=0. 245 g/cm 3; K=30 W/m. K Module (sensor + bumps + FE-I 4) Carbon foam Omega CF laminate Ti or CF pipe G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 23
Stave Prototype Options STAVE CARACTERISTICS SIMULATION RESULTS Pipe ID/OD [mm] Omega Thickness [µm] Foam Density [g/cm 3] Coolant CF pipe, heavy foam 2. 4 / 3. 0 150 0. 55 CF pipe, light foam 2. 4 / 3. 0 150 Ti 3 mm pipe, light foam 2. 8 / 3. 0 Ti 2 mm pipe, light foam 2. 0 / 2. 2 Thermal Figure of Merit (Γ) [ºC • cm 2/W] Bare Stave with Coolant Full layer (+ Module + Flex) C 3 F 8 0. 48 1. 056 17. 25 0. 25 CO 2 0. 36 0. 956 18. 56 300 0. 25 C 3 F 8 0. 66 1. 276 2. 79 300 0. 25 CO 2 0. 57 1/166 3. 22 Additional technical requirements (prototype work) • Max pressure of cooling pipe: 100 bar. • Develop pipe joints and fittings. • Gravitational / thermal deformation < 150 µm. • Isolation of the carbon foam from sensor high voltage. • Mock-up for thermal measurements. G. Darbo – INFN / Genova X/X 0 [%] The ATLAS IBL Project – 5 th Trento Workshop Module parameters • Sensor thickness = 250 µm • FE-I 4 thickness = 90 µm • Flex Hybrid (η = 0) = 0. 18 % of X 0 Carbon Foam 0. 25 g/cm 3 Manchester, 24 -26 February 2010 24
When IBL in ATLAS? IBL plans to be ready for installation by end of 2014. • Cannot be much before without compromising performance • A shut down of the machine of 8 month needed (4 to open/close ATLAS) LHC plans after Chamonix are not clear: how peak and integrated luminosity increase and when machine shutdown will be scheduled: • Only plans up to 2012 are known. • Many LHC upgrades need shutdowns: • Linac 4, Collimators phase II, new interaction region quadrupole triplets, etc. • Probably in one year from now we will know next 5 years plans. Chamonix Agenda: • http: //indico. cern. ch/conference. Display. py? conf. Id=67839 Summary of the Chamonix Workshop at Cern: • http: //indico. cern. ch/conference. Display. py? conf. Id=83135 G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 25
Conclusions IBL will improve physics performance of ATLAS and it is a “safety insurance” for present B-Layer TDR and Mo. U in progress – project cost evaluated • Motivated groups and institutes support Challenging project: • Tight envelopes, material budget reduction, radiation dose and R/O bandwidth requirements New technologies in advanced prototype phase: • FE-I 4, light supports, cooling, but mainly… G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 26
BACKUP SLIDES G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 27
Installation Scenarios Two global support / installation scenarios: IBL support tube (1) / no tube (2): • • . An IBL support tube would have advantage on stiffness and simplicity/safety for IBL installation, drawbackcarbon are envelope (~1÷ 1. 5 and increase radiation length Thebutsupport tube needs is fixed in 2 mm) point of PP 0 of and on PP 1 walls on side C and A. studied on mock-up at bld. 180 - procedure (1) animation: Procedure structural pipe with a support system is moved out -from • The beam pipe flange on A-side is to close to the B-layer envelope Needthe to besupport cut on the aluminum section carbon tube. • A structural pipe is inserted inside the Beam Pipe and supported at both sides. The new beam pipe (in any configuration with OD up to 82, 5 mm) is inserted • The support collar at PP 0 A-side is disassembled and extracted with wires at PP 1. from A-side. It has 2 supports at PP 0 area and 2 floating wall at PP 1 on side • Beam pipe is extracted from the C-side and it pulls the wire at PP 1 A and C. • New cable supports are inserted inside PST at PP 0. • A support carbon tube is pushed inside the PST along the structural pipe. C-side A-side Started to setup a 1: 1 mock-up of Pixel/beampipe/PP 1 in Bat 180 R. Vuillermet G. Darbo – INFN / Genova The ATLAS IBL Project – 5 th Trento Workshop Manchester, 24 -26 February 2010 28
IBL Organisation Structure Membership Whole project divided into 4 working groups • IBL Management Board has 10 members, plus “extra” and ex-officio members. • Frequent meetings (every ~14 days) in this phase of the project. IBL Management Board Membership: • IBL PL + IBL TC • 2 coordinators from each WG • Plus “extra” members Module WG (2 coordinators) • FE-I 4 • Sensors • Bump-Bonding • Modules • Test & QC • Irradiation G. Darbo – INFN / Genova Stave WG (1 Phys + 1 Eng. ) • Staves • Cooling Design & Stave Thermal Management • HDI • Internal Services • Loaded Stave • Test & QC IBL Project Leader: G. Darbo IBL Technical Coordinator: H. Pernegger “Module” WG (2 Physicists): F. Hügging & M. Garcia. Sciveres “Stave” WG (1 Phy. + 1 M. E. ): O. Rohne + D. Giugni “IBL Assembly & Installation” WG (2 M. E. initially, a Phy. Later): N. Hartman + R. Vuillermet “Off-detector” WG (1 Phy. + 1 E. E. ): T. Flick + S. Débieux “Extra” members: Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling) Offline “liaison” Pixel Off-line coordinator: A. Andreazza TDR editor (temporary): K. Einsweiler IBL Integr. -Install. (2 Eng. ) • Stave Integration • Global Sup. • Beam Pipe (BP) • Ext. services inst. • IBL+BP Installation • Cooling Plant • Test & QC The ATLAS IBL Project – 5 th Trento Workshop Off-detector (1 Phys + 1 E. Eng. ) • Power • DCS • ROD • Opto-link • Ext. serv. design/proc. • Test Beam • System Test Manchester, 24 -26 February 2010 29
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