Introduction to Microelectronic Fabrication by Richard C Jaeger

Introduction to Microelectronic Fabrication by Richard C. Jaeger Distinguished University Professor ECE Department Auburn University Chapter 11 Processes for Micro. Electro. Mechanical Systems: MEMS © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Copyright Notice • © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. • For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1. © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS An Example Figure 11. 14 (a) SEM photograph of hinged structure raised with gear drive (b) Close up of the hinges (Courtesy of Sandia National Laboratories) © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Mechanical Properties of Materials © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Isotropic Etching • Isotropic etching (a) without and (b) with agitation © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Anisotropic Etching © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Microchannel Heat Sink © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Diaphram Formation Diaphrams formed by anisotropic backside etching of the silicon wafer (a) Si. O 2 layer/diaphram used as an etch stop (b) Buried Si. O 2 or p+ layer can be used as an etch stop to form thin diaphrams (c) Often used in pressure sensors © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Cantilever Beams and Released Structures © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Dissolved Wafer Process Silicon etch stops on p+ regions © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Silicon Etchants © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Reactive Ion Etching Spring Structure Formation © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Surface Micromachining Beam Formation • Silicon dioxide is etched from beneath polysilicon structures to form free standing and cantilever beams © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Sealed Cavity Formation © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Surface Micromachining Rotary Structures © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Surface Micromachining Rotary Structures © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Comb Drive and Resonant Beams © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Comb Drive and Resonant Beams • Resonant beams can be used in electrical filters and oscillators © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Hinge Formation © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Out-of-Plane Motion Figure 11. 14 (a) SEM photograph of hinged structure raised with gear drive (b) Close up of the hinges (Courtesy of Sandia National Laboratories) © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS LIGA Plating Process © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Reentrant Cavity Heat Sink © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

Electrostatic Bonding Glass-Silicon Bonding • Field assisted anodic bonding • Glass & metal bonding to silicon • Glasses – Corning 7740 & 7707 – Schott 8329 & 8330 – Iwaki 7570 © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

IC Process Compatibility Pre Processing - Sandia Process © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

IC Process Compatibility Post Processing - UC Berkeley Process Figure 11. 19 - CMOS electronics combined with postprocessed MEMS device. After J. M. Bustillo et al. , Ref. [30]. © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

IC Process Compatibility Merged Processes © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

IC Process Compatibility U. Michigan Merged Process © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS Early Use of Anisotropic Etching • VMOS transistor formation • V-groove isolation of bipolar transistors © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

MEMS References © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.

End of Chapter 11 © 2002 Pearson Education, Inc. , Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN 0 -201 -44494 -1.