Ne SSI Generation II Revolution or Evolution New

Ne. SSI* - Generation II “Revolution or Evolution? ” *New Sampling/Sensor Initiative CPAC - November 5 -8, 2001 Rob Dubois - Peter van Vuuren - Jim Tatera and Associates “the best way to predict the future is to create it” 9/16/2020 1

The Recent History of • ISA 2001 Meeting (Joint ISA/CPAC Session) Ne. SSI Tutorial Standing Room Only Interest Public Introduction of Generation II Specification Open Discussion Session (Sept 11 Impact) Main Issue - Area Classification Requirements Identified X-Team to address Ad-hoc Sensor Connectivity Session CAN-based protocols (e. g. SDS, Device. Net) best candidates A C-team will clarify benefits of CAN and propose as preferred Ne. SSI sensor communications standard • Miscellaneous Efforts afoot to extend SP 76 to IEC standard Ne. SSI Tutorial at INTERMAC Meeting in Japan (Nov 8) - Rob Dubois Ne. SSI Marketing Survey Underway 9/16/2020 2

Hot Off The Press z Legacy 9/16/2020 z Ne. SSI 3

Major Goals of z Facilitate the acceptance/implementation of. . . y modular, miniature & smart sample system technology ybased on ISA SP 76 standardization work z Promote the concept of. . . yfield-mounted smart sampling/analytical systems yintegration of sample systems with physical/chemical sensors z Lay the groundwork for. . . yopen connectivity architecture for sensor communications (e. g. Ethernet, Device. Net, etc. ) yindustry standard communication protocols (e. g. OPC, Device. Net, CAN etc. ) yweb enabled technologies (e. g. Browser based HMI) z Provide a technology bridge to the process for. . . y“sensor/lab-on-a-chip” micro-analytical devices 9/16/2020 4

Ne. SSI Generations z. Ne. SSI Generation I (circa 2000 -2002) y mechanical, passive components are on a SP 76 substrate z. Ne. SSI Generation II (circa 2002 -2004) y y y “electrified” passive & active components are on a SP 76 substrate integral heating and temperature control of the substrate all electrical components are integrated with SAM sensors and actuators communicate via sensor bus smart (self-diagnostic) sample systems z. Ne. SSI Generation III (circa 2003+) y many analytical sensors and micro-analytical systems y wireless sensors 9/16/2020 5

Generation II Dimensions covered in the Specification…. z 1. Heated Substrate z 2. Physical Sensors z 3. Actuators z 4. SAM z 5. HMI (Graphical) 9/16/2020 z 6. Wired Bus z 7. Wireless Bus z 8. X Mini Power Bus z 9. Packaging z 10. Analytical Sensor 6

1. Heated Substrate Div/Zone 1 GP. A-D AC Power Div/Zone 1 or 2 GP. A-D Conduction Heating - cartridge heater(s) - over-temperature cut-off Furn. by substrate mfg. Heating Fluids (alternative) 9/16/2020 7

2. Physical Sensors for z Doing analytical is just not good enough! System Diagnostics z Miniature Flow, Pressure, Temperature y. Gas and/or liquid service y. Rugged construction y. Encapsulated (IEC Ex m) y. Intrinsically Safe (IEC Ex ib) y. Div/Zone 1 Gp A-D; T 4 (135 C) FLOW: P, coriollis, thermal, other? COM A/D Substrate 9/16/2020 8

2. Conceptual Sensor for Ne. SSI Parallel Ports - standard size/pin - daisy chain “Top Hat” Comm. Chip A Body - encapsulated Memory Comm. BARRIER - Process Seal - Electrical Isolation - Thermal Insulation Skirt - engineered 1. 50” Sensor 9/16/2020 B µP Digital “Smart” Sensor - engineering units - memory A/D Process Cavity - no unswept voids - low volume Base - 316 SS - pressure rated 9

3 a. Electrical Actuators on the Substrate - COMBO z. Miniature substrate mount y. Gas and/or liquid service y. Wide P & T service y. Rugged, encapsulated (IEC Ex m) y. Intrinsically Safe (IEC Ex ib) y. Div/Zone 1 Gp A-D; T 4 (135 C) COMBO Valve /w integral solenoid Comm. SV AIR Act. On/Off and Proportional 9/16/2020 10

3 b. Conceptual “Combo” Valve “Top. Hat” Comm. Chip A B Comm. 3 -way “pilot” solenoid valve - Intrinsically Safe Actuator - NO or NC Vent D/A Solenoid Actuator Vent Valve Engineered Insulation Skirt 9/16/2020 Parallel Ports - standard size/pin - daisy chain Instrument Air Digital On-Board Conventional pneumatic valve Thermal Barrier 11

4 a. SAM explained. . . HMI Interface - Field - Graphical Gateway to an Ethernet LAN - OPC perhaps - Wireless - e. g. Bluetooth™, 802. 11 Software Applets for Sample System Host to a Repetitive Tasks Sensor/Actuator Bus (Industry Common) 9/16/2020 12

4 b. SAM Applets for Common Tasks 4 Zero & span validation 4 Pressure regulation 6 Stream switching 4 Maintenance diagnostics 4 Temperature control z. Interoperability ytalk to all analytical systems Enabling Technology for quick introduction of micro. Analytical to Industry SAM 9/16/2020 13

5. Human Machine Interface PDA Hello? PC A 9/16/2020 F Vv T Vv P Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor; T=Temp. Sensor F 14

6 a. Standalone “SAM” with Wired Sensor/Actuator Bus Analyzer System Ethernet LAN z Target Ex ib intrinsically safe z Plug & Play z CAN based connectivity Sensor Analytical Manager (SAM) ? V T P A 9/16/2020 Analyzer Controller Legend: P Pressure Sensor T Temp Sensor V Valve/Actuator A Analytical Sensor 15

6 b. Embedded SAM With Wired Sensor/Actuator Bus z Target Ex ib intrinsically safe z Plug & Play z CAN based connectivity Analyzer System Ethernet LAN ? Analyzer Controller w/ Embedded SAM Functionality V T P A 9/16/2020 Legend: P Pressure Sensor T Temp Sensor V Valve/Actuator A Analytical Sensor 16

7. Wireless Signal (Gen III…? ) Analyzer System Ethernet LAN z Signal: Bluetooth , 802. 11, other? z Plug and Play! z Power Sensor Analytical Manager (SAM) y X-proof miniature power bus V T P A P. S. 9/16/2020 17

8. What the world needs is. . . Sensors (typ) z. . a miniature wiring method y “plug & socket” Mini-Power Bus y. Division/Zone 1 ye. g. MTL (England) AC Power 9/16/2020 AC/DC 18

9. Enclosure/Package Convection Heater X-Proof (OPTIONAL) Temp. Sensor Intrinsic Safe Div/Zone 1 GP. A-D Div/Zone 1 or 2 GP. A-D AC Power No Purge or Pressurization 9/16/2020 NEMA or IP Rated Enclosure - insulated 19

10. Analytical Sensors (Gen III…? ) Fiber Optic AT SAM One sensor per component “lab on a chip” One Sensor and Multiple Analytes “laser scanning device” A 9/16/2020 F Vv T A 20

What would a Gen II prototype look like? z. Programmable, heated substrate z. Digital, serial sensors/actuators: F, P, T z. Zone 1 enclosure interior z. SAM; control algorithms z. Wireless - graphical HMI z. Packaged for outdoor installation 9/16/2020 21

Summary z. Generation II Ne. SSI y. Evolution as opposed to revolution z. Release of Generation II Spec y 1 st quarter 2002 y. To Ne. SSI Distribution List & IFPAC 9/16/2020 22

Acknowledgements I z Dow y. Danny Quevillon y. Reg Hartwig y. Walt Henslee y. Bac Vu (SP 76) z Syncrude y. Ian Verhappen 9/16/2020 z Exxon. Mobil Chemical y. Dan Podkulski (SP 76) y. Jeff Gunnell y. John Cumbus y. Rajko Puzic z CPAC y. Mel Koch y. Lloyd Burgess y. Brian Marquardt 23

Acknowledgements II y. Doug Mitchell Panametrics y. John Wawrowski Swagelok y. Rick Ales - Swagelok y. Yoav Barshad Applied Analytics y. Nick van Bruggen Porter 9/16/2020 y. Carl Jones Rosemount Analytical y. CD Feng - Rosemount Analytical y. Bob Nickels Honeywell y. Chris Towle - MTL 24

Help Wanted/Needed z Technology Teams z A-Team – Define Applications for SAM z C-Team – Communications for SAM to Sensors + z X-Team – Hazardous Electrical Area Issues 9/16/2020 z Ne. SSI Partners z A group of users and vendors to help invest in, develop, and evaluate Ne. SSI technology. z CPAC Web Site Listing Ne. SSI/SP 76 Compatible Components 25