KURSUS ELECTRONIC ASSEMBLIES SOLDERING TECHNIQUE By Mohd Farizul

KURSUS “ELECTRONIC ASSEMBLIES & SOLDERING TECHNIQUE” By Mohd Farizul Irni Bin Ismail

ACCEPTABILITY OF ELECTRONIC ASSEMBLIES • Introduction: IPC -A- 610 E – 2010 Acceptability of Electronic Assemblies CERTIFIED IPC APPLICATION SPECIALIST (CIS) Video link

OBJECTIVE • Upon completion of this course, the participant will be able to: 1) Understand demonstrate the procedures in electronic assemblies comply to the IPC –A-610 standard document 2) Understand about terms and conditions, 3) Handling considerations.

SCOPE 1) Terms , Condition and Handling Electronic Assemblies 2) Component Mounting 3) Soldering Acceptability Requirements

CLASSIFICATION • Classification in Electronic Assemblies: 1. CLASS 1: GENERAL ELECTRONIC PRODUCTS - Includes products suitable for applications where the major requirement is function of the completed assembly. 2. CLASS 2: DEDICATED SERVICE ELECTRONIC PRODUCTS -Includes products where continued performance and extended life is required. Typically the end-use environment would not cause failures. • CLASS 3: HIGH PERFORMANCE ELECTRONIC PRODUCTS -Includes products where continued high performance or performance-on-demand is critical, the equipment must function when required, such as life support or other critical systems.

ACCEPTANCE CRITERIA • Acceptance Criteria - ‘‘Requirements for Soldered Electrical and Electronic Assemblies’’: 1. TARGET CONDITION Close to perfect, may not be necessary to ensure reliability 2. ACCEPTABLE CONDITION Not necessary perfect, maintains the reliability of the assembly 3. DEFECT CONDITION May be insufficient to ensure form, fit or function Defect Class 1 implies a defect for Class 2 & 3, defect Class 2 implies a defect for Class 3 • PROCESS INDICATOR Does not fully meet the acceptance criteria nor is defect

PRINTED CIRCUIT BOARD (PCB) ORIENTATION • Terms and conditions: 1. Primary Side 2. Secondary Side 3. Solder Source Side 4. Solder Destination Side 5. Electrical Clearance

TERMS AND CONDITIONS 1. Primary Side Ø Contains the most complex or the most number of components

TERMS AND CONDITIONS 2. Secondary Side Ø The side opposite the primary side

TERMS AND CONDITIONS 3. Solder Source Side Ø The side to which solder is applied

TERMS AND CONDITIONS 4. Solder Destination Side Ø The side of the PCB that the solder flows toward in a through hole application

TERMS AND CONDITIONS 5. Electrical Clearance Ø the minimum spacing between non-common uninsulated conductors

HANDLING ELECTRONIC ASSEMBLIES 1. EOS/ESD PREVENTION 2. HANDLING CONSIDERATIONS

EOS/ESD PREVENTION What is EOS: Electrical Overstress (EOS) is the internal result of an unwanted application of electrical energy that results in damaged components. This damage can be from many different sources, such as electrically powered process equipment or ESD occurring during handling or processing.

Video link 1 Video link 2

EOS

EOS/ESD PREVENTION What is ESD? ESD: Electrostatic Discharge (ESD) is the rapid transfer of a static electric charge from one object to another of a different potential that was created from electrostatic sources. When an electrostatic charge is allowed to come in contact with or close to a sensitive component it can cause damage to the component.