NSW Readout spec Rev B check19 pages document
NSW Read-out spec Rev: B ( check-->19 pages document) 1
Modification history • Rev: A date: 4 December 2013 – Rui : Creation of the document (19 pages) • Rev: B date: 6 January 2014 – – Rui : the misalignment tolerance for the resistive layer is added Rui : the starting copper thickness is changed Rui : The board cutting accuracy is added Rui: The board drilling accuracy is added Document under the responsibility of Rui De Oliveira , no modification is allowed. Any request for modification should be sent to Rui De Oliveira (rui. de. oliveira@cern. ch). The active document and all the previous revisions are stored in TE/DEM/EM/PMT data base. If you use this document for production purpose please contact Rui de Oliveira to know the active version. Rev: B ( check-->19 pages document) 2
Chapters 1/Process description 2/PCB detailed description 3/Flex description 4/Gluing description 5/Pillar creation 6/files Rev: B ( check-->19 pages document) 3
Chapter 1: Process description Rev: B ( check-->19 pages document) 4
50 um Kapton + resistive strips PCB + readout strips Rev: B ( check-->19 pages document) 5
50 um Kapton + resistive strips PCB + readout strips 25 um Glue Rev: B ( check-->19 pages document) 6
50 um Kapton + resistive strips PCB + readout strips 25 um Glue Isostatic Gluing Rev: B ( check-->19 pages document) 7
50 um Kapton + resistive strips PCB + readout strips 25 um solid Glue High temp Gluing Pillars creation Rev: B ( check-->19 pages document) 8
Chapter 2: PCB detailed description Rev: B ( check-->19 pages document) 9
PCB: -2250 mmx 500 mm ? ? -single side -0. 5 mm thick +/- 10% -Starting copper foil : 17 um thick copper + 17 um or 35 um copper protection -Final copper thickness 17 um -Pattern absolute accuracy: +/-30 um referring to the GERBER file in the 50 cm side +/-120 um referring to the GERBER file in the 2 m side -120 um minimum line and space , +/-20% general accuracy -NI/Au or Ag plating on connector fingers PCB + readout strips -Cutting absolute position accuracy : +/-50 um referring to the copper pattern on the 50 cm side +/-200 um referring to the copper pattern on the 2 m side -Cutting relative accuracy : (not referred to the pattern) +/-50 um in all directions -Drilling absolute position accuracy : +/-50 um referring to the copper pattern on the 50 cm side +/-200 um referring to the copper pattern on the 2 m side -drilling relative accuracy : (not referred to the pattern) +/-50 um in all directions Base material, when used, shall be flame retardant rated UL 94 V-0 laminate glass fiber epoxy and conform to L 94 according to IPC-4101/94. Copper shall be type H with pits and dent, class B. When procuring base material the following are required: minimum TG 170°C, minimum TD(5%) 350°C, minimum T-288 35 min, maximum Z-axis thermal expansion coefficient above TG 280 PPM/°C (alternatively Z-axis thermal expansion coefficient between 50 -260°C of 3. 5% maximum is acceptable) Acceptance of finished printed boards shall be in accordance with IPC-A-600, class 2 Fabrication and inspection shall be according to IPC-6011 and IPC-6012, class 2 Rev: B ( check-->19 pages document) 10
Chapter 3: Flex description Rev: B ( check-->19 pages document) 11
50 um Kapton + resistive strips Flex: -2250 mmx 550 mm ? ? ? -single side -50 um thick +/- 1 um -silk screen printed or deposited resistor on top -Kapton HN substrate -400 um min line -100 um min space - Visual inspection IPC-A-600 Class 2 Rev: B ( check-->19 pages document) 12
Chapter 4: Gluing description Rev: B ( check-->19 pages document) 13
Gluing Stack up SS main spacer 2 mm mini Pacopad Aluminium 0. 3 mm Pacothane Flex 25 um glue (Krempel Akaflex CDF 25) PCB Pacothane Aluminium 0. 3 mm Pacopad SS main spacer 2 mm mini Rev: B ( check-->19 pages document) 14
Gluing parameters • • • Pressure: 30 kg/cm 2 Ramp up temp: max 10 deg/min Polymerization time and temp: 45 min @ 170 deg Ramp down temp: max 10 deg/min Misalignment max: 0. 06 degrees in strip direction – corresponding to max 1 mm shift over 2. 2 m • Misalignment in the other axis 3 mm max Rev: B ( check-->19 pages document) 15
Chapter 5: Pillar creation Rev: B ( check-->19 pages document) 16
Pillars: -300 um pillars diameter -128 um +/- 2 um height -2 layers of Pyralux PC 1025 -Final curing min 160 deg 1 Hour -Ramp up curing : max 50 deg / hour Rev: B ( check-->19 pages document) 17
Chapter 6: Files Rev: B ( check-->19 pages document) 18
Files • Top copper strips: – Xxxx • Kapton area: – Xxxx – xxxx • Resistive layer: – Xxxx • Pillar layer: – Xxxx • Cutting file: – Xxxx • Drilling file: – Xxxx Rev: B ( check-->19 pages document) 19
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