ITEP Panda PCB for prototype status report by

ITEP Panda PCB for prototype status report by D Malkevich on behalf of the ITEP group

ALICE TOF experience - module based on PCB - Minimal Radiation Length, => no cooling and cabling inside module - Module design based on multi layer PCB both for mechanical construction and signal routing - Signal transmission lines, HV and L. V. distribution “on board” PANDA prototype design : Strip consists of 8 th single cell DRPC chambers fixed at 6 layers PCB and merged into common gas volume. 6 gaps R=5*1012Ω 4 gaps R=1012Ω 4 gaps R=1011Ω 4 gaps R=5*1011Ω 4 gaps R=1010Ω 4 gaps R=5*1010Ω 6 gaps R=1010Ω

PCB design (Capture) HV, LV and test line TOTs, fast “OR” + Amplitude outputs Internal / External Threshold Test input Amplitude outputs Pre amplifier Main amplifier Amplitude buffers Discriminator TOT outputs We are going to do : Differential transmission lines quality Resistive coating optimization LV filter Resolution, efficiency, rate dependence, and streamer fraction HV filter using this prototype

PCB design (Layout) TOTs + Fast “OR” H. V. connector L. V. connectors Amplitude outputs External Threshold connector Test input Fast “OR” Discriminators AD 96687 Buffers AD 8056 Main amplifiers AD 8146 Test 50 Ohm line

Last updates • • Discriminator MAXIM 9600 changed to AD 96687. Just to have both amplifier and discriminator from one vendor. PCB Stack up parameters for structure with 200 Ohm differential lines preliminary estimated with respect to reality i. e. available materials of manufacture, compromise between possibility and prices. (We are still discussing with manufacture precision we can achieve)

Conclusion • 6 layers PCB for 8 th channels prototype was design in ORCAD. • PCB stackup design parameters for 200 Ohm differential lines preliminary estimated. Calculation based on real available materials for some manufacture. • Transmission lines quality test will be taken ASAP when PCB already done. Test results could give conclusion about signal transmission possibilities up to 1, 5 m (we want to produced PCB ASAP but we haven’t funding for the moment) • Schematic and PCB design for real size prototype will be make after confirmation final mechanical design. (PCB will be produced only after DIRC design will be fixed)