Listing 823 GPONEPON the next generation of broadband
Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip
GPON on a Chip n GPON/EPON the next generation of broadband optoelectronics system on a chip n Optical networking. n Use of proven semiconductor fabrication technology to build a low cost, integrated electrical and optical system on the same IC chip (GPON).
Market n Primary market is manufacturing of electrical and/or optical network communication components. n This is a global opportunity as high-speed networks are being installed all over the world.
Market Growth n Significant global growth for the PON technology is predicted in the next five years. n Worldwide market for GPON electronics -- optical network terminals (ONTs) and optical line terminals (OLTs) -- will be worth $4. 7 billion in 2011, up from about $1. 3 billion this year.
Major players n Verizon n Ericsson AB n Alcatel-Lucent n France Telecom n Nokia Siemens Networks n Cisco n Intel n Packet. Front
Problem Solved by the Technology n Integration between optical and electronics-based systems by using a single device. n Today the connectivity is made through specially made couplers and components that have relatively higher losses, more expensive to manufacture, and are less reliable.
How the Technology Solves the Problem n A proven semiconductor manufacturing processes and methodologies, which are very precise, reliable, and at a lowest cost of manufacturing.
Technology Deployment n Delivered to the manufactures via systems and processes used by semiconductor manufacturing companies. n The products will be sold to the network content providers.
Competitive Advantage n Significant cost savings. n Lower cost resulting from fewer components.
Development Platform n Manufactured with semiconductor processing tools.
Development Status n Near prototype stage. n Optical coupler is ready for production, detectors and filters are off the shelf, the laser diode needs to be reconfigured, gratings on the silicon substrate need optimization.
Intellectual Property Ownership n The I. P. belongs to the seller, a large U. S. semiconductor manufacturing materials company. n There are no known liens or encumbrances.
Patent Status n U. S. Patents Pending: n 1. Patterning 3 -D Features in a Substrate. 2. Optical Coupling to IC Chip. n 3. Multiplexed Optical Sub-Assembly. n 4. Wafer Level Alignment of Optical Elements. n Patent information provided upon request.
Productization n The existing development team is in Silicon Valley, USA. n Some engineering resources would be required to complete the development. n The team and know-how are available from the U. S.
Deal Structure Sought n The deal structure envisaged is the sale of this technology asset. n Acquisition in 3 parts: n Initial acquisition. n Payment triggered when patents are issued. n Royalties on product sales n 3 -5% Royalties
Frequently Asked Questions And Answers n Why is the developer of this technology listing this technology? n Although the developer is a Fortune 500 company, it supplies semiconductor manufacturers and does not have existing channels to bring this product to market.
Follow Up n Please refer to Tynax listing number: 823 with regard to this opportunity. n Inquiries should be directed to: n Moshe Sarfaty n moshe. sarfaty@tynax. com
Thank You
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