NIST Nanofabrication Facility 1 CNST Nanofab A stateoftheart

NIST Nanofabrication Facility 1

CNST Nanofab A state-of-the-art shared-use facility for the fabrication and measurement of nanostructures – 19, 000 sq ft cleanroom (8, 000 sq ft class 100) – Advanced lithography and microscopy – Talented staff to train users or operate the tools – Makes available the expensive tools needed for nanotechnology – Instrumentation both inside and outside the cleanroom – Open to all users, NIST and worldwide 2

The CNST Nanofab is well equipped and expanding See cnst. nist. gov for details 3

CNST Nanofab tools Lithography – to pattern your chip • State-of-the-art electron-beam lithography: features as small as 5 nm, across whole wafer • Laser direct-write for mask making and rapid prototyping • Contact aligners for photolithography • Focused ion-beam tool for nanoscale milling and addition of material • Nanoimprint lithography for replicating nanoscale features Deposition, oxidation, and diffusion – to add dielectrics, dopants, metals • LPCVD furnaces for silicon nitride and poly-silicon • PECVD for low temperature oxides and nitrides • CMOS-clean or general use furnaces for oxidation and diffusion doping • Rapid thermal annealing • Sputter deposition, including dielectrics, metals, magnetic materials and multilayers • Electron-beam and thermal evaporation • Atomic layer deposition for molecular-scale, highly conformal coatings of metals and dielectrics. • Parylene deposition tool for conformal, bio-compatible polymer coatings 4

CNST Nanofab tools (cont. ) Etching - to selectively remove material • Two reactive ion etchers for thin metals and dielectrics • Two inductively coupled plasma etchers for deep silicon etching and metal etching • Two special purpose etchers allowing novel recipes for III-V materials and exotics • Cryogenic and high temperature capability • Xenon difluoride for sacrificial etching of silicon for MEMS applications • Microwave ashing for resist stripping Inspection and metrology – to see what you got • • • Field-emission scanning electron microscope (SEM) for high resolution imaging Tabletop SEM for rapid inspection Optical microscopes Spectroscopic ellipsometer for thin film thicknesses and optical properties Reflectometer for film thickness Profilometer for 2 D profiling Atomic Force Microscope (AFM) Wafer curvature tool for measurement of stress Four point probe systems for electrical characterization 5

CNST Nanofab tools (cont. ) Post-processing - to finish up your devices • Wafer Dicing Saw-Disco Model 341 • Wire Bonder: Kulicke and Soffa Model 4526 • Critical Point Dryer See this list and more at cnst. nist. gov 6

Using the CNST Nanofab • The Nanofab is fee-based, shared-use – Based on highly successful NNIN Nanocenter model – No proposal needed; simple one-page description of work • Open to all users – NIST site access restrictions apply • The Nanofab will train users in tool use – Alternatively, the process can be performed by a process engineer at an additional cost • Fees are based on operating costs – Similar to the full cost recovery fees of the NNIN-NSF Nanocenters • External users may apply to have a portion of their fee waived – For research supportive of CNST goals – Net charges similar to NNIN-NSF “academic” rates • User can maintain IP rights under certain circumstances • For information about use of the Nanofab – Contact Dr. Tony Novembre, the Nanofab Facility Group Leader (novembre@nist. gov) – Contact Dr. Alex Liddle if a joint research project is more appropriate (liddle@nist. gov) 7