Introduction To DMT 243 ELECTRONIC PACKAGING Mohd Sallehudin

Introduction To DMT 243 ELECTRONIC PACKAGING Mohd Sallehudin Bin

LECTURER / TECHNICIAN EN. MOHD. SALLEHUDIN BIN SAAD sallehudin@unimap. edu. my +6012 -3736158 EN. BAHARI BIN MAN bahari@unimap. edu. my +6012 -5776871

SYNOPSIS This course exposes students to the electronics packaging process flow and the statistical analysis method to control the packaging process. It covers all about microsystems packaging, the roles of packaging in microelectronics, general semiconductor process flow, interconnection in IC assembly, fundamental design for reliability and quantitative analysis.

COURSE OUTCOMES At the END of the course students will have : § Able to explain the semiconductor packaging process flow. (CO 1). § Able to evaluate the critical parameters in semiconductor packaging process. (CO 2). § Able to develop technology trend in semiconductor packaging. (CO 3).

LEARNING APPROACH TOTAL LEARNING HOURS • 54 hours in 14 weeks. § Lecturer • 30 hours : ( 2 hours + 1 hour per session ) once per week. § Practical & tutorial • 24 hours : ( 2 hours per session ) once per week. § Attendance at all session are COMPULSORY.

TIMETABLES LECTURER : § MONDAY : 4. 00 PM – 6. 00 PM ( 2 hours session ) : (BK 3, BLOK S 3) LABORATORIES / TUTORIALS : MMFA LAB, BLOK 8, PAUH PUTRA. § GROUP 1 (G 1) : THURSDAY : 12. 00 PM – 2. 00 PM ( 2 session ) § GROUP 2 (G 2) : WEDNESDAY : 10. 00 AM – 12. 00 PM ( 2 session ) § GROUP 3 (G 3) : WEDNESDAY : 2. 00 PM – 4. 00 PM ( 2 session ) hours

EVALUATION CONTRIBUTION § Final examination : 50% • (April 2018) § Mid Term Examination 1 : 10% • (January 2018) § End Term Examination 2 : 10% • (March 2018) § Course work : 30% • Labs : 10% • Quiz/Assignment/PBL : 20%

COURSE CONTENTS § § § Chapter 1 : Introduction to Microsystems Packaging. Chapter 2 : The Role of Packaging in Microelectronics. Chapter 3 : General Semiconductor Packaging Process Flow. § Chapter 4 : Interconnection in IC Assembly. § Chapter 5 : Fundamental Design for Reliability. § Chapter 6 : Quantitative Analysis.

LAB MODULE § § Lab 1 : Decapsulation. Lab 2 : Die preparation. Lab 3 : Wirebonding. Lab 4 : Wirebond pull test. § Lab group : 4 -5 person each GROUP. § Lab submission : 1 week after lab session.

LABORATORIES SESSION § MAKMAL ANALISIS KEGAGALAN DAN KEBOLEHARAN ( MMFA ) § LOCATION : MMFA, Pauh Putra. § CAPACITY : 15 – 20 person per session. § LAB STATION : 4 – 5 person per session. § SESSION : 2 hours per session. § LIST OF EQUIPMENT : • Wirebonder. • Diamond Scriber. • Wirebond Pull Tester. • Automatic Decapsulation System. • Low/High Power Microscope.

LABORATORIES FACILITIES § MAKMAL ANALISIS KEGAGALAN DAN KEBOLEHARAN ( MMFA )

LABORATORIES FACILITIES Wirebonder Diamond Scriber Wirebond Pull Tester

LABORATORIES FACILITIES High Power Microscope Decapsulation System

REFERENCES § Rao Tummala. (2001). Fundamentals of Microsystem Packaging. Mc-Graw Hill Professional. § William D. Brown (Editor). (1999). Advanced Electronic Packaging with Emphasis on Multichip Modules. New York : IEEE Press Series on Microelectronics Systems. The Institute of Electrical and Electronics Engineers Inc. § Glenn R. Blackweel. (2000). The Electronic Packaging Handbook. Florida U. S : CRC Press LLC. § M. Datta, T. Osaka, J. W Schultze (Editor). (2005). Microelectronic Packaging. Florida U. S : CRC Press, § Website : www. semiconfareast. com

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