Intels Next Generation Mobile Platform CPM Intels Next

Intel’s Next Generation Mobile Platform 양철훈 CPM

Intel’s Next Generation Mobile Platform Q 2’ 2004 Q 1’ 2005 Q 1’ 2006 Intel® Pentium® M Processor Banias FSB 400 MHz Intel® Pentium® M Processor Dothan FSB 533 MHz Next Generation Mobile CPU Yonah Dual-Core Processor FSB 667 MHz Intel® 855 Chipset Family Mobile Intel® 915 Express Chipset Family Next Generation Mobile Chipset Calistoga Intel® PRO/Wireless 2200 B Network Connection Intel® PRO/Wireless 2200 BG Network Connection Intel® PRO/Wireless 2915 ABG Network Connection Next Generation Wireless LAN 3945 ABG Q 1’ 2003 Processor Chipset Wireless Carmel Refresh Napa Sonoma Napa is Intel’s Next Generation Mobile Platform 2 *Other names and brands may be claimed as the property of others. All dates, plans and features are preliminary and subject to change without notice.

Napa: Platform Overview Dual Core Processor Supporting Higher FSB 667 Yonah Dual Core CRT TV Yonah FSB 667 MHz LVDS Flat Panel DDRII SO-DIMM Calistoga Suppo rting Intel® PRO/ Wirele ss 3945 A BG WLAN Discrete Gfx Golan WLAN Gb. E PCIE- x 16 MHz Yonah Generation 3. 5 Intel Internal Graphics Core DDR II 667 MHz DMI x 4 x 1 2 Ports x 1 1 Port 6 PCIE Ports x 1 Express. Card x 1 docking x 2 ICH 7 M PATA Azalia / AC 97 SPI Flash LPC TPM 1. 2 8 ports LPC PCI Bus SIO/EC ICH 7 M Reduced Voltage: 1. 05 V 802. 11 Mini. PCI Card Intel Gb Ethernet w/AMT * Other names and brands may be claimed as the property of others New features enhancing next-generation Mobile platform 3 Intel may make specifications, product descriptions, and plans may at any without notice. All plans, dates, and features are preliminary andchanges subject totochange without notice. *Other names and brands betime, claimed as the property of others

Napa Platform – Improvements from Sonoma Platform Sonoma Napa CPU Pentium M Single Core Yonah Dual Core FSB 533 MHz 667 MHz Wireless 2915 ABG Mini. PCI form factor 3945 ABG Mini. Card form factor Memory Tech. DDR 2 400/533 MHz DDR 2 533/667 MHz Chipset Alviso & ICH 6 -M Calistoga & ICH 7 -M I/O Expresscard based on USB/PCI Express ODD PATA SATA Ethernet Integrated 10/100 based on PC 1 e Integrated 10/100/1 G Based on PCIe Audio Intel® High Definition Audio 70 -80% Faster 50% Lighter 25% more throughput Up to 90% higher graphics performance Build Momentum on Key Napa Platform Features 4 All plans, dates, and features are preliminary and subject to change without notice. *Other names and brands may be claimed as the property of others

Yonah Features Highlights Intel® Smart Cache • Shared L 2 enables access to full cache size when only one core is active Intel® Advanced Thermal Manager • Digital Temperature Sensors • Hardware Thermal Monitor • Shared L 2 saves power by reducing cache coherency complexity Intel® Dynamic Power Coordination Coordinated Intel® Speed. Step™ (P-State) transitions in HW to efficiently manage voltage and frequency to match the performance required by an application. Intel® Digital Media Boost • New Enhanced SIMD Streaming • Extensions (SSE 3) • Floating Point Performance Enhancement 5 All plans, dates, and features are preliminary and subject to change without notice. *Other names and brands may be claimed as the property of others

Yonah Dual-Core: A Revolution in Mobile Performance Compute Intensive Performance: The SPEC* CPU 2000 benchmark suite measures component level performance on compute-intensive integer and floating-point throughput workloads. For the SPEC rate, TWO copies of the benchmarks are run simultaneously to measure throughput of the processor while executing multiple tasks. INTEGER PERFORMANCE FLOATING POINT PERFORMANCE 2. 0 1. 8 1. 6 1. 4 Up to 1. 89 x 1. 2 Up to 1. 96 x 1. 4 1. 2 1. 0 0. 8 0. 6 0. 4 0. 2 0 0 SPECint_rate 2000 Intel® Pentium® M 765 Processor (2. 1 GHz, FSB 400 MHz), Intel® 855 GM SPECfp_rate 2000 Intel® Pentium® M 780 Processor (2. 26 GHz, FSB 533 MHz), Intel® 915 GM Yonah Dual-Core Processor (A-1 2. 16 GHz, FSB 667 MHz), Intel® 945 GM Yonah Dual-Core Enables Outstanding Performance for Parallel Execution of Multiple Intense Applications Note System Configuration Details in Backup Performance tests and ratings are high-confidence projections using measurements at multiple lower frequencies using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. 6 *Other names and brands may be claimed as the property of others. All dates, plans and features are preliminary and subject to change without notice.

Yonah Dual-Core vs. Yonah Single Core INTEGER PERFORMANCE 2. 0 1. 8 1. 6 1. 4 1. 2 1. 0 0. 8 0. 6 0. 4 0. 2 0 1. 76 x FLOATING POINT PERFORMANCE OFFICE PRODUCTIVITY & INTERNET CONTENT CREATION 1. 4 1. 2 SPECint_rate 2000 1. 0 0. 8 2. 0 1. 8 1. 6 1. 4 1. 2 1. 0 0. 8 0. 6 0. 4 0. 2 0 1. 54 x SPECfp_rate 2000 1. 30 x 0. 6 0. 4 0. 2 0 SYSmark*04 – Overall Score Yonah Single Core Processor (A-1, 1. 66 GHz, FSB 667 MHz) Yonah Dual-Core Processor (A-1 1. 66 GHz, FSB 667 MHz) Yonah Dual-Core Delivers Increased Performance at the Same Frequency Note System Configuration Details in Backup Performance tests and ratings are high-confidence projections using measurements at multiple lower frequencies using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. 7 *Other names and brands may be claimed as the property of others. All dates, plans and features are preliminary and subject to change without notice.

Mobile Intel® 945 GM: The Next Generation Mobile Integrated Graphics Chipset High Quality Graphics Performance: The Future. Mark 3 Dmark*05 & 3 DMark*03 benchmarks combine the latest Direct. X* 9. 0 support with unique and updated high quality game, image & sound tests and graphics. 3 DMark 05 & 3 DMark 03 are premium benchmarks for evaluating the latest generation of 3 D graphics hardware 1. 6 1. 4 1. 2 1. 0 0. 8 0. 6 0. 4 1. 36 x 3 DMark 05 – Overall Score 2 x 0. 2 0 3 DMark 03 – Overall Score Mobile Intel® 915 GM Express Chipset B-1 (1. 05 v, 1 GB, DDR 2 -533, 200 MHz Int. Gfx. ) 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 1. 8 2. 0 Mobile Intel® 945 GM Express Chipset A-1 (1. 05 v, 1 GB, DDR 2 -667, 250 MHz Int. Gfx. ) Exceptional 3 D Graphics Performance for Corporate and Consumer Notebooks Note System Configuration & 3 DMark 05* Details in Backup Performance tests and ratings are high-confidence measurements using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. 8 *Other names and brands may be claimed as the property of others. All dates, plans and features are preliminary and subject to change without notice.

Intel® Centrino™ Mobile Technology Napa CMT Component Average Power & TDP Targets Component Sonoma Average Power 2 Napa Average Power Target 1 CPU 1. 1 W 3 1. 1 - 1. 35 W 3, 7 Chipset GM: < 1. 5 W PM: 0. 8 W GM: 1. 3 - 1. 5 W PM: 0. 8 - 1. 0 W ICHx-M < 1. 5 W 5 0. 9 - 1. 1 W 4 WLAN < 0. 135 W 6 0. 1 - 0. 12 W 6 Total CMT Components < 4. 2 W 3. 4 - 4. 07 W Component Napa TDP Target Yonah Dual-Core 31 W Yonah Single Core 27 W Yonah Low Volt 15 W ICH 7 -M GM: 7. 5 – 8. 0 W PM: 6. 5 – 7. 0 W 1. 9 W 3945 ABG 1. 7 W Calistoga 1 - Napa Average Power Targets Under Mobile. Mark* 2002 workload 2 - Sonoma Average Power production guidance under Mobile. Mark* 2002 workload 3 - Assumes top-bin, median leakage, Adaptive mode 4 - Assumes 250 m. W are saved by Intel Matrix Storage Driver with SATA HDD 5 - Does not include reverse bridge chip. Assumes native SATA drive connected. SATA to PATA reverse bridge chip adds ~300 mw incremental power 6 - Idle associated, PSP mode (Connected but no data is being transferred) 7 - Yonah Single Core & Yonah Low Voltage Average Power in same range as Yonah Dual-Core On Target to Achieve Average Power & TDP Targets All on Napa CMT Components Note System Configurations in Backup 9 *Other names and brands may be claimed as the property of others. All dates, plans and features are preliminary and subject to change without notice.

Thinner and Lighter with the 3945 ABG Discrete Components Calexico 2 abg (~300 components) Half the size of Mini PCI – More functionality in less space – Smaller form factor platforms Support for modern high speed bus protocols CX 1/CX 2 integration learnings incorporated to Silicon Significant reduction in discrete components Building Blocks 3945 ABG (~90 Components) 10 All plans, dates, and features are preliminary and subject to change without notice. *Other names and brands may be claimed as the property of others

Platform Interchangeability ODMs Hitachi Global Fujitsu Seagate Katama Napa Designs Panasonic QSI Lite-On CMO, AUO CPT, QDI Simplo Celxpert Dynapack Suppliers Value Proposition • Ingredient Flexibility • Improved Availability • Economies of Scale Distributors INTEL CONFIDENTIAL - For Internal Use Only *Other names and brands may be claimed as the property of others. 11

Intel Interchangeability Initiative (phase 1) Participating suppliers: – 13 ingredient suppliers – 33 ingredient SKUs being verified Hitachi Global Fujitsu Seagate Hard Drives Panasonic QSI Lite-On Optical Drives CMO, AUO CPT, QDI Displays Simplo Celxpert Dynapack Battery Packs INTEL CONFIDENTIAL - For Internal Use Only *Other names and brands may be claimed as the property of others. 12

10’ Local and Extended Usage Models learn more about 10’ UI ‘Enjoy from the comfort of your couch*’ is a key Intel® Viiv™ technology value proposition *Not marketing messaging 10’ Local = 10’ Extended = PC directly connected to monitor, TV and/or audio system. DMA connected to monitor, TV and/or audio system via home network Marketing focus at launch will be weighted toward 10’ Local experiences * Other names and brands may be claimed as the property of others Intel confidential

The Intel® Viiv™ Technology Program Intel Viiv Technology PCs Connected Devices Services & Apps Performance Easy Connected

Service Oriented Enterprise Vision Enterprise Data Center Service Providers Internet Digital Cities Digital Homes Factory / Warehouse Sen sors , & te es pu m age ss ce Co r ro ws ed Sto s P flo liz & es rk a rk in Wo irtu two V e N s Bu Digital Office Mobile Workforce Ou ts ou rc ed , S Da upp ta lie Ce r, nt an er d s Cu st om er Digital Offices (SMB) Mobile Consumers & Workforces SOA (Service-Oriented Architecture) SOI (Service-Oriented Infrastructure) Intel® Technology HT, VT, LT, i. AMT, DC, MC, EM 64 T • •