ITRS AMC Roadmap Project Plan AMC Integrated Concept

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ITRS AMC Roadmap Project Plan : AMC Integrated Concept ITRS / WECC /TWG AMC/crosscut

ITRS AMC Roadmap Project Plan : AMC Integrated Concept ITRS / WECC /TWG AMC/crosscut issue FI First proposal : Spring meeting April-2010 Follow up with FI May-26 -2010

Outline Changes/additions in Red Bold • Problem statement Current Situation. . problems, examples of

Outline Changes/additions in Red Bold • Problem statement Current Situation. . problems, examples of AMC issues exeprienced by waferfab • First assumptions from ITRS AMC • Project coordination with FI • Next steps Others: waste reduction matrix

AMC Integrated Concept

AMC Integrated Concept

Problem statement Foup could act as contamination reservoir and distributor for contamination ; Foup

Problem statement Foup could act as contamination reservoir and distributor for contamination ; Foup = Fab interface for: - AMHS Tools; loadports Minienvironment Wafer surfaces with different outgassing potential and interactions to other surfaces - Foup characterization and monitoring becomes more important New approach: Introduction of new foup materials (FM 4911) Lack of standards/methods for defining Foup – and Foup cross contamination (SEMI) - High costs for non standardized tests @ IDMs

Status and proposal for next steps Description of different interactions /interfaces between Foup and

Status and proposal for next steps Description of different interactions /interfaces between Foup and environment Defining of reliable monitoring methods for chemical compounds in regards to YE 7 table -Literature research; collecting most detrimental effects and compounds -Implementation of particle cleanliness requested ? Methods to be tested / proofed (eg. ISMI project ? ) Project coordination with FI; contribution of FI -First meeting held March-10 -2010 -Input received from FI- refer to meeting minutes from Patrick -Team formation

Goal Definition of interfaces and monitoring strategy in regards to Foup: -Introduction of acceptance

Goal Definition of interfaces and monitoring strategy in regards to Foup: -Introduction of acceptance criteria in ITRS table ( YE; YE 7) -Introduction of extra line for „Foup environment“ in ITRS table YE 7 Definition of Potential solutions and countermeasures-eg. : ( needs to be discussed with FI ) -Cleaning methods -Purging options -Degas chambers -Addressing development of improved Foup materials ( non-absorbing) Development first draft for method description; time line in dependency of discussion /outcome with FI

Define working group /Team Member WECC / AMC: Christoph Hocke- INFINEON Arnaud Favre –

Define working group /Team Member WECC / AMC: Christoph Hocke- INFINEON Arnaud Favre – ADIXEN Andreas Neuber – AMAT Michael Otto - FHG Astrid Gettel - Globalfoundries FI: Will follow soon i

First proposal: Description of Interactions: Foup < - > wafer A. Favre

First proposal: Description of Interactions: Foup < - > wafer A. Favre

First proposal: Description of Interactions: Foup < - > wafer A. Favre

First proposal: Description of Interactions: Foup < - > wafer A. Favre

First proposal: Description of Interactions: Cleanroom air -> Foup Proposal TWG AMC: Chr. Hocke/INF

First proposal: Description of Interactions: Cleanroom air -> Foup Proposal TWG AMC: Chr. Hocke/INF

First proposal: Description of Interactions: Cleanroom air -> Foup Proposal TWG AMC: Chr. Hocke/INF

First proposal: Description of Interactions: Cleanroom air -> Foup Proposal TWG AMC: Chr. Hocke/INF

First proposal: Description of Interactions: Cleanroom air <-> wafer inside Foup Proposal TWG AMC:

First proposal: Description of Interactions: Cleanroom air <-> wafer inside Foup Proposal TWG AMC: Chr. Hocke/INF

First proposal: Description of Interactions: Memory effects (based on Foup material) Proposal TWG AMC:

First proposal: Description of Interactions: Memory effects (based on Foup material) Proposal TWG AMC: Chr. Hocke/INF

Collection of measuring methods = f {compounds, wafer/or foup based etc…. } Proposal TWG

Collection of measuring methods = f {compounds, wafer/or foup based etc…. } Proposal TWG AMC: M. Otto/FHG

Input FI from first meeting 03/09/10

Input FI from first meeting 03/09/10

Input FI from first meeting 03/09/10

Input FI from first meeting 03/09/10

Input FI from first meeting 03/09/10 Get packet together to send to the wafer

Input FI from first meeting 03/09/10 Get packet together to send to the wafer fabs…. Get a list of waferfab…. to poll Get participation Get data Bottleneck…. get some university…neutral participation…. . …. get more inform from the ye group…. Next Steps: Arnaud, Christopoh, and Patrick…make an input to the pack… Next meeting 2 -3 weeks….

Backup

Backup

Project plan: AMC (Integrated) Concept Proposal TWG AMC: Interactions Contermeasures a) Fresh processed wafer

Project plan: AMC (Integrated) Concept Proposal TWG AMC: Interactions Contermeasures a) Fresh processed wafer <-> FOUP - outgassing fresh processed wafers -> degas chamber; tool supplier ; FI - Loadlock? Purge FI ambient cleanroom MENV/Filter Tool environment for processing wafer b) FOUP <-> wafer - fresh FOUP - as-used-FOUP - cleaned FOUP LP Carrier supplier : Deployment of nonabsorbing materials –no interactions wafer –carrier material c) FOUP <-> ambient Cleanroom FOUP d) ?

AMC Integrated Concept : Different interactions / interfaces

AMC Integrated Concept : Different interactions / interfaces

Project plan: AMC(Integrated) Concept v. good Focus area

Project plan: AMC(Integrated) Concept v. good Focus area

Next steps 2. Collection of different measuring methods = f - Chemical species in

Next steps 2. Collection of different measuring methods = f - Chemical species in acc. to YE 9 table - Online /offline method - Detection limit - Referring to Literature ……? ! Next steps: - Justification/Evaluation of methods - Concentration only on already known detrimental chemical compounds ( too much datas); needs to be defined