January 2006 January 2006 doc IEEE 802 15

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January, 2006 January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003

January, 2006 January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Project: IEEE P 802. 15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results ] Date Submitted: [9 January, 2006] Source: [Brian Gaucher] Company [IBM Research] Address [1101 Kitchawan Ave Yorktown Heights, NY 10598] Voice: [914 -945 -2596], FAX: [914 -945 -4134], E-Mail: [[email protected] ibm. com] Re: [] Abstract: [Overview of Integrated 60 GHz Front End Chip Set and Test Results] Purpose: [Contribution for millimeter-wave study group ] Notice: This document has been prepared to assist the IEEE P 802. 15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P 802. 15. Submission 1 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Completely

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Completely Integrated 60 GHz ISM Band Front End Chip Set and Test Results IBM Research mm. Wave Design Team Submission 2 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Our

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Our Vision for Silicon mm. Wave ICs Discrete Ga. As 60 -GHz Radio Integrated Si. Ge 60 -GHz Radio Bring “mm. Wave to the masses” Submission 3 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c High-Speed

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c High-Speed Wireless Need Driven by Multiple Markets Low power, short range 100 -500 Mbps link • Consumer electronics – Replacement for 1394 Fire Wire and other cables • Potential for 150 M consumer electronic devices, such as TVs, home automation camera/camcorder, game consoles, music players etc. by 2009. • Streaming High Definition Video • Computer & peripherals – Replacement for USB, monitor cable, parallel ports and other cables – • Computer applications HD Video 1. 5 Gbps Potential for 100 M computers and peripherals by 2009. • Other application needs outside home – Healthcare, SOHO, industrial control, wireless sensor network, smartphones, last mile access, positioning & measurements (asset management), radar… Consumer electronic applications Submission 4 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Redefining

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Redefining Home Networks with mm. Wave Freedom to locate anywhere BS/CS/Digital Terrestrial Analog Signal Digitally Stored TV Program (Compressed) HD Uncompressed Digital Stream Internet Access Base Station on the ceiling & Backbone PC Multiple Data Streams Internet Digital Media Adaptor HDD Home Server / Router TV Monitor No penetration through walls (High Security) PC Ultra High-Speed Stream HD-DVD Player Camcorder Submission 5 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 -GHz Receiver in Si. Ge Bi. CMOS 8 HP BB Amp IF Mixer Input 59 -64 GHz 0. 4 G IF Amp Image-reject LNA 8. 8 G 9. 2 G 62 G I (0 - 500 MHz) ÷ 2 52. 8 G Q (0 - 500 MHz) x 3 17. 6 G PLL ÷ 32 Ref. CLK 0. 5 -0. 6 GHz PFD CP • • Integration Level 342 NPNs 1200 FETs 77 transmission lines 15 inductors 715 resistors 189 MIMs 53 pads LPF § Highest integration level for millimeter-wave circuits § Complexity approaching that seen at 5 GHz. Submission Size: 3. 4 x 1. 6 mm 2 6 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 -GHz Receiver: Measured Results Summary Target Meas. Power Gain (d. B) ~40 35 -40 Noise Figure (d. B) <6 5 -6. 5 Image Rejection (d. B) > 20 > 30 Phase Noise (d. Bc/Hz) -88, 1 M < -120 floor -85, 1 M < -130 floor i. CP 1 d. B (d. Bm) -31 -36 S 11, RF (d. B) < -15 I/Q f Balance (deg) +/- 2 4. 2 I/Q Amp Balance (d. B) <1 <1 Power Diss (m. W) -- 525 § First RF-to-baseband 60 G silicon receiver built, to our knowledge. § Receiver hits nearly all performance targets. § Achieves the highest integration level for mm. Wave. Submission 7 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 -GHz Transmitter in Si. Ge Bi. CMOS 8 HP IF Mixer PA Output 59 -64 GHz Image-reject Driver 0. 4 G IF Amp 8. 8 G 9. 2 G ÷ 2 62 G 52. 8 G Q (0 - 500 MHz) x 3 17. 6 G ÷ 32 PFD CP • • PLL Ref. CLK 0. 5 -0. 6 GHz I (0 - 500 MHz) LPF Integration Level 359 NPNs 1040 FETs 157 transmission lines 13 inductors 521 resistors 270 MIMs 60 pads § High integration level is unique for millimeter-wave. § Complexity approaching that seen in early commercial implementation at 5 GHz. Submission Size: 4 x 1. 5 mm 2 8 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 -GHz Transmitter Measured Results Summary Gain = 33 d. B Target Meas. 1 -d. B Compression (d. Bm) 10 10 -12 Saturated Pwr. (d. Bm) 15 16 -18 Conversion Gain (d. B) 45 34 -37 3 XLO Spur (d. Bm) < -25 Carrier Suppr. (d. B) 25 -30 >21 -25 Image Suppr. (d. B) >20 Power Consumption (at low power levels) -- 800 m. W Efficiency of PA 10% (50 -55 GHz) Psat = 16 d. Bm o. CP 1 d. B = +12 d. Bm ~25 (from cascaded driver-PA) § First 60 -GHz baseband-to-RF 60 G silicon transmitter built, to our knowledge. § Transmitter hits nearly all performance targets. § Again, highest integration level for mm. Wave. Submission 9 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Measured

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Measured Performance of Si. Ge Chip Set 60 -GHz Receiver Measurements 60 -GHz Transmitter Measurements Gain 35 -40 d. B Gain 34 -37 d. B Noise Figure 5 -6. 7 d. B P 1 d. B (out) 10 -12 d. Bm S 11, RF in -15 d. B Psat 16 -17 d. Bm Image Rejection > 30 d. B Image Rejection 20 -30 d. B P 1 d. B (in) -36 d. Bm PAE of PA 6 -10% IIP 3 -30 d. Bm Carrier Suppression 21 -25 d. B 3 x. LO leakage, RF in < -77 d. Bm at 52 -55 GHz 3 x. LO Spur -25 to -20 d. Bm Phase Noise (1 MHz), tripled -85 to -90 d. Bc/Hz < -130 d. Bc/Hz floor Phase Noise, (1 MHz) tripled -85 to -90 d. Bc/Hz < -130 d. Bc/Hz floor I/Q Balance 0 -4 degrees <1 d. B I/Q Balance ± 2 deg ± 0. 5 d. B Power Dissipation 195 m. A, 2. 7 V Power Dissipation 190 m. A, 2. 7 V 72 m. A, 4. 0 V Submission 10 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Chip-on-Board

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Chip-on-Board Package for TX/RX Chips Tx or Rx Chip Wire-Bond Antenna Flip-Chip encapsulate Folded Dipole Reflector ~ 8 mm • *World’s First Functional 60 GHz “Chip-on-board” Package! • All wire bonds • Standard FR 4 board Tx or Rx Board *More detail available under CDA Submission 11 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 GHz Radio Test System using Software Baseband Gen 1 Receiver IC* Image-reject LNA Input 59 -64 GHz 63 G Demodulation/Data Recovery BB Amp IF Mixer 0 G 9 G IF Amp ÷ 2 54 G 1 Gs/s VGA 8 b A/D I 9 G PC 8 b A/D x 3 in non real-time PCI A/D Card 18 G Tx. IC LPF CP PFD PLL Signal Generator ~500 MHz Gen 1 Transmitter IC* ÷ 32 18 G Tx. IC LPF Output 59 -64 GHz PA CP PFD PLL Modulation : DQPSK for 1 Gb/s Directional Antennas OFDM for 1 Gb/s Omni Antennas Data/Modulation Source BB Amp x 3 ÷ 2 Image-reject IF Amp Driver sample buffer and demodulates Q ÷ 32 PC captures I 12 b D/A Memory Buffer 12 b D/A IF Mixer *More detail available under CDA Submission Q 12 1 Gs/s ARB loops Real-time Modulation frame To radio B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c OFDM

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c OFDM Link Demonstration using 60 G Rx/Tx with Antennas 630 Mbps QPSK-OFDM 630 Mbps Received constellation 630 Mbps 60 -GHz OFDM Link 60 GHz Tx Module 60 GHz Rx Module PC A/D 7 d. Bi pk. gain ARB Antenna Gain (7 d. Bi) Pkg loss (-2 d. B) -69 d. Bm Channel Loss 10 m (-88 d. B) -67 d. Bm -74 d. Bm Antenna Gain (7 d. Bi) +14 d. Bm Pkg loss (-2 d. B) +7 d. Bm Tx +9 d. Bm 10 m reference separation Rx-Gain +35 d. B NF = 7 d. B I IQ Level Q -15 d. Bm k. TBF = -80 d. Bm (500 MHz BW) C/N = 11 d. B • Rx/Tx modules used with software radio with 700 Ms/s ADC. QPSK-OFDM modulation used. • Error-free operation demonstrated at 630 Mbps at 10 m. • Link budget corroborated, with 7 d. B NF, 10 d. Bm output power, 2 d. B package loss in Rx/Tx, 7 d. Bi antenna gain and 88 d. B path loss for 10 m. Submission 13 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c ASK

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c ASK Link Demonstration using 60 G Rx/Tx with Antennas 1 Gbps 60 -GHz ASK Link diff bipolar data I+ IQ- 60 GHz Tx with Antenna 60 GHz Rx with Antenna 1 m reference sep. IQ+ Q- Detector Σ Amp Q+ I+ Amp ARB Gen. Detector Measured eye-diagram of rectified I and Q at 1 Gbps, across 1 m wireless link • On-off keying (OOK) used to enable a simple modulation to be used without A/D converters. • Same 60 G Rx/Tx modules used, demonstrating good data eyes to 1 Gbps. • Rough setup with ARB and scope. Moving towards PRBS generator to drive bipolar encoder on Tx side, then will add clock and data recovery on the Rx side. This will allow true BER measurements to be made. , • This scheme addresses Multi Gb/s point to point links. • 8 d. Bi antennas suitable for proto-typing, but >10 m coverage will require waveguidelaunch modules with directional antennas. Submission 14 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c 60 -GHz Chipset Road Map Third Gen Eval Boards Second Gen Eval Boards First Gen Packaged Die Integration Functionality Eval Board Bare Die Receiver Transceiver Sept 2005 Aug, 2006 Bare Die Transmitter Receiver CMOS Building Blocks Individual Comp’ts Addresses: AM-OOK, FM-FSK Mod and Demod Transmitter LNA 2004 Submission LNA PA PA Feb. 2004 Individual Comp’ts Mar, 2006 Aug, 2005 2006 2005 15 2006 -2008 2007 B. Gaucher IBM Research

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Summary

January 2006 doc. : IEEE 802. 15 -15 -06 -0003 -00 -003 c Summary Low cost package 2 Q 06 • Fully integrated, “baseband-to-millimeter wave” Gbps Si. Ge radio chip sets are a reality • Si. Ge integration also makes possible the use of standard IC package solutions • Our Gen 1 chipset consists of a complete I/Q receiver and Chip on board-Today transmitter – Baseband to/from 60 GHz VCO/PLL, Filters, Mixers… – Capable of analog Up/Dn conversion or high-speed I/Q modulation • Gen 1 chips are currently: – Packaged on a PCB eval board and includes an integral 7 d. Bi antenna, capable of Gbps rates over 10 M, when drive by appropriate baseband. – For directional links, we also have a waveguide interface for the chips to be available in 2 Q 06. • Gen 2 chips are in test with eval boards expected in 2 Q 06. They will have both a PCB with integral antenna and waveguide interface. Waveguide Interface 2 Q 06 We gratefully acknowledge partial funding for this effort under DARPA contract N 66001 -05 -C-8013 Submission 16 B. Gaucher IBM Research