MEMS CLEAN ROOM n 1500 m 2 class
- Slides: 11
MEMS CLEAN ROOM n 1500 m 2, class 10 n 150 mm (6”) Wafer line n 3 shift preparation for R&D and pilot fabrication (24 x 5) n Access to external services n Technological parameter supervising system n MES / PPS based planning and documentation n ISO 9001 certification © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 1
MEMS Clean Room Layout Aktuelle Clusterung SEM BACK END CHARACTERIZATION & TEST WET ETCH / CLEANING LAB INLINE METROLOGY BACK END CVD LOGISTICS HIGH TEMPERATURE EXTERNAL PARTNERS LITHOGRAPHY DRY ETCH / PVD GOWNING AREA CMP © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 2
MEMS Clean Room: Characterization & Test © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 3
MEMS Clean Room: Lithography © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 4
MEMS Clean Room: Wet Etch / Cleaning © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 5
MEMS Clean Room: Wet Etch / Cleaning © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 6
MEMS Clean Room: Dry Etch / Strip Resist © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 7
MEMS Clean Room: Backend (Bonding, Dispense) © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 8
MEMS Clean Room: Inline Metrology © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 9
MEMS Clean Room: Inline Metrology © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 10
MEMS Clean Room: SEM © Fraunhofer IPMS T. Zarbock I 05. 04. 2013 I slide 11