New Dimensions in Scribing and Cleaving August 16

New Dimensions in Scribing and Cleaving August 16, 2019

…Scribing and Cleaving, methods used for much more than Silicon. . . Silicon wafer

When you think about scribing and cleaving… …you think handheld scribers, pins, dust, particle and a mess.

There’s an alternative way to Sapphire wafer Downsize Ga. As photonic devices Singulate Silicon and Cross-section prepare advanced materials in the cleanroom!

. . . a clean, dry way to cross-section targets and create mirror-finish facets. Singulated 200 µm thin In. P substrate to 3 x 4 mm dice with mirror finish facets.

…a reliable way to singulate wafers prior to and inspect after processing. . . 2” sapphire wafer Ga. N on Sapphire

. . . amorphous materials can be cleaved, thin and thick glass, even Gorilla glass Singulated 200 µm thin In. P substrate to 3 x 4 mm dice with mirror finish facets.

Lattice. Ax is a patented, dry, clean and easyto-learn scribeless cleaving system—proven to save time and cost. The Lattice. Ax 420 covers a variety of sample prep needs in the cleanroom or nanofab.

“We saw a significant reduction in particulate contamination, as most users have shifted to cleaving with this tool. ” US based nanofab manager Confidential 7/22/15 9

“…It is clear that reducing cycle time and cost while developing the best processes is critical in creating new materials and products. . . ” Lattice. Gear customer feedback Confidential 7/22/15 10

We can help you… Cut your nanofab operating costs Make your users really happy? and

Talk to us. We’re here to help improve sample preparation.