North America Microlithography Technical Committee Chapter Liaison Report

  • Slides: 20
Download presentation
North America Microlithography Technical Committee Chapter Liaison Report Jan. 2016

North America Microlithography Technical Committee Chapter Liaison Report Jan. 2016

Meeting Information • Last meeting – SEMICON West – July 14, 2015 • San

Meeting Information • Last meeting – SEMICON West – July 14, 2015 • San Francisco Marriott Marquis Hotel • Next meeting – SPIE Advanced Lithography Conference – San Jose, CA – Wednesday, February 24, 2016 • 6: 00 PM to 8: 00 PM NA Microlithography Report - Jan 2016

Task Force and Leadership Changes • Task Force Change – Standards for Scatterometry Task

Task Force and Leadership Changes • Task Force Change – Standards for Scatterometry Task Force was disbanded. • Leadership Changes – Rick Silver (NIST) stepped down as TC Chapter cochair. – Bryan Barnes (NIST) was appointed as TC Chapter cochair serving with Wes Erck (Wes Erck & Associates). NA Microlithography Report - Jan 2016

Leadership • N. A. Microlithography TC Chapter Cochairs – Wes Erck / Wes Erck

Leadership • N. A. Microlithography TC Chapter Cochairs – Wes Erck / Wes Erck & Associates – Bryan Barnes / NIST NA Microlithography Report - Jan 2016

Microlithography TC Chapter Structure NA Microlithography Report - Jan 2016

Microlithography TC Chapter Structure NA Microlithography Report - Jan 2016

Ballot Review Summary • None. NA Microlithography Report - Jan 2016

Ballot Review Summary • None. NA Microlithography Report - Jan 2016

New SNARFs • Doc. 5906 - Line Item Revision to SEMI P 39, OASISTM

New SNARFs • Doc. 5906 - Line Item Revision to SEMI P 39, OASISTM - Open Artwork System Interchange Standard (To correct nonconforming title) • Doc. 5907 - Revision to SEMI P 5 -0704 Specification for Pellicles • Doc. 5908 - Reapproval for SEMI P 40 -1109 Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks • Doc. 5909 - Reapproval for SEMI P 48 -1110 Specification of Fiducial Marks for EUV Mask Blank NA Microlithography Report - Jan 2016

Ballots issued for cycle 9 -15 • Doc. 5907 - Revision to SEMI P

Ballots issued for cycle 9 -15 • Doc. 5907 - Revision to SEMI P 5 -0704 Specification for Pellicles • Doc. 5908 - Reapproval for SEMI P 40 -1109 Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks • Doc. 5909 - Reapproval for SEMI P 48 -1110 Specification of Fiducial Marks for EUV Mask Blank NA Microlithography Report - Jan 2016

Ballots issued for cycle 1 -16 • Doc. 5906 - Line Item Revision to

Ballots issued for cycle 1 -16 • Doc. 5906 - Line Item Revision to SEMI P 39, OASIS® - Open Artwork System Interchange Standard (To correct nonconforming title) NA Microlithography Report - Jan 2016

SNARFs Discontinued • Revision of SEMI P 10 -1112, Specification of Data Structures for

SNARFs Discontinued • Revision of SEMI P 10 -1112, Specification of Data Structures for Photomask Orders (SNARF # 5561) – No additional document development activity planned. • Reapproval of SEMI P 35 -1106, Terminology for Microlithography Metrology (SNARF # 5145) – SEMI P 35 was reapproved via the Japan Micropatterning TC Chapter in spring 2013. • Revision to SEMI P 25 -94 (Reapproved 1104), Specification for Measuring Depth of Focus and Best Focus (SNARF # 5271) – SEMI P 25 has already been moved into Inactive status. NA Microlithography Report - Jan 2016

Inactive Standard • The NA Microlithography Technical Committee Chapter agreed to allow P 10

Inactive Standard • The NA Microlithography Technical Committee Chapter agreed to allow P 10 to go into Inactive Status. – SEMI P 10 (Specification of Data Structures for Photomask Orders) NA Microlithography Report - Jan 2016

Standards will go into Inactive status [1/3] • Feedback Requested on NA Microlithography TC

Standards will go into Inactive status [1/3] • Feedback Requested on NA Microlithography TC Chapter-Originated Standards to go into Inactive Status. • If no inputs are received, these Standards will go into Inactive status. • See next two slides for full list NA Microlithography Report - Jan 2016

Standards will go into Inactive status. [2/3] • • P 1 -0708 E, Specification

Standards will go into Inactive status. [2/3] • • P 1 -0708 E, Specification for Hard Surface Photomask Substrates P 2 -0308, Specification for Chrome Thin Films for Hard Surface Photomasks P 3 -0308, Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates P 6 -88 (Reapproved 0707), Specification for Registration Marks for Photomasks P 12 -0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP) P 13 -91 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy P 14 -0997, Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy P 15 -92 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy NA Microlithography Report - Jan 2016

Standards will go into Inactive status. [3/3] • • P 16 -92 (Reapproved 1104),

Standards will go into Inactive status. [3/3] • • P 16 -92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy P 17 -92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP) P 18 -92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer Steppers P 19 -92 (Reapproved 0707), Specification for Metrology Pattern Cells for Integrated Circuit Manufacture P 24 -94 (Reapproved 1104), CD Metrology Procedures P 28 -96 (Reapproved 0707), Specification for Overlay-Metrology Test Patterns for Integrated-Circuit Manufacture P 34 -0200 (Reapproved 0707), Specification for 230 mm Square Photomask Substrates P 45 -0211, Specification for Job Deck Data Format for Mask Tools NA Microlithography Report - Jan 2016

Data Path TF • Open Artwork Systems Interchange Standard (OASIS®) is widely used in

Data Path TF • Open Artwork Systems Interchange Standard (OASIS®) is widely used in the semiconductor industry • No plan to materially change SEMI P 39 NA Microlithography Report - Jan 2016

Extreme Ultraviolet (EUV) TF • Doc. 5907, Revision to SEMI P 5 -0704, Specification

Extreme Ultraviolet (EUV) TF • Doc. 5907, Revision to SEMI P 5 -0704, Specification for Pellicles – The proposed change is to bring the standard up to date to include EUV pellicles. Paragraphs which will require changes are • • 2 Scope 4. 1. 2. 2 Exposure Wavelength, 4. 1. 2. 3 Optical Transmission, 4. 1. 2. 4 Thickness 4. 1. 2. 5 Mechanical Strength 5. 2 Frame Adhesive 5. 4 Light resistance – Ballot will be reviewed at the next meeting NA Microlithography Report - Jan 2016

Mask Orders (P 10) TF • Plans to add a new syntax to support

Mask Orders (P 10) TF • Plans to add a new syntax to support both “pre-order” and Foundry order mask making instructions though no progress has been made. • No other activity is foreseen on P 10 unless something comes up. NA Microlithography Report - Jan 2016

Terminology TF • No activity. • Will determine whether to disband the task force

Terminology TF • No activity. • Will determine whether to disband the task force at the next meeting. NA Microlithography Report - Jan 2016

Extreme Ultraviolet (EUV) Fiducial Mark TF • No update NA Microlithography Report - Jan

Extreme Ultraviolet (EUV) Fiducial Mark TF • No update NA Microlithography Report - Jan 2016

Thank You! For more information or to participate in any N. A. Microlithography activities,

Thank You! For more information or to participate in any N. A. Microlithography activities, please contact Kevin Nguyen at SEMI (knguyen@semi. org) NA Microlithography Report - Jan 2016