MQXFA 04 Coil 206 OD Bump postGPI Dan

MQXFA 04 Coil 206 OD Bump post-GPI Dan Cheng 11/21/2019 LBNL

Coil 206 Dressed Coil Status § Coil 206 received at LBNL 2 -Oct-19 § Observed abrasion from shipping fixture § A wipedown cleaned up abrasions fine § Coil electrical tests performed and passed § SG instrumentation § Coil GPI applied § Discovered a bump; further GPI processes stopped Coil 206 Bump after GPI 2

Coil 206 Notes § Between Coil instrumentation there are two handling operations § § Lifting to coil rotating table Rotation of coil Lifting to coil GPI stretcher table No anomolies observed during these (standard) operations § The coil LE is resting as pictured in Figure 4. § The iron used was at 135 C § GPI is ironed from LE to RE § Location of bump is at LE endshoe to coil transition § On the second side of the GPI that is applied (the other side is attached first) § Approximately ~0. 005” (by feel, not measured) Coil 206 Bump after GPI 3

Pictures Coil 206 Bump after GPI 4

Pictures Coil 206 Bump after GPI 5

Pictures Coil 206 Bump after GPI 6

Pictures Coil 206 Bump after GPI 7

Video § The bump appears to be the top surface “buckling” § § Mechanism of this is not yet fully understood Cannot tell if it extends down into endshoe-coil transition Coil 206 Bump after GPI 8

Pictures before Instrumentation Coil 206 Bump after GPI 9

Pictures before Instrumentation Coil 206 Bump after GPI 10

Summary and Next Steps § Coil 206 developed a bump some time between instrumentation and GPI application § Based on photographic evidence only § May have occurred § Will perform EQC on Coil 206 to verify integrity § Stopped GPI application processes on Coil 115 (last coil of five for MQXFA 04) pending investigation Coil 206 Bump after GPI 11