Module 0 construction an introduction Marina Artuso Syracuse

Module 0 construction: an introduction Marina Artuso Syracuse University 1 Marina Artuso Velo Upgrade Meeting 5/5/10

A reminder of our organization structure From Paula’s presentation on work package organization Identify the meaningful arrows and maintain coordination 2 Marina Artuso Velo Upgrade Meeting 5/5/10

How a module might look like (strawman) Marco Gersabeck/Tony Smity Velo Upgrade Meeting 4/14/10 3 Marina Artuso Velo Upgrade Meeting 5/5/10 Basic Building block of module 0 3 or 3 x 1

Goals of Module 0 Construction Work � Develop experience in the mechanical assembly, cooling techniques, signal data flow, HV and LV distribution, and reliability issues that need to be tackled to construct the final module [basic unit 3 chip block (single or 1 x 3)] � Identify one or two challenges which would enhance the performance of the overall system (e. g. metallization of diamond substrate, electronic thinning) � Complement approximation with electrical and mechanical mock-ups. � Mechanical, thermal, electrical simulations to validate design confirmed by program of measurements on mock-ups. 4 Marina Artuso Velo Upgrade Meeting 5/5/10

Overview of the challenges �Radiation hardness �Adequate cooling �Mechanical stability �Good performance in vacuum �Reliability of the various components in changing operating conditions (radiation, thermal, mechanical stresses…) �Signal integrity at high rates 5 Marina Artuso Velo Upgrade Meeting 5/5/10

Radiation Hardness resistance: all the components close to the beam need to be qualified for ~1 x 1016 neq/cm 2 � Sensor � Front End Electronics � Cooling substrate � Interconnection system (kapton, metallized substrate, bump bonds…) 6 neqcm-2 x 1016 � Radiation 5 Tip of current velo Marina Artuso Velo Upgrade Meeting 5/5/10

Cooling needs Affolder RD 50 June 2009 Meeting Proton Irradiation Results for illustration purposes � Power consumption of sensor changes due to irradiation � Electronics needs to be fast and drive high output rate signal � With Si option, we need to prevent thermal runaway 7 Marina Artuso Velo Upgrade Meeting 5/5/10

Other issues of concern Mechanical Issues Electrical Properties � Thermal � Signal stresses induced by CTE mismatch, temperature gradients, distributed heat sources with hot spots � Strategy to validate design: simulation, mock-ups… 8 integrity for the needed data rate (proper termination at each discontinuity, noise immunity) � Grounding and power distribution for low noise Miscellaneous Vacuum performance Low mass device (wafer thinning mechanical design) Marina Artuso Velo Upgrade Meeting 5/5/10

Hybridization issues � Reliability of bump bond connectivity as a function of temperature and irradiation (test structures to validate technology to 1016 neq/cm 2? ) � Wafer thinning � Which substrate? � Kapton or metallized diamond? � Prospects fro TSV? 9 Marina Artuso Velo Upgrade Meeting 5/5/10

For the final discussion � Shopping list & matrix of responsibilites Compnent Items needed Responsible Institution Sensor – Planar Si Timepix/Medipix 3 Bump bonding Kaptons (signal/power) Electronics infrastructure Cooling blocks Electronics Infrast Mechanical mock-ups Components for irradiation/thermal stress tests 10 Marina Artuso Velo Upgrade Meeting 5/5/10

Concluding remarks � The program is designed to start filling this table � I hope that at the end of the day the module 0 will be the result of a true collaborative effort merging the best ideas proposed � Summary of our conclusions will be circulated to have the feedback of all 11 Marina Artuso Velo Upgrade Meeting 5/5/10