Micro TCA 0 to Micro TCA 4 A

Micro. TCA. 0 to Micro. TCA. 4: A standard and it's evolution

x. TCA Specification landscape Advanced. TCA Including dot-specifications PICMG 3. 1 – 3. 6 Micro. TCA MTCA. 1 Air Cooled Rugged Micro. TCA ATCA 300 MTCA. 3 Hardened Conduction Cooled Micro. TCA MTCA. 2 * Hardened Air Cooled Micro. TCA MTCA. 4 Abandoned Enhancements for Rear I/O and Precision Timing x. TCA for Physics* ATCA Extensions * standardized Zone 3 connector Timeline Defense © Pentair Technical Products Industrial, Test & Measurement, Transportation Telecom Data Center * Work in process 2

Advanced Mezzanine Card the base for Micro. TCA Carrier Blade in an Advanced. TCA chassis Advanced. MC Modules Carrier Blade The Advanced. MC Modules are defined as Mezzanine Cards for the use on special Advanced. TCA Blades, called Advanced. MC Carrier, within the Advanced. TCA System. © Pentair Technical Products 3

Micro. TCA (MTCA. 0) „Micro Telecommunications Computing Architecture Base Specification“ Advanced. MC in Micro. TCA Systems Advanced. MC Modules Micro. TCA Subrack The Advanced Mezzanine Card is plugged directly into the Micro. TCA Subrack or System. The Advanced. MC is converting from a hook-on module to a functional board © Pentair Technical Products 4

Micro. TCA = standalone solution of Advanced. MC ‣ ‣ ‣ New standard platform Backplane directly accepts Advanced. MC modules Advanced. MC interchangeable between Advanced. TCA and Micro. TCA Subracks fits into 300 mm deep ETSI racks No rear I/O, power input and all moduls will be inserted from the front side New dimensions (not 3 U / 6 U anymore), card depth 180 mm (instead of 160 / 220 / 280 mm) © Pentair Technical Products 5

Advanced. MC Module dimensions 6 different Module sizes: ‣ „Height“: Compact, Mid-size, Full -size ‣ „Width“: Single and Double Full-size Mid-size = 6 HP Compact = 4 HP = 3 HP Double = 148. 8 mm Single = 73. 8 mm © Pentair Technical Products 6

Management: List of standards Micro. TCA Specification Advanced. MC Specification Advanced. TCA Specification IPMI Specification I 2 C-bus Specification © Pentair Technical Products 7

Physical Management Controllers Micro. TCA Shelf MCMC ‣ ‣ Micro. TCA Carrier Management Controller MCH Resides on the MCH MMC ‣ Module Management Controller ‣ Resides on the Advances. MC Module EMMC ‣ ‣ Enhanced Module Management Controller MCMC Backplane MMC MMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module Resides on the PMs and CUs © Pentair Technical Products 8

Management Buses IPMB-L ‣ ‣ Micro. TCA Shelf Micro. TCA Carrier Connects the MCMC on the MCH to the MMC on the Adcanvec. MC Modules MCH Radial architecture MCMC IPMB-0 ‣ Connects the MCMC on the MCH to the EMMC on the PM and CU ‣ Bused architecture IPMB-L I 2 C-bus IPMB-0 Backplane Carrier-FRU SEEPROM MMC MMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module I 2 C-bus ‣ Connects the MCMC on the MCH to the Carrier FRU EEPROM on the backplane © Pentair Technical Products 9

Micro. TCA Management Structure Carrier Manager ‣ ‣ Resides on the MCH ‣ E-keying Shelf Manager Micro. TCA Carrier Enables power to the Advanced. MCs via the PM MCH Carrier Manager Shelf Manager ‣ ‣ ‣ System Manager Resides either on the MCH or external to the shelf MCMC IPMB-L Maintains SEL (System Event Log) I 2 C-bus IPMB-0 Backplane Carrier-FRU SEEPROM Fan control System Manager ‣ ‣ Highest level management function Manages one or more Micro. TCA Systems Each FRU’s (Field Replaceable Unit) equipped with a management controller MMC MMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module All FRU’s connected via IPMI (Intelligent Platform Management Interface) © Pentair Technical Products 10

Micro. TCA Power Module (PM) and Cooling Unit (CU) Power Module ▶ ▶ The MTCA Power Module is involved into the Carrier Management ▶ Enables Management and Payload power to each slot individually ▶ Decision for enabling / disabling power is done by the MCH (Carrier Manager) The MTCA Cooling Unit is controlled by the MCH (Shelf Manager) too ▶ Sets different fan speed levels on the request of the MCH (AMC: temperature event -> MCH command to CU to increase fan speed) Cooling Unit © Pentair Technical Products Power Module 11

Powering up a Micro. TCA Shelf Autonomous Booting Operational mode CU Operational Booting MCH X © Pentair Technical Products Pres. Enable IPMB-0 MP PP IPMB-0 ♥♥ Autonomous Operational Booting mode PM -48 V 12

Powering up a Micro. TCA Shelf Operational CU MCH X © Pentair Technical Products PP Pres. IPMB-L IPMB-0 I 2 C Operational Enable IPMB-0 MP ♥♥ FRU-ID MMC Operational FRU-ID operational FRU-ID Operational AMC PM -48 V 13

Micro. TCA Connector and Backplane ‣ ‣ Data transport is based on switched fabrics (serial data transfer) Connector: 170 pin Card Edge Component side 1 is left!! Supported protocols: Gb. E, 10 Gb. E, SRIO, PCIe, S-ATA, SAS © Pentair Technical Products 14

Backplane Topologies (Connection Schemes) Micro. TCA Specification defines a Star and a Dual Star Backplane, other topologies often requested by customers Examples “low cost” Micro. TCA Chassis with direct interconnects © Pentair Technical Products Dual star Micro. TCA Chassis with direct interconnects on port 2 &3 and in the fat pipe 15

Micro. TCA Backplane Technology ▶ Bandwidth: shall support up to 12, 5 Gbps, today’s “speeds” per lane • • PCIe I 2, 5 Gbps Gb. E 1, 25 Gbps (“-KX”) ‣ Aggregated Bandwidth per link: 4 * data rate per lane ‣ Near Future “speeds” per lane • • PCIe II • SRIO 5, 0 Gbps, PCIe III 8, 0 Gbps 10 Gig. E 10 Gbps (IEEE 802. 3 ap, -KR) 10 Gig. E 3, 125 Gbps (“-KX 4”) SRIO 1, 25; 2, 5 & 3, 125 Gbps © Pentair Technical Products 5 - 6 Gbps 16

Micro. TCA Carrier Hub (MCH) Tongue 1: Common Options interface, IPMB connections Tongue 2: Common Options, Clocks Tongue 3, 4: Fat Pipe and Extented Fat Pipe connections © Pentair Technical Products 17

Thermal requirements for a Micro. TCA System Different Power losses defined: MTCA. 0 R 1. 0 Single Compact = 20 W Single Full-size = 40 W Double Compact = 40 W Double Full-size = 80 W AMC. 0 R 2. 0 Single Compact = 24 W Single Mid-size = 30 W Single Full-size = 48 W Double Compact = 48 W Double Mid-size = 60 W Double Full-size = 80 W ▶ The maximum ambient temperature is defined at 55°C ▶ The allowed temperature increase within a slot is ΔT = 10 Kelvin ▶ One slot can be a several AMC modules in a row ▶ (1) + (2) + (3) = one slot ▶ Double FS + Single FS ▶ 80 W + 48 W = 176 W 3 © Pentair Technical Products 2 1 18

Rugged Micro. TCA ▶ The Rugged Micro Telecommunications Computing Architecture specifications define the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in Micro. TCA. 0. ▶ MTCA. 1 (Air Cooled Rugged Micro. TCA): this first subspecification of Micro. TCA describes rugged air-cooled systems for industrial applications. ▶ MTCA. 2 (Hardened Air Cooled Micro. TCA): the second sub -specification of Micro. TCA; it describes rugged air-cooled systems for military applications. ▶ MTCA. 3 (Hardened Conduction Cooled Micro. TCA): the third sub-specification of Micro. TCA; it describes rugged conduction-cooled systems for military applications © Pentair Technical Products 19

MTCA. 1 Shock & Vibration requirements Vibration Shock Specification Micro. TCA. 0 0. 5 g 7 g IEC 61587 -1 DL 1 Micro. TCA. 1 3 g sinusodial 8 g random 25 g IEC 61587 -1 DL 3 ANSI/VITA 47 V 2 Thermal requirements : 3 different Levels: Ambient (Micro. TCA. 0) and 2 Extended Temperature ranges XT 1 & XT 1 L Micro. TCA. 0: XT 1 L: XT 1: - 5°C - 40°C to to to + 55°C + 70°C Additional requirements: Drop test, Ro. HS, Acoustic, Surface temperature are defined as application specific For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MTCA. 1 refers to the MTCA. 0 base specification © Pentair Technical Products 20

Solution ▶ Advanced. MC front panel has to be fastened (screwed) to the subrack additional retention screw front panel with flange MTCA. 1 front panel ( XR 2 ) © Pentair Technical Products Advanced. MC. 0 front panel 21

Issues using a normal screw Face plate deflection F When the Rugged Micro. TCA Module is screwed to the subrack… … the face plate will be deflected… … and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed. F F © Pentair Technical Products Conclusion: A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector. 22

Solution Gap 0. 0 mm MTCA chassis Front panel flange Sleeve welded onto front panel Maximum gap ( 1. 60 mm )* 1. 60 Collet Welded sleeve * Based on 185, 85 subrack depth Screw M 3 © Pentair Technical Products 23

Micro. TCA Evolution (Rugged Micro. TCA) ‣ Micro. TCA. 2 (work in process) - Hardened air Cooled Micro. TCA • For Telecommunication outdoor and military air, land sea applications • • Clamshell System similar to Micro. TCA. 3, similar shock & vibration demands • Wedge-LOK is blocking the air flow • Special retainer solution is needed allowing forced air flow through heat sinks Conduction Cooling, Heat path: From the hot spots though thermal paste to clamshell and through Card-LOK to the chassis © Pentair Technical Products 24

MTCA. 3 Hardened Conduction Cooled Micro. TCA ‣ Specification approved Febr 2011 • • • For Telecommunication outdoor and military air, land sea applications 5 ruggedization levels with up to 15 g vibration and up to 40 g shock Standard AMC board in a clamshell • • it hardens the Boards • provides a thermal conduction path to the Thermal Interface Surfaces of the Chassis Sidewall protects the active circuits of the PCB from ESD damage, supports Two Level Maintenance / 15 KV ESD Protection © Pentair Technical Products 25

MTCA. 3 (Hardened Conduction Cooled Micro. TCA) ▶ Demands other kind of chassis ▶The chassis must have slots to hold the boards with wedge-loks ▶The chassis must be able to emit the heat to the surrounding air © Pentair Technical Products 26

Micro. TCA. 4 - Enhancements for Rear I/O and Precision Timing ‣ The advanced Physics community has made the decision to use Advanced. TCA and Micro. TCA in their next generation of systems ‣ ‣ Today their platform is VME Main Reason for the change: • The Large Hadron Collider, Cern Remote management, failure detection of FRU’s (fans, PSU’s, Blades) ‣ The Advanced. TCA & Micro. TCA Specification need some adoption to fit the needs of the community ‣ This was the reason for starting the working group “x. TCA for Physics” inside the PICMG © Pentair Technical Products Karlsruher Tritium Neutrino experiment KATRIN 27

Micro. TCA. 4 ‣ Why are enhancements needed to the existing Micro. TCA specification? • No Rear Transition Module (RTM) for Micro. TCA defined • Physics applications typically require a large number of I/O cables. It makes sense to connect them to the rear of the chassis. Special clock and trigger topology - Micro. TCA. 0 specifies 3 Clocks and AMC. 0 R 2. 0 specifies 4 Telecom and 1 Fabric Clock on the AMC Module. Physics / measurement applications typically need additional Clocks and Triggers © Pentair Technical Products 28

Micro. TCA. 4 ‣ Requirements for mechanics and sizes • • AMC µRTM AMC Module size: Double Mid-size Allows for the max number of 12 AMCs in a 19” wide shelf • • Large µRTM real estate • • Use front panel mechanics based on Rugged Micro. TCA µRTM size approximately the size of the AMC (doubles depth of existing Micro. TCA chassis) Use Rugged Micro. TCA retention device Reuse existing AMC front panels for the µRTM Optional zone 3 backplane © Pentair Technical Products 29

x. TCA for Physics Features of a Micro. TCA shelf with RTM, side view Safety keying, 8 positions Front 3 -pair ZD connector (2 x 30 diff. pairs) AMC Retention device (defined in Rugged Micro. TCA spec. ) © Pentair Technical Products AMC card edge connector µRTM Space for mounting mezzanine boards Could be used for clock and trigger distribution µRTM handle, is at the top of the µRTM (µRTM front panel appears up side down) Rear Retention device (defined in Rugged Micro. TCA spec. ) 30

Micro. TCA. 4 ‣ Management extensions required for Physics Micro. TCA Shelf Micro. TCA Carrier MCH MCMC IPMB-L I 2 C-bus • • • Connects the AMC to the µRTM The µRTM is treated as managed FRU of the AMC µRTM fans can be independently managed © Pentair Technical Products IPMB-0 Backplane MMC MMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit EMMC Power Module I 2 C-bus µRTM 1 µRTM 2 µRTM 12 µRTM Cooling 31

‣ Differences MTCA. 0 / MTCA. 4 backplane topology Backplane Topology, 23005 -463 12 Slot Dual Star Common Options MCH 1 Fabric [A] to AMC Port 0 Common Options MCH 2 Fabric [A] to AMC Port 1 AMC Port 2 AMC Port 3 Fat Pipe MCH 1 Fabric [D: G] to AMC Port [4: 7] 4 • Direct S-ATA slot interconnects (used in most MTCA. 0 systems too) 4 4 4 4 4 4 Extend. Fat Pipe MCH 2 Fabric [D: G] to AMC Port [8: 11] AMC Port 12 AMC Port 13 AMC Port 14 AMC Port 15 • Special slot to slot interconnects (star & daisy chain routing) on user defined ports 12 to 15 AMC Port 17 AMC Port 18 AMC Port 19 AMC Port 20 Clocks MCH 1 CLK 1 to AMC TCLKA • Parallel bus structure on user defined ports 17 to 20 Clocks MCH 2 CLK 1 to AMC TCLKC Clocks AMC TCLKB to MCH 1 CLK 2 Clocks AMC TCLKD to MCH 2 CLK 2 Clocks MCH 1 CLK 3 to AMC FCLKA P M 0 1 © Pentair Technical Products P M 0 2 M C H 0 1 A M C 0 2 A M C 0 3 A M C 0 4 A M C 0 5 A M C 0 6 A M C 0 7 A M C 0 8 A M C 0 9 A M C 1 0 A M C 1 1 A M C 1 2 M C H 0 2 P M 0 3 P M 0 4 32

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