MAPS readout Systems Christoph Schrader Dresden 26 09

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MAPS readout Systems Christoph Schrader Dresden -26. 09. 2007

MAPS readout Systems Christoph Schrader Dresden -26. 09. 2007

Micro- Vertex Detector MAPS (“Monolithic Area Pixel Sensors”) Micro- Vertex Detector: • consists of

Micro- Vertex Detector MAPS (“Monolithic Area Pixel Sensors”) Micro- Vertex Detector: • consists of two MAPS detector stations • ~ 20µs integration time • ~ 20µm pixel pitch 20 Gb/cm 2 raw data Fig. 1: Sketch of the proposed CBM experiment

Vertex Demonstrator Our MAPS-Chip (Mimosa-17): • consists of four matrices with parallel readout •

Vertex Demonstrator Our MAPS-Chip (Mimosa-17): • consists of four matrices with parallel readout • 256 x 256 pixel/matrix • pixel by pixel readout • 1 ms readout speed/frame Fig. 2: Example for MAPS-chip with 4 matrices in 12 seconds 1 Gb

TRBv 2 and the add-on concept TRBv 2: • Etrax-FS-Processor • Ethernet-connectivity • an

TRBv 2 and the add-on concept TRBv 2: • Etrax-FS-Processor • Ethernet-connectivity • an optical link with 2 Gbit/s • programmable logic (Vertex 4) Fig. 3: The general-propose trigger and readout board Fig. 4: The MDC-add-on mounted on the TRBv 2 (TRBv 2) – back side

Duties and responsibilities of the TRBv 2 for the MAPS add-on • High data-rate

Duties and responsibilities of the TRBv 2 for the MAPS add-on • High data-rate digital interface connector (15 Gbit/s) • FPGA configuration • High data transfer with optical link (2 Gbit/s) • Application process interface (API) • Power supply +5 V, 10 A • Clock distribution

System configuration of MAPS readout serves as support for the various versions of MAPS

System configuration of MAPS readout serves as support for the various versions of MAPS devices adapts/converts the signals control and collect measurement data Fig. 5: A block diagram of system configuration for MAPS readout

Add-on board design AUXILIARY BOARD ADD-ON BOARD Fig. 6: Diagram of the add-on components

Add-on board design AUXILIARY BOARD ADD-ON BOARD Fig. 6: Diagram of the add-on components TRBv 2

Data processing • Correlated double sampling • Data compression • Threshold

Data processing • Correlated double sampling • Data compression • Threshold

Pipelining as data processing Fig. 7: Data processing way

Pipelining as data processing Fig. 7: Data processing way

Correlated double sampling by Self-Bias-Pixel ADC units Fig. 8: The behaviour of SB-pixels is

Correlated double sampling by Self-Bias-Pixel ADC units Fig. 8: The behaviour of SB-pixels is observed by frames. The constant current leakage in the capacitor threshold is compensate through a diode. After hit the diode re-fill the capacitor 1900 fx: px hit fx-1: px ∆ ADC readout cycle Fig. 9: Equivalent circuit diagram of SB-Pixel (fx: px - fx-1: px) threshold Fig. 10: After CDS clear hit identification is possible (fx-1: px - fx-2: px) acquisition cycle

Correlated double sampling and data compression Data compression Correlated double sampling: • for noise

Correlated double sampling and data compression Data compression Correlated double sampling: • for noise reduction • difference between the actual frame and the frame before Fig. 11: Different between the pixel by FIFO and SDRAM

Threshold The hit and the 8 neighbour pixel are important Result: not the complete

Threshold The hit and the 8 neighbour pixel are important Result: not the complete matrix is readout, only the hit with the neighbour pixel Fig. 12: Data selection with threshold

Project status • Board design (schematics) • Layout is advanced • Test the board

Project status • Board design (schematics) • Layout is advanced • Test the board hardware • Data processing concept • Data processing code (simulation)

THANK YOU

THANK YOU

Add-on board design Fig. 11: Add-on board

Add-on board design Fig. 11: Add-on board

Simulation of Self-Bias-Pixel readout

Simulation of Self-Bias-Pixel readout

Correlated double sampling by 3 T-Pixel fx: px ADC units Fig. 8: Equivalent circuit

Correlated double sampling by 3 T-Pixel fx: px ADC units Fig. 8: Equivalent circuit diagram hit fx-1: px readouto cycle Fig. 9: The behaviour of 3 T-pixels is observed by frames. The constant wastage is produced from the current leakage in the capacitor. Fig. 10: Past baseline the leakage current is cut out ∆ ADC (fx: px - fx-1: px) (fx-1: px - fx-2: px) cycle