Nanofabrication Facility overview Fabrication The Temescal EBeam evaporator
Nanofabrication Facility overview
Fabrication. The Temescal E-Beam evaporator allows automated deposition of up to six materials in a single process. The system can process 25 4” wafers in a single batch. (Au fee of $2/nm)
Fabrication. The Elionix ELS-7000 can produce 6 nm features with overlay accuracy ~30 nm. Can support any substrate <150 mm X 6 mm. ($101/hr)
Fabrication. The Heidelberg MLA-150 enables rapid, maskless photopatterning at 375 nm. Minimum feature size and overlay accuracy are submicron.
Fabrication. The Plasma-Therm Versalign is a state of the art RIE system capable of Bosch etching 150 mm wafers. Equipped with interferometric and spectroscopic endpoint detection.
Packaging. The Finetech Fineplacer lambda is a thermocompression die bonder capable of sub-micron bonding accuracy and programmable chip and substrate thermal ramping, allowing eutectic and adhesive die attach.
The ficontec CL 1500 pick and place robotic assembly tool allows sub-micron placement and bonding of delicate components, as well as active optical alignment with six axis of motion control.
The Hybond 626 wirebonder allows for Ball, Wedge, Bump, Peg and Tab bonding. Numerous material systems are supported as well as an assortment of wire geometries.
To incorporate The Nanofabrication Facility in grant applications… • Talk to us about your plans/goals • Consider personnel requirements (time, expertise, training) • Leverage our vertically integrated facility as a selling point
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