Ne SSI The Good The Bad and the
Ne. SSI*: The Good, The Bad and the Ugly Early Implementations and Directions *New Sampling/Sensor Initiative IFPAC Scottsdale, AZ, USA - January 22, 2003 John Cumbus Rob Dubois “the best way to predict the future is to create it”
“And let it be noted that there is no more delicate matter to take in hand, nor more dangerous to conduct, nor more doubtful in its success, than to set up as the leader in the introduction of changes. For he who innovates will have for his enemies all those who are well off under the existing order of things, and only lukewarm supporters in those who might be better off under the new. '’ Niccolò Machiavelli (from The Prince pub. 1515)
Presentation Outline • • • Recap of Ne. SSI Structure, Objectives & History Ne. SSI Gen I, III Overview Some “sacred cows” The good, the bad, the ugly Implementations and Directions – POCA Projects – Do. E Project • Acknowledgements • Summary
Ne. SSI Structure & History • An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in the way we do Process Analytical. – Ne. SSI mail-out has now grown to 330+ subscribers • Represents over 33 End Users from Oil and Petrochemical as wells as Manufacturing Companies, Academia, National Labs • An “Open” Initiative sponsored by CPAC (Center for Process Analytical Chemistry) • End User driven
Ne. SSI Objectives • Facilitate the acceptance/implementation of. . . – modular, miniature & smart process analytical technology • Promote the concept of. . . – at the pipe/field-mounted (“by-line”) analytical • Lay the groundwork for. . . – open connectivity communication architecture • Provide a technology bridge to the process for. . . – “sensor/lab-on-a-chip” microanalytical devices
Ne. SSI: The Vision of Success • Reduce Engineering Time Courtesy of J. Warnowski/D. Mitchell. Swagelok/Panametrics – “configurator tool” – self-documenting • Reduce Assembly Time – Lego Like Assembly • Lower Maintenance Costs – diagnostics Courtesy of U. Bonne. Honeywell. Vision Element: To design, assemble and configure an analytical system on one’s kitchen table.
Ne. SSI Generation Segmentation Wireless, Advanced Gas & Liq. Sensors Value & Platform for micro. Analytical Gen III Gen I Electrical Transducers/IS Network Mechanical Components (mostly)
Ne. SSI Generation I Mechanical: Miniature and Modular • Adapted from SEMI • ANSI/ISA SP 76 approved “Standard” Form Factor • Allows Lego®-like construction • Several SP 76 substrate compliant vendors exist Courtesy of Swagelok
Ne. SSI Gen. II Networked/I. S. / mini. Transducers/Wireless PDA Ethernet LAN CANbus Analyzer Controller or PC V F P A T Substrate Programmable Substrate Heater T Auxiliary Heating/Cooling SAM PDA
Ne. SSI Gen III - an enabling platform for Analytical Ethernet LAN Enabling Technology for Analytical AT One sensor measures one component uanlaytical Fiber Optic SAM One sensor measures multiple components V T A A
Sacred Cows. . . . or Opportunities? • Size of sample passages restrictive to flow • Sample System should be located under the GC • Double block and bleed valves are needed for stream switching • Modular assembly prone to leaks from number of connections • Components do not meet area electrical classification • insufficient flow to purge for stream switching • Flow path difficult to follow without tubing
The Good • • Reduction in detailed engineering effort Ease of Construction Saves space, allows options for location Simple design Competitive costs Remote monitoring possible Alarm on failure Number of manufacturers increasing
The Bad • • Harder for technicians to intuitively understand / follow Need more components, broader ranges O-rings/seals in vertical configuration Low flow monitors / controllers
The Ugly (Softer Issues) • • • Who constructs the system Packaging for ease of maintenance interface Interconnection (power, signal, control) with analyzer SAM interface? Technician education / acceptance Re-evaluation of maintenance effort
Field Installations
Substrate Selection What do we like? What we don’t like! • • • 4 -screw approach o-ring grooves (gripper) no torque requirements flow pattern inscribed P/N & function visible on parts metal seals tight space what component is it? any special tools required inconsistencies with other substrates
Shopping List of Downmount Components • • • Pressure regulator Flow measurement devices Flow control devices Quick change filters Any temp/pressure/flow transmitters with liquid crystal display
Activities and Directions • Since IFPAC, 2002 – May, 2002. Do. E supplier/user team formed & White Paper developed by U. Bonne/Honeywell Labs – June, 2002. White Paper Submitted to Do. E – June, 2002. Honeywell demonstrates first IS CANbus – July, 2002. POCA* Project conceived – August, 2002. ISA SP 76 footprint approved by ANSI – 12 Installations in Dow & Exxon. Mobil Facilities – November, 2002. POCA prototypes ordered. *POCA = Ne. SSI Gen II Proof of Concept Apparatus Project
Introducing the POCA Project(s) • Purpose: Accelerate Ne. SSI Gen II dev. • Seeded by Dow Chemical, Exxon. Mobil Chemical, Air Products • Honeywell is the major supplier/integrator – B. Nickels/J. Mosher (commercialization & networking) – U. Bonne (sensor R&D) • Impact to Industry • first SP 76 diagnostic physical minisensors (p, T, F) • first SP 76 miniactuators (Vo, Vm) • first intrinsically safe, low cost, network IN PROGRESS
Introducing Potential Do. E Project • Purpose – Field test Ne. SSI Gen II – Develop/source missing components – Certification of electrical products • ~ $2 MM funding (50% “work in kind”) • 2 year duration (1 year lab/1 year field test)
The Do. E User/Supplier Team (More folks welcome!!) • User Team – – – – Peter van Vuuren (Exxon. Mobil) Rob Dubois (Dow Chemical) Joe Andrisani (Du. Pont) Steve Wright (Eastman) Bob Reed (Merck) Paul Vahey (Honeywell-SM) D. Young/D. Nettles (Chevron. Texaco) Frank Scweighardt (Air Products) George Vickers (BP) Paul Barnard (Equistar. Chemicals) Steve Doherty (Pharmacia) Bob Maglagenta (Kraft) Alan Eastman (Conoco. Phillips) UOP • Supplier Team – – Ulrich Bonne (Honeywell Labs)* Bob Nickels (Honeywell ACS) Dave Simko (Swagelok) Steve Doe (Parker-Hannifin) • CPAC – Mel Koch * Supplier Team Lead PI
Do. E Project Deliverables 1. Heated/Temperature Programmed Substrate 2. mini-Sensor Transducers (p, T, F) 3. “Combi” Actuator Transducers (Vo, Vm) (on/off & modulating transducers) 4. SAM - Sensor/Actuator Manager Certified CSA, FM, 5. Multi-Drop Digital Intrinsically Safe Bus. CENELEC 6. Micro Climate Enclosure * HMI = Human Machine Interface
Acknowledgements • Dow Chemical – R. Hartwig/D. Quevillon – Craig Snook – B. Vu /P. Williams/J. Leach – R. O’Reilly – W. Henslee • Air Products – Frank Schweighardt • Eastman Chemical – Steve Jacobs • Tatera & Associates – Jim Tatera • Exxon. Mobil Chemical – Dan Podkulski – Jeff Gunnell – Peter van Vuuren – Rajko Puzic – Kelley Bell • Honeywell – John Mosher – Bob Nickels – Ulrich Bonne • CPAC – Mel Koch – Dave Veltkamp
Summary. . . • Gen I products moving into the field • Strengths and Weaknesses Reviewed – Strengths to build on…weaknesses to overcome • Gen II - High Level of Activity – Proof of Concept (POCA) in progress – Do. E Potential Project • Gen III Products in Sight
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