LPKF Laser Direct Structuring System Speciality Products and

LPKF Laser Direct Structuring System Speciality Products and Services Group § Electrical functionalisation of non conductive 3 D Structures § Electrical tracks produced on 3 D structures allowing SMT assembly, die attach, wire bonding etc. Metallised Fingers for Robotic Hand LPKF – Laser Direct Structuring of 3 D devices.

LPKF Laser Direct Structuring System Tyndall Fabrication Process • 3 D Design and drawing. • 3 D part fabrication. • Conductive layer design and drawing. • Part Coating – Proto. Paint epoxy layer. • Laser Direct structuring as per design. • Copper plating • Post processing – Ni. Au plating, Flip chip bonding, SMT, wire bonding etc.

LPKF Laser Direct Structuring System Fabrication Principle

LPKF Laser Direct Structuring System 3 D Design • In-house 3 D design of parts • Autocad used to produce. step files which can be imported to LPKF system. • Autocad used to produce. dwg files for fabrication in mechanical workshop.

LPKF Laser Direct Structuring System 3 D Part Fabrication • In-house mechanical workshop fabrication from 3 D designs. • Parts fabricated from metals or plastic materials. • 3 D designs can be used to fabricate parts using standard 3 D printers

LPKF Laser Direct Structuring System Conductive layer design • Autocad produces. stp files with both the 3 D part and associated conductive layer. • LPKF system used. stp file to laser write the conductive layer on a Proto. Paint epoxy layer which is applied to 3 D part surface.

LPKF Laser Direct Structuring System Part Coating – Proto. Paint epoxy layer. • Spray coating of 3 D part surface. • Multiple layer build up to produce a smooth surface finish. • Low temperature oven bake to cure epoxy. • Coating on conductive and non conductive materials. • Possible materials include metals, plastics, glass, FR 4 etc.

LPKF Laser Direct Structuring System Laser Direct Structuring – Laser writing • LPKF system laser etches the conductor design in the top surface of the Proto. Paint epoxy. • The laser removes some of the epoxy material exposing metal particles in the Proto. Paint layer. • These metal particles can act as a seed layer for deposition of Cu layer.

LPKF Laser Direct Structuring System Laser Direct Structuring – Protopaint • Metal particles exposed by the laser • Copper, palladium, Chromium and Magnesium Seed Layer

LPKF Laser Direct Structuring System Copper plating • Electroless copper plating of seed layer exposed by laser etching of the Proto. Paint top surface. • Layer thickness is a time-temperature dependent build up of copper.

LPKF Laser Direct Structuring System Copper plating

LPKF Laser Direct Structuring System Copper plating • Test coupons used to check track resistance and isolation between tracks. • Different track and gap widths were designed to look at the effect of this on electrical measurements. • Typical track resistance of <1 ohm • Typical isolation of > 2 K ohm Part Type 200 µm TG 500 µm TG 100 µm TG 200 µm TG Plating Thickness 9 µm 5 µm 9 µm 6 µm 3 µm Track Resistance Ω 0. 8 0. 9 1. 0 0. 8 1. 0 0. 5 0. 6 1. 4 Fingers Resistance Ω Open Circuit >2000 Open Circuit >2000

LPKF Laser Direct Structuring System Post Processing - Solder • Copper plating provides a solderable finish • Allowing post process SMT assembly, solder flip chip etc. Solder ball Placement Element ID size x (um) size y (um) SIZE X (inch) SIZE Y (inch) Area 10 -4 (inch square) Mil-883 -J Requirement (Kg) Measured Shear Force (Kg) SMT 1 1200 500 0. 0472 0. 0197 9. 30 0. 37 3. 12 SMT 2 1200 500 0. 0472 0. 0197 9. 30 0. 37 2. 72 SMT 3 1200 500 0. 0472 0. 0197 9. 30 0. 37 4. 12 SMT 4 1200 500 0. 0472 0. 0197 9. 30 0. 37 3. 08

LPKF Laser Direct Structuring System Post Processing - Solder • Solderable finish allows for in house Laser Assisted Solder Jetting (SB²)

LPKF Laser Direct Structuring System Post Processing - Ni. Au Plating • Ni. Au Plating on the copper surface • Increased solderability • Wire bondable finish Bond No. (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) Strength (gf) 5. 35 6. 45 8. 30 4. 55 5. 90 5. 65 9. 10 4. 95 5. 15 6. 20 Military Standard (gf) 3. 00 3. 00

LPKF Laser Direct Structuring System Post Processing - Ni. Au Plating

LPKF Laser Direct Structuring System • Post Processing - Ni. Au Plating – Assisted Solder Jetting (SB²)

LPKF Laser Direct Structuring System Demonstrator 1 – Antenna on housing § Antenna fabricated directly on surface of 3 D printed component housing.

LPKF Laser Direct Structuring System Demonstrator 2 – Chemical Sensor PCB Equivalents § Flip chip over hole based micro electrode chemical sensor § 3 D substrate Demonstrator § Silicon based Micro electrode arrays. § Complete Design and Fabrication in Tyndall § Machined plastic substrate Silicon Sensor die

LPKF Laser Direct Structuring System Demonstrator 2 – Chemical Sensor Electrodes Protopaint application Laser Patterning Machined plastic substrate Copper plating Solder flip chip Underfill sealing of sensor

LPKF Laser Direct Structuring System Contact Information Ken Rodgers Phone: +353 21 2346898 Email: ken. rodgers@tyndall. ie Finbarr Waldron Phone: +353 21 2346093 Email: finbarr. waldron@tyndall. ie