Intelligent Systems Group ISG Platform Roadmap WW 03

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Intelligent Systems Group (ISG) Platform Roadmap WW 03 2012 ISG Channel and Business Operations

Intelligent Systems Group (ISG) Platform Roadmap WW 03 2012 ISG Channel and Business Operations January 2012 Expires WW 07’ 2012 1 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

Legal Disclaimer Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or

Legal Disclaimer Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. The Intel products) referred to in this document is intended for standard commercial use only. Customer are solely responsible for assessing the suitability of the product for use in particular applications. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel® products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http: //www. intel. com/performance/resources/limits. htm or call (U. S. ) 1 -800 -628 -8686 or 1 -916 -356 -3104. All information provided related to future Intel products and plans is preliminary and subject to change at any time, without notice. All dates provided are subject to change without notice. Intel may make changes to specifications and product descriptions at any time, without notice. Celeron, Intel logo, Intel Core, Intel Inside logo, Intel. Leap ahead. logo, Intel Net. Burst, Intel Speed. Step, Intel XScale, Itanium, Pentium Inside, VTune, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Other vendors are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Copyright © 2009, Intel Corporation. All rights reserved. 2 INTEL CONFIDENTIAL

ISG Roadmap Key Messages General • Added Q 1 2013 and dropped Q 4

ISG Roadmap Key Messages General • Added Q 1 2013 and dropped Q 4 2011 from roadmap horizon. CID-Performance Roadmap • Updated Launch Timing for Crystal Forest platforms to Q 2 2012 PSD-Scalable Roadmap • Updated IVB SKUs PSD-Low Power Roadmap • Updated IVB SKUs CSD Roadmap • TBD ISG Software Enabling Roadmap • TBD 3 INTEL CONFIDENTIAL

Communications Infrastructure Division 4 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

Communications Infrastructure Division 4 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

ISG-CID Roadmap Strategy: Key Features Focus on Communications Maximum Performance Density, Top-to-Bottom • Featuring

ISG-CID Roadmap Strategy: Key Features Focus on Communications Maximum Performance Density, Top-to-Bottom • Featuring multi-core Embedded Intel Xeon processors for communications • Industry leading performance • Multi-socket, high I/O bandwidth, high memory capacity & data integrity Bladed (DP & UP) - Intel® Xeon® Processors Dense Segment - Intel® Core™ Processors • Solutions for AMC, compact PCI & Dense applications • Exceptional value, unmatched performance density • Multi-Core, highly integrated, fully featured chipsets • Data integrity, balance I/O and memory bandwidth Ultra-Dense – EP 80579 & Intel® Atom™ Processors • High volume, general purpose compute & communication • Accelerated packet and powerful security processing • Power & space efficiency, deeply embedded • Low Power IA 5 INTEL CONFIDENTIAL P ower • Multi-core Embedded Intel Xeon processors for DP &UP blade • Multi-core Intel® Core. TM processors for UP blade • Industry leading performance and performance / watt • DP and UP, high I/O bandwidth, high data integrity Performance Full Performance - Intel® Xeon® Processors

ISG-CID Performance Platforms Roadmap Q 1’ 12 Q 2’ 12 Q 3’ 12 Q

ISG-CID Performance Platforms Roadmap Q 1’ 12 Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1‘ 13 Full Performance DP/UP Computing Romley – Intel® C 600 Series Chipset (Patsburg-B) Intel® Xeon® processor E 5 -2600/2400 product family (Sandy Bridge-EP/EN) Crystal Forest Server – Cave Creek Chipset (Q 2 ‘ 12) Intel® Xeon® processor E 5 -2600/2400 product family (Sandy Bridge-EP/EN) Bladed Computing Romley – Intel® C 600 Series Chipset (Patsburg-B) Intel® Xeon® processor E 5 -2600 L/2400 L product family (LV Sandy Bridge-EP/EN) Crystal Forest Server – Cave Creek Chipset (Q 2 ‘ 12) Intel® Xeon® processor E 5 -2600 L/2400 L product family (LV Sandy Bridge-EP/EN) Dense Computing Eagle Heights – Intel® 3100 Chipset Crystal Forest Gladden – Cave Creek Chipset (Q 2 ‘ 12) Sandy Bridge Gladden processor Picket Post - Jasper Forest Processor* Ultra Dense - EP 80579 (Tolapai) 6 INTEL CONFIDENTIAL Sandy Bridge Gladden processor (Q 2 ‘ 12) * Nehalem Based, Quad-Core / Dual Core/ Single Core, DDR 3 memory, Intel® Turbo. Boost Technology, Intel® VT, Intel® Quick. Path interconnect, Intel® Hyper-Threading Technology, Lead and halogen free 2

CID Performance and Bladed Processor & Chipset Roadmap Q 1 ’ 12 Q 2

CID Performance and Bladed Processor & Chipset Roadmap Q 1 ’ 12 Q 2 ’ 12 Q 3 ’ 12 Q 4 ’ 12 Q 1 ’ 13 Xeon® E 5 -2658 (8 C, 95 W, 2. 1 GHz) Xeon® E 5 -2620 (6 C, 95 W, 2. 0 GHz) Processors DP Performance (8 C, 6 C, 4 C, 2 C) Xeon® EC 5549 Xeon® EC 5509 DP Bladed (8 C, 6 C, 4 C, 2 C) UP Bladed 4 C/2 C/1 C Xeon® E 5 -2430 (6 C, 95 W, 2. 2 GHz) Xeon® EC 5539 Xeon® E 5 -2648 L (8 C, 70 W, 1. 8 GHz) Xeon® LC 5528 Xeon® LC 5518 Xeon® EC 3539 (QC) Xeon® LC 3528 (DC) Xeon® LC 3518 (SC) Xeon® E 5 -2448 L (8 C, 70 W, 1. 8 GHz) Xeon® E 5 -2428 L (6 C, 60 W, 1. 8 GHz) Xeon® E 5 -2418 L (4 C, 50 W, 2. 0 GHz) Sandy Bridge - Gladden UP Dense Value Celeron® P 1053 (SC) SOC EP 80579 (Tolapai) Jasper Forest Processors Chipsets Patsburg - B Performance, Bladed and Dense Computing 7 INTEL CONFIDENTIAL 3420 Cave Creek Sandy Bridge Processors

CID Embedded IA Roadmap Processor Reference Table Performance WW 3 Updated (vs. prior NDA

CID Embedded IA Roadmap Processor Reference Table Performance WW 3 Updated (vs. prior NDA roadmap cycle) 8 INTEL CONFIDENTIAL

Crystal Forest Reference Boards Crystal Forest Server Reference - Shumway Crystal Forest Gladden Reference

Crystal Forest Reference Boards Crystal Forest Server Reference - Shumway Crystal Forest Gladden Reference - Stargo 9 INTEL CONFIDENTIAL

Crystal Forest Proof of Concept Developments LAD Gb. E QANIC Proof of Concept Cave

Crystal Forest Proof of Concept Developments LAD Gb. E QANIC Proof of Concept Cave Creek Plug In Card(CPIC) Test Vehicle x 16 PCIe ATCA 40 Gbps Crystal Forest Server Proof of Concept AMC Gladden Proof of Concept 10 INTEL CONFIDENTIAL

Romley EP CRB – Rose City Overview • Romley EP CRB • Platform designed

Romley EP CRB – Rose City Overview • Romley EP CRB • Platform designed to provide Sandy Bridge EP & Patsburg evaluation Status Update: • Current Boards Shipping • Access DCL & Rose City Users Guide for latest status and customer documentation • Initial Shipments socketed to allow updates of Sandy Bridge and Patsburg Si updates 1 11 INTEL CONFIDENTIAL

Romley EN CRB – Harbor City Overview • Romley EN CRB • Platform designed

Romley EN CRB – Harbor City Overview • Romley EN CRB • Platform designed to provide Sandy Bridge EN & Patsburg evaluation Status Update: • Current Boards Shipping • Access DCL & Harbor City Users Guide for latest status and customer documentation • Initial Shipments socketed to allow updates of Sandy Bridge and Patsburg Si updates 1 12 INTEL CONFIDENTIAL

CID Software Roadmap 1 H-2011 Networking Software System Software/ Libraries Tools Intel® Architecture Platform

CID Software Roadmap 1 H-2011 Networking Software System Software/ Libraries Tools Intel® Architecture Platform Level 13 INTEL CONFIDENTIAL 2 H-2011 6 WINDGate* on Intel® DPDK Wind River* NAP 3. 0 Early Access Release POCs : 3 G RNC (RNL Pipeline), 6 WINDGate™ IPSec Acceleration using AES-NI and Intel® DPDK, Wind River* NAP 1. 1 IPSec Acceleration on Crystal Forest Intel® DPDK - Early Access Release R 1. 0 Intel® Signal Processing Development Kit (Intel® SPDK) – Early Access Release Vx. Works* 6. 9 Intel® Performance Primitives 7. 0 Code. Sourcery* GCC version 4. 5. x JTAG on-chip debuggers from: Wind River*, Arium* Green Hills* - Atom only: Macraigor*, Lauterbach ICC 12. 0, & IPPsfor Wind River* Vx. Works 6. 9 ICC 12. 0, IPPs & VTune for Wind River* Linux 4. x Westmere ISA: AES-NI, GFMULT Sandy Bridge ISA: AVX Barton Hills: RSS, VMDq, DCA Niantic: RSS, VMDq. DCA, RSC, Flow Director Intel® Quick. Assist Integrated Accelerator 1 H-2012 Wind River* NAP 3. 0 GA (on Crystal Forest) 6 WINDGate* on Intel® DPDK with IPSec Accel. Wind River* NAP 3. 0 on Intel® DPDK with IPSec Accel. POCs : 3 G RNC, 6 WINDGate™ with Intel® DPDK + Intel® Quick. Assist, Wind River NAP 3. 0 with Intel® DPDK + Intel® Quick. Assist Technology Intel® DPDK R 1. 1 Intel® SPDK – Early Access Release Intel® Performance Primitives 7. x Vx. Works* 6. 9. 1 Wind River* Linux* 4. 2 Wind River* Hypervisor 1. 3. 1 Code. Sourcery GCC version 4. 6. x Intel tools plug into Wind. River* On. Chip Debugger Westmere ISA: AES-NI, GFMULT Sandy Bridge ISA: AVX Barton Hills: RSS, VMDq, DCA Niantic: RSS, VMDq. DCA, RSC, Flow Director Intel® Quick. Assist Integrated Accelerator

Jasper Forest Software OS Windows Server 2003 64 -bit Windows Server 2008 64 -bit

Jasper Forest Software OS Windows Server 2003 64 -bit Windows Server 2008 64 -bit • INF available from Intel Linux (Red Hat* Enterprise Linux) • Please work with your OSV for schedule alignment • Jasper Forest specific patches pushed to open source Wind River Vx. Works* Wind River Linux* • Enabled and supported by Wind River*Systems BIOS IBVs enabled: AMI*, Phoenix*, Insyde* and Byosoft* • Please work with your IBV for schedule alignment Jasper Forest specific software 14 Non-transparent Bridging (NTB) • EA drivers available from platformsw. intel. com Crystal Beach 3 DMA, DCA • EA drivers available from platformsw. intel. com INTEL CONFIDENTIAL

Intel O/S Validation Matrix for Romley Platforms (As of April, 2010) Intel® Xeon® processor

Intel O/S Validation Matrix for Romley Platforms (As of April, 2010) Intel® Xeon® processor E 5 -4600/2400 product families 4 S/2 S Server PCH: Intel® C 600 series chipset (Patsburg B/D/T) 1 S/2 S Workstatio n Memory: UDIMM w/wo ECC, RDIMM, LV, RAS: ECC, Scrubbing, Sparing, Scrambling, Mirroring, Poisoning, Lockstep mode OS: Microsoft Server 2008 R 2 Enterprise (x 64) Microsoft Server 2008 Enterprise (x 32 and x 64) Red Hat Enterprise Linux Server* (x 32 and x 64) SUSE Linux Enterprise Server* (x 32 and x 64) Memory: UDIMM w/wo ECC, RDIMM, LV, RAS: ECC, Scrubbing, Sparing, Scrambling, Mirroring, Poisoning, Lockstep mode, OS: Microsoft Windows 7 SP 1 (x 32 and x 64) Windows Vista SP 2 (x 32 and x 64) Red Hat Enterprise Linux Desktop* (x 32 and x 64) SUSE Linux Enterprise Desktop* (x 32 and x 64) Socket-R PCH: Intel® C 600 series chipset (Patsburg D) IMPORTANT NOTE (PLEASE READ): • The listing of an operating system (OS) in the table indicates only that it is being used by Intel for Romley platform validation. The listing of an OS in the table does not imply Intel has completed Romley platform validation with it, or that the platform has full support from the OS supplier. • Please contact your OS suppliers or check their web sites on latest and future OS support for the Romley platform. • Intel is not validating or certifying OS’s for the Romley platform and related silicon. Customers are responsible for certification of operating systems for their platforms. They may validate additional operating systems and/or platform features that are not validated by Intel and claim support on their platforms. • Intel® Xeon® E 5 -4600 -based platforms (Romley EP 4 S) are validated by Intel only in NUMA configurations. 15 INTEL CONFIDENTIAL

Intel Virtualization Validation Matrix for Romley Platforms (As of October, 2010) Intel® Xeon® processor

Intel Virtualization Validation Matrix for Romley Platforms (As of October, 2010) Intel® Xeon® processor E 5 -4600/2400 product families 4 S/2 S/1 S Server VMware ESX 4. 1, 4. 1 update 1 beta, 4. 0 update 2 Microsoft Windows Server 2008, R 2 Xen 3. 3/3. 4/3. 5 Linux KVM (RHEL 6) Microsoft Azure (Parallels Server†) 1 S/2 S Workstatio n Microsoft Windows Server 2008, R 2 Xen 3. 3/3. 4/3. 5 Linux KVM (RHEL 6) VMware Workstation 7 (Parallels Workstation†) IMPORTANT NOTE (PLEASE READ): • The listing of an Virtual Machine Monitor (VMM) in the table indicates only that it is being used by Intel for Romley platform validation. The listing of an VMM in the table does not imply Intel has completed Romley platform validation with it, or that the platform has full support from the VMM supplier. Our validation goal is NOT to certify or validate the software. • Please contact your VMM suppliers or check their web sites on latest and future VMM support for the Romley platform. • Intel is not validating or certifying VMM’s for the Romley platform and related silicon. Customers are responsible for certification of operating systems for their platforms. They may validate additional VMMs and/or platform features that are not validated by Intel and claim support on their platforms. †Stretch goals 16 INTEL CONFIDENTIAL

Crystal Forest-Server : Platform Overview Processor Core ü Sandy Bridge Core (32 nm) [Next

Crystal Forest-Server : Platform Overview Processor Core ü Sandy Bridge Core (32 nm) [Next Intel TOCK] ü Integrated PCI-E Gen 3: Up to 40/24 PCIe lanes (EP/EN) ü Integrated Memory Controller ü Planning EP and EN CPUs with a range of core counts (4/6/8) ü Planning CPUs with a range TDPs and Thermal Profiles (High Tcase) ü Simultaneous multi threading (2 threads/core) ü Crystal Beach DMA Platform Features ü Extended Product Support ü Intel ® Quick. Assist Technology ü Technologies: AES-NI, TXT-SX, AVX ü Intel® Virtualization technology ü ECG unique CPUs ü One of two EP or EN sockets supported ü 2 Chip solution (CPU + Chipset) ü RAS: Reliability, Availability and Serviceability: I/O, Memory, System RAS ü Memory : UDIMM & RDIMM & LV Schedule EA Samples 2 H’ 10 -1 H’ 11 Packages ü Socket R 45 x 52. 5 mm LGA 2011 ü Socket B 2 42 x 45 mm LGA 1356 ü PCH 27 x 27 mm FCBGA 17 INTEL CONFIDENTIAL

Crystal Forest-Server : Cave Creek chipset Product Options Multiple Acceleration Performance Options ü Range

Crystal Forest-Server : Cave Creek chipset Product Options Multiple Acceleration Performance Options ü Range of Performance SKUs w Intel® Quick. Assist & Virtualization Technologies PCIe x 8/x 16 Gen 2 Ethernet MACs -10/1000 x 4 ü SGMII/Serdes Interface ü IEEE 1588/802. 3 as Time Stamp/Link ü IEEE 802. 1 p/q support ü IEEE 802. 1 ae Link. Sec/MACSec support ü Intel® I/O Acceleration Technology – MSI-X, DCA, RSS, VMDq, – 8 Tx/Rx Queues (per port) – Low Latency Interrupt Intel® Quick. Assist Technology PCIe Gen 1 1 x 4, 2 x 2. 4 x 1 Intel® Quick. Assist Technology PHY PCIe Gen 1 Root LPC & SPI INTEL CONFIDENTIAL PHY x 4 Gb. E MAC SMBus 18 PHY x 2 UART Target TDP: 5 -10 w options PHY x 50 GPIO ü x 4 DMI 2. 0 ü PCIe Gen 2 Endpoint (Processor connect x 8/x 16) ü PCIe Gen 1 Root (External 1 x 4, 2 x 2, 4 x 1) ü x 6 USB 2. 0, x 2 SATA 2. 0, x 50 GPIO ü x 2 UART, SMBus, LPC, SPI (Boot Interface) Cave Creek PCH x 2 SATA I/O PCIe Gen 2 Endpt x 6 USB ü Security - Up to 10 Gbps Bulk Encrypt/Decrypt – Bulk: AES, 3 DES, (A)RC 4 – Hash: MD 5, SHA-1/2, HMAC – Wireless: Kasumi & SNOW 3 G – Public Key – RSA, DSA, – DH Internal TRNG + p. CRC ü Compression/Decompression – Deflate/LZS ü Reg. Ex/Pattern Match x 4 DMI Gen 2 Timers WDT RTC HPET Package ü FCBGA -27 mm x 27 mm @ 0. 7 mm Variable Pitch OS Enabled Drivers ü MAC, PCIe, USB, SATA, - Linux, Free. BSD, Vx. Works, Windows ü Intel® Quick. Assist Technology Software Driver - Linux, Free. BSD, Vx. Works Sample Libraries ü Intel Data Plane SDK

Romley : Platform Overview Processor Core ü Sandy Bridge Core (32 nm) [Next Intel

Romley : Platform Overview Processor Core ü Sandy Bridge Core (32 nm) [Next Intel TOCK] ü Integrated PCI-E Gen 3: Up to 40/24 PCIe lanes (EP/EN) ü Integrated Memory Controller ü Planning EP and EN CPUs with a range of core counts (4/6/8) ü Planning CPUs with a range TDPs and Thermal Profiles (High Tcase) ü Simultaneous multi threading (2 threads/core) ü Crystal Beach DMA Platform Features ü Extended Product Support ü Technologies: AES-NI, TXT-SX, AVX ü Intel® Virtualization technology ü ECG unique CPUs ü One of two EP or EN sockets supported ü 2 Chip solution (CPU + Chipset) ü RAS: Reliability, Availability and Serviceability: I/O, Memory, System RAS ü Memory : UDIMM & RDIMM & LV Schedule EA Samples 2 H’ 10 Packages ü Socket R 45 x 52. 5 mm LGA 2011 ü Socket B 2 42 x 45 mm LGA 1356 ü PCH 27 x 27 mm FCBGA 19 INTEL CONFIDENTIAL

Romley : Patsburg-B chipset Sandy. Bridge EP/EN Features Patsburg-B Gb. E 1 USB 2.

Romley : Patsburg-B chipset Sandy. Bridge EP/EN Features Patsburg-B Gb. E 1 USB 2. 0 14 Extra Chipset PCIe CPU connect x 8 Gen 2 x 4 DMI Gen 2 AHCI – SATA 2 ports (3 Gb/s) 4 AHCI – SATA 3 ports (6 Gb/s) 2 SCU ports (6 Gb/s) x 4 DMI Gen 2 14 x 2. 0 4 x 3 G 2 x 6 G SM Bus 2. 0 GPIO SPI Flash Patsburg-B PCH 27 x 27 mm 4 (SAS/SATA) LPC I/F SM Bus Yes TPM 1. 2 GPIO Yes Super. I/O JTAG Yes PCI 20 INTEL CONFIDENTIAL LANPHY LAN 1 x. Gb. E x 8 PCIe Gen 2

Crystal Forest-Gladden Platform Overview Processor ü Sandy Bridge Core (32 nm) ü Single, Dual

Crystal Forest-Gladden Platform Overview Processor ü Sandy Bridge Core (32 nm) ü Single, Dual & Quad Core Options ü “Gladden” BGA – 1 mm Ball Pitch ü Simultaneous multi threading (2 threads/core) 4 C, 2 C, 1 C Options Platform Features ü Integrated Memory Controller ü Integrated PCI-E ü Integrated 4 x 1 Gb. E MAC(PCH) ü Integrated Intel® Quick. Assist Technology w/Crypto, Compression, Reg. Ex ü 10 year reliability ü Technologies: AES-NI, TXT-SX, AVX, VT-x, d, c Memory ü Up to 2 Channels Native DDR 3, ECC ü Single/Dual Rank + 2 DIMM’s per channel ü Up to 32 GB Memory support ü Memory Down, SO DIMM, UDIMM SNB Gladden x 16 PCie Gen 2 x 4 PCie Gen 2 (Total of 20 PCie Gen 2) x 4 DMI Cave Creek x 4 Gb. E MAC Intel® Quick. Assist Technology PCH I/O Schedule : Samples 1 Q’ 11, Production 1 H’ 12 Package üGladden – Comm’s ECG Package 37. 5 x 37. 5 mm BGA – 1. 016 mm Ball Pitch üCave Creek 27 x 27 mm FCBGA Intel® Quick. Assist Technology Security, Pattern Match, Reg. Ex, Compression 4 x 1 Gb. E MAC, PCI-E Gen 1: 1 x 4, 2 x 2, 4 x 1 *Highlighting the key differences V standard Sandy Bridge BGA 21 INTEL CONFIDENTIAL

ISG Intel® Core™ Processor Platform Roadmap 22 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

ISG Intel® Core™ Processor Platform Roadmap 22 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

2012 Platform Overview Ivy Bridge 23 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

2012 Platform Overview Ivy Bridge 23 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

Key Milestones of Platform Innovation 32 nm Process Technology Westmere Sandy Bridge Intel Microarchitecture

Key Milestones of Platform Innovation 32 nm Process Technology Westmere Sandy Bridge Intel Microarchitecture (Nehalem) Intel Microarchitecture (Sandy Bridge) TICK TOCK 2010 2011 22 nm Process Technology Ivy Bridge Intel Microarchitecture (Sandy Bridge) TICK 2012 IVB Processor & Graphics Haswell Intel Microarchitecture (Haswell) TOCK 2013 Panther Point PCH 82579 LM Gb. E (Lewisville ) Wifi chip 24 First 2 chip solution First monolithic integrated graphics Intel® Core™ Processors Intel® 2 nd Generation Core™ Processors INTEL CONFIDENTIAL Introduction of Trigate transistors Intel® 3 rd Generation Core™ Processors uncompromised performance/watt

3 rd Generation Intel® Core™ Processors Value Proposition Smart Performance Faster, Smarter, More Efficient

3 rd Generation Intel® Core™ Processors Value Proposition Smart Performance Faster, Smarter, More Efficient Performance Made possible by revolutionary Tri-Gate transistor technology, 22 nm process technology as well as through Intel® Turbo Boost and Intel® Hyper Threading Technologies Rich media, immersive visuals, more displays Built-in Visuals Delivered by 3 independent display capability, improved media processing performance Vs. Sandy Bridge, smoother visuals with 3060% 3 D performance increase, support for latest graphics APIs (DX 11, Open. GL 3. 1 & Open. CL 1. 1) Scalable designs, flexible for embedded applications Versatile Enabled by rich package selection with top-to-bottom product scalability, drop-in compatibility with Sandy Bridge processors and dynamic thermal configurability Security & Manageability 25 INTEL CONFIDENTIAL Cost Saving through Manageability and Improved Security Remote management through flexible Setup and Configurations, diagnosis and repair regardless of OS health. Better immunity from malware attacks with hardware integrated encryption features.

What’s New Under the Cap…… Intel® 3 rd Generation Core Processor 22 nm /

What’s New Under the Cap…… Intel® 3 rd Generation Core Processor 22 nm / 3 -D Transistor Better peformance at same TDP or lower Fastest I/O • PCIe 3. 0* / USB 3. 0 • Up to 4 controllers Memory Interface DDR 3 -1600 and DDR 3 L-1333* for high bandwidth data transfer with lower latency Graphics / Media • • Cross Compatibility 3 independent displays ~30 -60% 3 D performance increase Up to ~2 x media improvement processing Support of latest graphics API Socket and pin compatible with Intel® 2 nd Gen Core Processors enables faster TTM, reduce design costs. All new technologies * Certain Skus only 26 INTEL CONFIDENTIAL • Responsiveness • Security • Manageability

2012 Chief River Platform Highlights Up to 26%1 IA improvement with Intel® Turbo Boost

2012 Chief River Platform Highlights Up to 26%1 IA improvement with Intel® Turbo Boost and Intel® Hyper Threading 3 rd Gen Intel® Core™ Processor (Ivy Bridge) DDR 3 or DDR 3 L Intel® HD Graphics Up to 2 x 1 Media improvements with Intel® Quick Sync Video 2. 0 PCIe* Graphic s Next Gen high speed I/O with USB 3. 0 30 -60%1 faster Intel® FDI DMI Platform responsiveness with Intel® Smart Connect Intel® Rapid Start Intel Smart Response 1 Enhanced Security & Manageability with Intel® 7 Series Chipset Family (Panther Point) Performance data is based on projections. Actual performance may vary with actual silicon and by system configuration 27 INTEL CONFIDENTIAL Graphics and support for DX-11 *Other names and brands may be claimed as the property of others. Intel® AMT 8 Intel® OS Guard Intel® Secure Key

2011 vs. 2012 Platform Comparison Sandy Bridge 2011 Ivy Bridge 2012 Processor 2 nd

2011 vs. 2012 Platform Comparison Sandy Bridge 2011 Ivy Bridge 2012 Processor 2 nd Generation Intel® Core™ Processor (codenamed Sandy Bridge) 4+2, 4+1, 2+2, 2+1 Ivy Bridge 4+2, 4+1, 2+2, 2+1 Chipset (Platform Controller Hub) Intel® 6 Series Chipset (Cougar Point) Intel® 7 Series Chipset (Panther Point) Cache Up to 8 MB PCI Express* 16 PCIe 2. 0 (5 GT/s) - 1 x 16 3 controllers (additional 1 X 4 PCIe 2. 0 – only on QC PGA & WS Skus) 16 PCIe 3. 0 (8 GT/s) (i 5/i 7 ONLY) - 1 x 16 Up to 4 controllers (additional 1 X 4 PCIe 2. 0 – only on QC PGA; all WS Skus when paired with C 216 chipset) ECC Memory Support No (embedded PGA skus) Yes (embedded BGA skus and WS platform) No (embedded PGA skus) Yes (embedded BGA skus and WSPlatform) Memory Controller Integrated 2 channel DDR 3, up to 1333 MHz Integrated 2 DIMM per channel DDR 3, up to 1600 MHz Integrated 2 DIMM per channel DDR 3 L Up to 1333 MHz (PGA only 1. 5 V) Integrated 1 DIMM per channel DDR 3 L Up to 1600 MHz (DC PGA, QC/DC BGA 1. 35 V) Graphics/Display In-Tru 3 D™, Intel® Quick Sync Video, Intel® Clear Video HD Technology, Gfx APIs - DX 10. 1 2 independent displays e. DP In-Tru 3 D™, Intel® Quick Sync Video 2. 0 , Intel® Clear Video HD Technology Gfx APIs - DX 11, OCL 1. 1, OGL 3. 1 3 independent displays e. DP USB 2. 0 & 3. 0 Not POR Puma Peak, Taylor Peak Wifi 28 INTEL CONFIDENTIAL Note: There is no change in thermal solutions from 2 nd Generation Intel® Core™ processor-based platform. † Subjected to change *Other names and brands may be claimed as the property of others.

2011 vs 2012 Intelligent Systems Platform Comparison (Technologies) Huron River/Sugar Bay/ Chief River/Maho Bay/

2011 vs 2012 Intelligent Systems Platform Comparison (Technologies) Huron River/Sugar Bay/ Chief River/Maho Bay/ Bromolow Carlow Intel® Hyper-Threading Technology Intel® Turbo Boost Technology 2. 0 Intel® Smart Cache Technology with LLC sharing between CPU and Gfx cores Technologies Responsive Intel® Rapid Start Technology Intel® Smart Response Technology Intel® Smart Connect Security Manageability Intel® Trusted Execution Technology Intel® OS Guard 1 Intel® Secure Key 2 Intel® Active Management Technology 7. 0 Intel® Active Management Technology 8. 0 * Pending POR Note 1: Not all features available on all SKU’s 29 INTEL CONFIDENTIAL Intel® Hyper-Threading Technology Intel® Turbo Boost Technology 2. 0 Intel® Smart Cache Technology with LLC sharing between CPU and Gfx cores Power Aware Interrupt Routing (PAIR) 1. 2. Formerly known as SMEP – Supervisory Mode Execution Protection Formerly Known as DRNG or Blue Mountain

Cross Generation Compatibility Customize the platform (pair processor and chipset) to optimally meet the

Cross Generation Compatibility Customize the platform (pair processor and chipset) to optimally meet the performance needs of the end user applications, applicable to all Sandy Bridge and Ivy Bridge Scalable and Low Power Platforms 4 possible configurations 1 CPU Chipset Sandy Bridge Ivy Bridge CPT PPT CPT 2011 Cougar Point (Series 6) PCH 2012 Panther Point (Series 7) PCH BENEFITS: §Ramp products faster by minimizing re-design effort §Choice of a wider array of Processor SKU offerings over two generations 30 INTEL CONFIDENTIAL *Will require FW & BIOS Update, see details in the Sandy Bridge - Ivy Bridge Platform Cross-compatibility Design Guide (467265) **Will require design considerations, see detail in the Sandy Bridge - Ivy Bridge Platform Cross-compatibility Guide - Part 2 (473307) ***Cougar Point Chipsets Supported: - Scalable: Q 65, B 65, C 206 - Low Power: QM 67, HM 65

ISG-Intel® Core® Processor Roadmap 31 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

ISG-Intel® Core® Processor Roadmap 31 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

Scalable & Low Power Product Line Capabilities 32 Usages Capabilities Intel® v. Pro™ Technology

Scalable & Low Power Product Line Capabilities 32 Usages Capabilities Intel® v. Pro™ Technology Enabled Computing • Easily manage your assets using Intel® Active Management Technology • Enable multiple machine partitions with Intel® Virtualization Technology • Improve platform security using Intel® Trusted Execution Technology Media Intensive Computing • Stunning 3 D graphics and video unleashed by Intel® HD Graphics • Performance when you need it with Intel® Turbo Boost Technology and enhanced Dynamic Frequency • Display more content using independent displays • Significant performance improvement for floating point intensive applications I/O Intensive Computing • Protect against memory errors with Error Correction Code (ECC) • Maximum I/O flexibility & Speed with PCIe Gen 3, SATA 3. 0, USB 3. 0 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor & Chipset Roadmap Processors Premium Performance Q 1’ 12 Q 2’

ISG-PSD Scalable Processor & Chipset Roadmap Processors Premium Performance Q 1’ 12 Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 Intel® Xeon® E 3 -1275 v 2 (95 W) Intel® Xeon® E 3 -1225 v 2 (95 W) Intel® Xeon® E 3 -1275 (95 W) Intel® Xeon® E 3 -1225 (95 W) i 7 Xeon Intel® Core™ i 7 -3770 (95 W) i 7, i 5, Xeon i 5 I 5 -3550 S (65 W) Mainstream Performance i 3 Intel® Core™ i 3 -3220 (65 W) Intel® Core™ i 3 -2120 (65 W) Value Intel® Pentium® G 2120 (65 W) Intel® Pentium® G 850 (65 W) Pentium, Celeron Pentium Intel® Celeron® G 540 (65 W) TBD Chipsets Intel® v. Pro™ Technology Enabled Computing Media, Signal and Image Processing I/O Intensive Computing Basic Sandy Bridge 33 INTEL CONFIDENTIAL Intel® Q 67 Express Chipset / Intel® C 206 Chipset Intel® Q 77 Express Chipset / Intel® C 216 Chipset Intel® C 206 Chipset Intel® C 216 Chipset Intel® B 65 / H 61 Express Chipset Intel® B 75 Express Chipset Ivy Bridge

ISG-PSD Scalable Processor Roadmap Intel® v. Pro™ Technology Enabled Computing Q 1’ 12 Extreme

ISG-PSD Scalable Processor Roadmap Intel® v. Pro™ Technology Enabled Computing Q 1’ 12 Extreme Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 Intel® v. Pro™ Technology Enabled Computing Xeon i 7 Best Quad-Core Performance Xeon i 5 Better LGA E 3 -1275 v 2 E 3 -1275 v 2 i 7 -3770 i 7 -3770 E 3 -1225 v 2 E 3 -1225 v 2 i 5 -3550 S i 5 -3550 S LGA Power Optimized Performance 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 34 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor Roadmap Media, Signal and Image Processing Q 1’ 12 Extreme Q

ISG-PSD Scalable Processor Roadmap Media, Signal and Image Processing Q 1’ 12 Extreme Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 Media, Signal and Image Processing LGA+ECC E 3 -1275 Xeon i 7 E 3 -1275 v 2 i 7 -3770 E 3 -1225 v 2 i 5 -3550 S i 3 -2120 i 3 -3220 LGA Quad-Core Performance Best i 7 -3770 LGA+ECC Xeon i 5 Power Optimized Performance Power Better Optimized Performance i 3 E 3 -1225 LGA i 5 -3550 S LGA+ECC i 3 -2120 Good Power Optimized Performance 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 35 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor Roadmap I/O Intensive Computing Q 1’ 12 Extreme LGA+ECC Xeon E

ISG-PSD Scalable Processor Roadmap I/O Intensive Computing Q 1’ 12 Extreme LGA+ECC Xeon E 3 -1275 Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 E 3 -1275 v 2 I/O Intensive Computing E 3 -1275 v 2 E 3 -1225 v 2 Best Xeon LGA+ECC E 3 -1225 v 2 i 3 -3220 Better LGA+ECC i 3 -2120 i 3 -3220 Good Power Optimized Performance 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 36 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor Roadmap Basic Q 1’ 12 Pentium Celeron Q 2’ 12 Q

ISG-PSD Scalable Processor Roadmap Basic Q 1’ 12 Pentium Celeron Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 LGA G 850 G 2120 G 540 TBD LGA Basic 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 37 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor & Chipset Roadmap Processors Premium Performance i 7 i 5

ISG-PSD Low Power Processor & Chipset Roadmap Processors Premium Performance i 7 i 5 Q 1’ 12 Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 LV Intel® Core™ i 7 -2655 LE (25 W) Intel® Core™ i 7 - 3555 LE (25 W) ULV Intel® Core™ i 7 -2610 UE (17 W) Intel® Core™ i 7 - 3517 UE (17 W) Intel® Core™ i 5 -2510 E (35 W) Intel® Core™ i 5 -2515 E (35 W) Intel® Core™ i 5 -3610 ME (35 W) Intel® Core™ i 3 -2310 E (35 W) Intel® Core™ i 3 -3120 ME (35 W) SV Essential Performance Mainstream Performance SV i 3 Intel® Core™ i 3 -2330 E (35 W) ULV Value Celeron Intel® Core™ i 7 - 3610 QE (45 W) Intel® Core™ i 7 -3615 QE (45 W), Intel® Core™ i 7 -3612 QE (35 W) SV Intel® Core™ i 3 -3217 UE (17 W) Intel® Core™ i 3 -2340 UE (17 W) SV ULV Intel® Celeron® B 810 (35 W) TBD Intel® Celeron® B 810 E (35 W) TBD Intel® Celeron® 847 E (17 W) TBD Intel® Celeron® 827 E (17 W) Intel® Celeron® 807 UE (10 W) Chipsets TBD Red Font = BGA Package + ECC Intel® v. Pro™ Technology Enabled Computing Media, Signal and Image Processing, Mobile Intel® QM 67 Express Chipset Mobile Intel® QM 77 Express Chipset I/O Intensive Computing Mobile Intel® HM 76 Express Chipset Basic 38 INTEL CONFIDENTIAL Sandy Bridge Ivy Bridge

ISG-PSD Low Power Processor Roadmap Intel® v. Pro™ Technology Enabled Computing Q 1’ 12

ISG-PSD Low Power Processor Roadmap Intel® v. Pro™ Technology Enabled Computing Q 1’ 12 Extreme Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 Intel® v. Pro™ Technology Enabled Computing BGA+ECC i 7 -3615 QE i 7 -3615 QE i 7 -3612 QE i 7 -3612 QE i 7 -3610 QE i 7 -2655 LE i 7 -3555 LE i 7 -2610 UE i 7 -3517 UE i 5 -2510 E i 5 -3610 ME i 5 -2515 E i 5 -3610 ME i 3 -2330 E i 3 -3120 ME i 7 PGA Quad-Core Performance Best i 7 -3610 QE BGA+ECC i 7 i 5 Power Optimized Performance Power Better Optimized Performance i 5 i 3 Power Optimized Performance Good PGA i 5 -2510 E BGA+ECC i 5 -2515 E PGA i 3 -2330 E 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 39 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor Roadmap Media, Signal and Image Processing Q 1’ 12 Extreme

ISG-PSD Low Power Processor Roadmap Media, Signal and Image Processing Q 1’ 12 Extreme Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1’ 13 Media, Signal and Image Processing BGA+ECC i 7 -3615 QE i 7 -3615 QE i 7 -3612 QE i 7 -3612 QE i 7 -3610 QE i 7 -3610 QE PGA Quad-Core Performance Best BGA+ECC i 7 Power i 5 Optimized Performance Power Better Optimized Performance i 7 i 5 Power Optimized Performance Good i 7 -2655 LE i 7 -3555 LE i 7 -2610 UE i 7 -3517 UE i 5 -2510 E i 5 -3610 ME i 5 -2515 E i 5 -3610 ME i 3 -2330 E i 3 -3120 ME PGA i 5 -2510 E BGA+ECC i 5 -2515 E PGA i 3 -2330 E 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 40 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor Roadmap I/O Intensive Computing Q 1’ 12 Extreme BGA+ECC i

ISG-PSD Low Power Processor Roadmap I/O Intensive Computing Q 1’ 12 Extreme BGA+ECC i 7 Q 3’ 12 Q 4’ 12 Q 1’ 13 I/O Intensive Computing i 7 -3615 QE i 7 -3612 QE i 7 -2655 LE i 7 -2610 UE i 7 -3615 QE i 7 -3612 QE i 7 -3555 LE i 7 -3610 QE i 7 -3610 QE i 5 -2515 E i 5 -3610 ME i 5 -2510 E i 5 -3610 ME i 3 -2310 E i 3 -3120 ME i 3 -2340 UE i 3 -3217 UE i 3 -2330 E i 3 -3120 ME PGA Quad-Core Performance Q 2’ 12 Best BGA+ECC i 5 -2515 E i 5 Power Optimized Performance Power Optimized Better Performance i 3 Power Optimized Performance PGA i 5 -2510 E BGA+ECC PGA Good i 3 -2330 E 32 nm ‘Sandy Bridge’-based processors (Sandy Bridge/Huron River) 22 nm ‘Ivy Bridge’-based processors (Ivy Bridge/Chief River) Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 41 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor Roadmap Basic Q 2’ 12 Q 3’ 12 B 810

ISG-PSD Low Power Processor Roadmap Basic Q 2’ 12 Q 3’ 12 B 810 E 847 E Q 4’ 12 Q 1’ 13 B 810 E 847 E 827 E 827 E 807 UE (10 W) 807 UE (10 W) B 810 Q 1’ 12 BGA Celeron PGA Basic B 810 32 nm ‘Sandy Bridge’-based (Sandy Bridge/Huron River) *See feature tables for more details on Max Graphics Dynamic Frequency Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance. 42 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor Reference Table WW 3 43 INTEL CONFIDENTIAL

ISG-PSD Scalable Processor Reference Table WW 3 43 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor Reference Table WW 3 44 INTEL CONFIDENTIAL

ISG-PSD Low Power Processor Reference Table WW 3 44 INTEL CONFIDENTIAL

ISG-PSD Scalable Chipset/Processor Matrix WW 3 C – Compatible: CPU and chipset can be

ISG-PSD Scalable Chipset/Processor Matrix WW 3 C – Compatible: CPU and chipset can be paired together, validation done by owning division on windows environment, but not on all the embedded OS systems. Embedded software is by platform, please check embedded software roadmap. V – Validated: CPU and chipset can be paired together, validation done on all the embedded OS systems. Embedded software is by platform, please check embedded software roadmap. 45 INTEL CONFIDENTIAL

ISG-PSD Low Power Chipset/Processor Matrix WW 3 V – Validated: CPU and chipset can

ISG-PSD Low Power Chipset/Processor Matrix WW 3 V – Validated: CPU and chipset can be paired together, validation done on all the embedded OS systems. Embedded software is by platform, please check embedded software roadmap. 46 INTEL CONFIDENTIAL

ISG-PSD Platforms 47 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

ISG-PSD Platforms 47 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

Ivy Bridge Scalable Platform Overview Processor Quad Core Processor with Intel® HD Graphics 4000

Ivy Bridge Scalable Platform Overview Processor Quad Core Processor with Intel® HD Graphics 4000 and Integrated Memory Controller (Calow) Quad Core Processor with Intel® HD Graphics 4000 and Integrated Memory Controller (Maho Bay) • • • Quad/Dual processing with Intel® Hyper. Threading Technology (2 threads per core) Integration of high performance Intel® HD Graphics 2500/4000 w/ 3 independent displays Support for DDR 3 and DDR 3 L 1600/1333 Advanced Encryption Standard (AES)** ECC memory support** Carlow 2/4 Core 4/8 T PCI Express* Graphics 2 CH DDR 3: 1333/1600 2 CH DDR 3 L : 1333** Maho Bay 2/4 Core 4/8 T HDMI/DVI/ DP DMI 5 GT/s Display Ports HDMI/DVI/Display. Port* /SDVO Intel® High Definition Audio Integrated or Discrete Graphics 6 SATA Ports Intel® C 216 Chipset & Intel® Q 77/ B 75 Express Chipset 4 PCI Bus Masters 14 Hi-Speed USB 3. 0 Ports PCI Express Gen 3. 0 1 x 16** LPC or SPI Gb. E LAN PHY, Wi. Fi BIOS Support Platform Controller Hub (PCH) Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA Additional USB, PCIe*, and SATA ports Enhanced Manageability features: Carlow Platform Intel® Xeon® E 3 -1275 v 2 CPU Intel® Xeon® E 3 -1225 v 2 Intel® Core™ i 3 -3220 Intel® Core™ i 7 -3770 Intel® Core™ i 5 -3550 S Intel® Core™ i 3 -3220 Intel® Pentium® G 2120 • Intel® Active Management Technology 8. 0 TDP 65 W/95 W • Intel® Trusted Execution Technology ECC Yes No PCIe 3. 0** Intel® C 216 Chipset Intel® Q 77/B 75 Express Chipset CPU I/O PCH *Other names and brands may be claimed as the property of others. 48 Maho Bay Platform INTEL CONFIDENTIAL ** Certain features are available on select SKUs only. See configuration tables for details

Ivy Bridge Low Power Platform Overview Processor • Quad/Dual Core Processor with Intel® HD

Ivy Bridge Low Power Platform Overview Processor • Quad/Dual Core Processor with Intel® HD Graphics 4000 and Integrated Memory Controller • Integration of Intel® HD Graphics w/ 3 independent displays • Support for DDR 3 and DDR 3 L 1600/1333* • Advanced Encryption Standard (AES)** • ECC memory support** Platform Controller Hub (PCH) • Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA • Additional USB, PCIe*, and SATA ports • Enhanced Manageability features: PCI Express* x 16 Graphics (Embedded Display Port (e. DP)** Or PCIe Graphics x 16 Huron River 2/4 Core Or 2 x 8 I/O (2. 5 GT/s) 4/8 Threads Intel® Flex Display Interface Processor or Discrete Graphics SATA Display Interfaces 3 Ports – Can Mix: Display. Port*/DVI/HDMI/SVDO Intel® High Definition Audio Mobile Intel® QM 77, HM 76 Express Chipsets PCH PCI Bus Masters USB 3. 0 Ports SPI PCI Express Gen 3. 0 1 x 16** BIOS Support Gb. E LAN PHY, Wi. Fi Chief River Platform • Intel® Trusted Execution Technology • Enhanced Security features r. PGA: Intel® Core™ i 7 -3610 QE, i 5 -3610 ME , i 3 -2120 ME CPU TDP ECC CPU I/O Port Bifurcation PCH BGA: Intel® Core™ i 7 -3615 QE, i 7 -3612 QE, i 7 -3555 LE, i 7 -3517 UE, i 5 -3610 ME, i 3 -3120 ME, i 3 -3217 UE r. PGA: SV (45 W/35 W) BGA : SV (45 W/35 W), LV(25 W), ULV (17 W) Yes (BGA Pkg Only) PCIe 2. 0** & PCIe 3. 0** Intel® QM 77/HM 76 Express Chipsets *Other names and brands may be claimed as the property of others. INTEL CONFIDENTIAL DMI 2 CH DDR 3: 1333/1600 2 CH DDR 3 L : 1333** VGA & LVDS • Intel® Active Management Technology 8. 0 49 Chief River+ECC Processors** e. DP ** Certain features are available on select SKUs only. See configuration tables for details

Sandy Bridge Scalable Platform Overview Processor • Quad Core Processor with Intel® HD Graphics

Sandy Bridge Scalable Platform Overview Processor • Quad Core Processor with Intel® HD Graphics 3000 and Integrated Memory Controller (Bromolow) • Quad Core Processor with Intel® HD Graphics 3000 and Integrated Memory Controller (Sugar Bay) • Quad/Dual processing with Intel® Hyper. Threading Technology (2 threads per core) • Integration of high performance Processor Graphics w/ 2 independent displays • Support for DDR 3 1066/1300 • Advanced Encryption Standard (AES)** • ECC memory support** Bromolow 2/4 Core 4/8 T PCI Express* Graphics Sugar Bay 2/4 Core 4/8 T Display Ports HDMI/DVI/Display. Port* /SDVO Intel® High Definition Audio 6 SATA Ports Intel® C 206 Chipset & Intel® Q 67/ B 65/H 61 Express Chipset 4 PCI Bus Masters 14 Hi-Speed USB 2. 0 Ports PCI Express Gen 2. 0 x 1 LPC or SPI BIOS Support Platform Controller Hub (PCH) • Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA Bromolow Platform Intel® Xeon® E 3 -1275 CPU • Enhanced Manageability features: Intel® Xeon® E 3 -1225 Intel® Core™ i 3 -2120 Sugar Bay Platform Intel® Core™ i 7 -2600 Intel® Core™ i 5 -2400 Intel® Core™ i 3 -2120 Intel® Celeron® G 850 and G 540 • Intel® Active Management Technology 7. 0 TDP 65 W/95 W • Intel® Trusted Execution Technology ECC Yes No PCI-Express** Intel® C 206 Chipset Intel® Q 67/B 65/H 61 Express Chipset • Enhanced Security features CPU I/O PCH *Other names and brands may be claimed as the property of others. 50 Integrated or Discrete Graphics HDMI/DVI/ DP DMI 5 GT/s Gb. E LAN PHY • Additional USB, PCIe*, and SATA ports 2 CH DDR 3: 1066/1333 INTEL CONFIDENTIAL ** Certain features are available on select SKUs only. See configuration tables for details

Sandy Bridge Low Power Platform Overview Processor • Quad/Dual Core Processor with Processor Graphics

Sandy Bridge Low Power Platform Overview Processor • Quad/Dual Core Processor with Processor Graphics and Integrated Memory Controller • Integration of Processor Graphics w/ 2 independent displays • Support for DDR 3 1600/1333/1066** • Advanced Encryption Standard (AES)** • ECC memory support** Platform Controller Hub (PCH) • Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA • Additional USB, PCIe*, and SATA ports • Enhanced Manageability features: • Intel® Active Management Technology 7. 0 PCI Express* x 16 Graphics (Embedded Display Port (e. DP)** Or PCIe Graphics x 16 Huron River 2/4 Core Or 2 x 8 I/O (2. 5 GT/s) 4/8 Threads Intel® Flex Display Interface DMI 1 or 2 CH DDR 3: 1066/1333/1600 Processor or Discrete Graphics SATA VGA & LVDS Display Interfaces 3 Ports – Can Mix: Display. Port*/DVI/HDMI/SVDO Intel® High Definition Audio PCI Express, 8 x 1 Lanes 2. 5 GT/s Mobile Intel® QM 67, HM 65 Express Chipsets PCH PCI Bus Masters USB 2. 0 Ports SPI BIOS Support Gb. E LAN PHY • Intel® Trusted Execution Technology Huron River Platform • Enhanced Security features r. PGA: Intel® Core™ i 7 -2710 QE, Intel® Core™ i 5 -2510 E, Intel® Celeron® B 810 CPU TDP ECC CPU I/O Port Bifurcation PCH BGA: Intel® Core™ i 7 -2715 QE, Intel® Core™ i 7 -2655 LE, Intel® Core™ i 7 -2610 UE, Intel® Core™ i 5 -2515 E, Intel® Core™ i 7 -2310 E, Intel® Celeron® B 810 E, Intel® Celeron® 847 E, Intel® Celeron® 827 E, Intel® Celeron® 807 UE r. PGA: SV (45 W/35 W) BGA : SV (35 W), LV(25 W), ULV (17 W), ULV(10 W) Yes (BGA Pkg Only) PCI-Express** 1 x 16, 2 x 8, 1 x 8+2 x 4 Intel® QM 67/HM 65 Express Chipsets *Other names and brands may be claimed as the property of others. 51 Huron River+ECC Processors** e. DP INTEL CONFIDENTIAL ** Certain features are available on select SKUs only. See configuration tables for details

ISG-PSD Software 52 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

ISG-PSD Software 52 INTEL CONFIDENTIAL, FOR INTERNAL USE ONLY

OS is Key to Unlocking New Features Win 81 Win 7 Linux Win XP

OS is Key to Unlocking New Features Win 81 Win 7 Linux Win XP 2 To take full advantage of all the new intelligent high performing and rich graphics & media features on Ivy Bridge, customers should upgrade to Windows 7* or Windows 8* • Intel® AVX Technology • PAVP v 3. 0 • Stereoscopic 3 D • Full HW Acceleration for H. 264/AVC • Full HW Acceleration for VC 1 • Flash 10. 1 for H. 264 Decode • Intel Quick Sync Video Linux* and Windows* XP users will have subset ability to use new features and acceleration options for graphics and media 1 The Windows 8 reference is applicable at the time of Windows 8 release. Please contact Microsoft directly for dates. 53 INTEL CONFIDENTIAL 2 This includes all embedded Win XP based Operating Systems: Windows Embedded Standard 2009 and POSReady 2009

ISG Scalable & Low Power Processor Windows Software Roadmap Scalable (Desktop/Workstation) 2010 Piketon &

ISG Scalable & Low Power Processor Windows Software Roadmap Scalable (Desktop/Workstation) 2010 Piketon & Fox Hollow • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009, POSReady 2009 • Windows Vista SP 2* • Windows 2008 Server Low Power (Mobile) Low Calpella+ECC • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009, POSReady 2009 • Windows Vista SP 2* • Windows 2008 Server 2011 Sugar Bay & Bromolow • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009 • Windows 2008 Server Huron River+ECC • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009, POSReady 2009 • Windows 2008 Server 2012 Maho Bay & Carlow • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009, POSReady 2009 • Windows 2008 Server Chief River+ECC • Windows 81, Windows 7, WES 7, POSReady 7 • Windows XP SP 3, WES 2009, POSReady 2009 • Windows 2008 Server 1 The Windows 8 reference is applicable at the time of Windows 8 release. Please contact Microsoft directly for dates. 54 INTEL CONFIDENTIAL

3 rd Generation Core™ Graphics, Media, Display Features Windows* 7 Windows* XP 3 Linux*

3 rd Generation Core™ Graphics, Media, Display Features Windows* 7 Windows* XP 3 Linux* OTC DX 10. 1 Yes No No DX 11 (new on IVB) Yes No No Open. GL 3. 0 Yes TBD Open. GL 3. x (new on IVB) Yes TBD OCL 1. 1 (new on IVB) Yes No TBD GLSL 1. 3 Yes TBD GLSL 1. 4 (new on IVB) Yes TBD Stereoscopic 3 D (HDMI 1. 4 w/ Stereoscopic 3 D for Blu-ray ) Yes No TBD Intel® Media SDK support Yes No No Full Acceleration support for MPEG 2 Decode Yes Yes Full Acceleration support for H. 264/AVC Decode Yes No Yes Full Acceleration support for VC-1 Decode Yes No Yes Full Acceleration support for H. 264 Encode Yes No Yes Encode support for MPEG 2 Encode Yes No Q 1’ 12 Intel® Quick Sync Video for media processing Yes No Q 1’ 12 Platform Feature Graphics Media 55 INTEL CONFIDENTIAL 1 This feature matrix contains GMA/ Linux OTC driver features applicable for SNB forward, unless specifically called out 2 Includes Windows 7 and Windows Embedded Standard 7 (WES 7) 3 Includes Windows XP, Windows Embedded Standard 2009 (WES 2009), and WE POSReady 2009

3 rd Generation Core™ Graphics, Media, Display Features Platform Feature Windows* 7 Widows* XP

3 rd Generation Core™ Graphics, Media, Display Features Platform Feature Windows* 7 Widows* XP 3 Linux* OTC Display Dual LVDS (integrated LVDS + SDVO-LVDS) Yes Yes Hybrid Multi Monitor (2 displays on processor graphics, additional displays on discrete graphics) Yes Yes 3 Displays support (new on IVB) Yes No TBD SDVO to DVI/CRT/LVDS support Yes TBD Intel® Wireless Display (Long life support not available for this feature, Mobile only)4 Yes No No Support for Intel® Turbo Boost Technology Yes Yes Intel® Display Power Saving Technology (Intel® DPST) – mobile only Yes No Power 56 INTEL CONFIDENTIAL 1 This feature matrix contains GMA/ Linux OTC driver features applicable for SNB forward, unless specifically called out 2 Includes Windows 7 and Windows Embedded Standard 7 (WES 7) 3 Includes Windows XP, Windows Embedded Standard 2009 (WES 2009), and WE POSReady 2009

2 nd Generation Intel® Core™– Technology Features Windows 1 Linux Vx. Work s RTOS

2 nd Generation Intel® Core™– Technology Features Windows 1 Linux Vx. Work s RTOS 3 Intel® Hyper-Threading Technology Yes Yes Intel® Advanced Vector Extensions (Intel® AVX)2 Yes Yes Chipset Information/Patches Yes Yes Intel® Active management Technology 7. 0 Yes No No PC-Initiated Secure Connection over LAN Yes No No AES - NI Yes Yes PAVP v 2. 0 2 Yes No No No Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d), Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Yes Yes Intel® Trusted Execution Technology (Intel® TXT) Yes Yes 5 MB (Fully Featured PCH) Yes Yes 1. 5 MB (Value PCH) Yes Yes Platform Feature Base feature/Performance Manageability Security & Virtualization Firmware 57 57 INTEL CONFIDENTIAL 1 Supported Operating Systems include Windows 7, WES 7, Windows XP, WES 2009, WE POSReady. 2 Windows 7 and WES 7 only 3 RTOS Vendors: Greenhill, Lynux. Works, QNX, Tenasys. Please contact individual vendor for release details.

2 nd Generation Intel® Core™– Technology Features Platform Feature Windows 1 Linux Vx. Works

2 nd Generation Intel® Core™– Technology Features Platform Feature Windows 1 Linux Vx. Works RTOS 2 IPS support Yes No No No Dynamic Power Performance Management (Camarillo) Yes No No No Intel Turbo Boost Technology Yes No No Wi-Fi (Mobile Only) Yes No No LAN (Lewisville) Yes Yes IPv 6 Support Yes Yes SATA 2 Yes Yes SATA 3 Yes Yes USB 2 Yes Yes RAID (Rapid Storage Technology) Yes No No Integrated Performance Primitives Yes Intel Cluster Toolkit Compiler Edition 3. 2 (ICC) Yes Intel Cluster Toolkit 3. 2 Yes Intel Trace Analyzer and Collector 7. 2 Yes Intel MPI Library 3. 2 Yes Math Kernel Library Yes Vtune Performance Analyzer Yes Threading Building Blocks 2. 2 Yes Power Management Networking I/O Tools 58 58 INTEL CONFIDENTIAL For Vx. Works and RTOS vendors, please contact the supporting OS vendor for tool support. 1 Supported Operating Systems include Windows 7, WES 7, Windows XP, WES 2009, WE POSReady. 2 RTOS Vendors: Greenhill, Lynux. Works, QNX, Tenasys

2 nd Generation Intel® Core™ – Media, Graphics, Display Features Win 7* Win. XP*

2 nd Generation Intel® Core™ – Media, Graphics, Display Features Win 7* Win. XP* Linux GMA OTC Platform POR Features Graphics DX 10. 1 Open. GL 2. 2 Open. GL 3. 0 Open. GLES 2. 0 GLSL 1. 3 Stereoscopic 3 D support (HDMI 1. 4 w/ Stereoscopic 3 D for Blu-ray) Media VA-API PAVP API DXVA 2. 0 HW Accelerated Decode support for MPEG 2 HW Accelerated Decode support for H. 264 HW Accelerated Decode support for VC-1 HW Accelerated Decode (MPEG 2, H. 264, VC-1) supported in all rotated modes Flash 10. 1 support for H. 264 Decode Accelerated Encode support for MPEG 2 Accelerated Encode support for H. 264 Accelerated Transcode Skin Tone Enhancement (New Post Processing) Total Color Control (New Post Processing) Adaptive Contrast Enhancement (New Post Processing) De-interlacing (New Post Processing to Linux) Render to text (New Post Processing to Linux) Scaling (New Post Processing to Linux) Header 59 INTEL CONFIDENTIAL Yes Yes No Yes Yes Yes No No Yes No TBD Yes TBD Header No Yes Yes Yes Yes No No No Yes No No No Yes Yes No TBD Yes TBD No No No Yes Yes

2 nd Generation Intel® Core™– Media, Graphics, Display Features Win 7* Win. XP* Linux

2 nd Generation Intel® Core™– Media, Graphics, Display Features Win 7* Win. XP* Linux GMA OTC Platform POR Features Display Header Dual LVDS Yes Yes Hybrid Multi Monitor (4 concurrent / independent displays, 2 on i. Gfx + 2 or more on discrete) Yes Yes Hotplug support Yes Yes EDID-less displays support Yes Yes Display. ID support Q 1'12 Q 1’ 12 TBD Wireless Display ** Long Life Support not available for this feature (Mobile only) Yes No No Support for external digital displays (DVI, HDMI, DP) Yes Yes Power Header Intel® Display Power Saving Technology (Intel® DPST) - mobile only Yes No Support for Intel® Turbo Boost Technology (IPS) aka Intel® Dynamic Power Perf Management 5. 0 (DPPM) Yes Yes 60 INTEL CONFIDENTIAL * Includes support for embedded OS’s: WES 7, WES, WE POSReady 2009

ISG Intel® Atom™ Processor Platform Roadmap Q 1’ 12 Q 2’ 12 Q 3’

ISG Intel® Atom™ Processor Platform Roadmap Q 1’ 12 Q 2’ 12 Q 3’ 12 Q 4’ 12 Q 1 ‘ 13 General Purpose Embedded Clients (Standard UI Platforms, Traditional IA Usages) Luna Pier-D/Luna Pier Refresh-D Platform – Intel® ICH 8 M Performance Intel® Atom™ Processor D 525/D 425 (DDR 2/DDR 3) Intel® Atom™ Processor D 510/D 410 (DDR 2) Cedar Trail Platform – Intel® NM 10 Chipset Intel® Atom™ Processor D 2700 Luna Pier-M/Luna Pier Refresh-M Platform – Intel ® ICH 8 M Mainstream Intel® Atom™ Processor N 455 (DDR 2/DDR 3) Intel® Atom™ Processor N 450 (DDR 2) Queens Bay – Intel® EG 20 T IOH Intel® Atom™ Processor E 6 x 0, E 6 x 0 T Cedar Trail Platform – Intel® NM 10 Chipset Intel® Atom™ Processor N 2800/N 2600 Battery Optimized Oak Trail Platform – Intel® SM 35 Intel® Atom™ Processor Z 670/Z 650 Usage Specific Embedded (Usage Specific Platforms, Emerging Usages for IA) Application Specific Queensbay Platform – Third Party IOH’s Intel® Atom™ Processor E 6 x 0 T Intel® Atom™ Processor E 6 x 0 Stellarton Platform – Integrated Third Party FPGA Configurable 61 INTEL CONFIDENTIAL Intel® Atom™ Processor E 6 x 5 CT Intel® Atom™ Processor E 6 x 5 C

ISG Intel® Atom™ Processor & Chipset Roadmap Q 4 ’ 11 Q 1’ 12

ISG Intel® Atom™ Processor & Chipset Roadmap Q 4 ’ 11 Q 1’ 12 Q 2’ 12 Q 3’ 12 Q 4’ 12 Processors D 525 D 510 N 455 N 450 D 425 D 410 E 660 T E 640 T E 620 T E 660 E 640 E 620 E 665 CT E 645 CT E 625 CT E 665 C E 645 C E 625 C LEPD Intel® Atom™ Processor & Chipset Roadmap E 680 T E 680 Z 670 Z 650 D 2700 N 2800 N 2600 Intel D/N 4 xx Series Processors (Pineview) Chipsets Intel E 6 x 0 Series Processors (Tunnel Creek) Intel E 6 x 5 Series Processors (Stellarton) Intel Z 6 x 0 Series Processors (Lincroft) ICH 8 M EG 20 T + Third Party IOH’s SM 35 (Whitney Point) NM 10 62 INTEL CONFIDENTIAL Cedarview Processors

ISG Intel® Atom™ Processor Roadmap Reference Table WW 3 63 INTEL CONFIDENTIAL

ISG Intel® Atom™ Processor Roadmap Reference Table WW 3 63 INTEL CONFIDENTIAL

ISG Intel® Atom™ Development Board Roadmap Q 2 ’ 11 Q 3’ 11 Q

ISG Intel® Atom™ Development Board Roadmap Q 2 ’ 11 Q 3’ 11 Q 4’ 11 Q 1’ 12 Q 2’ 12 Embedded Intel® Atom™ - Performance Cedar Rock Luna Pier Atom™ N 450/N 510 “$149” Black Sand Intel Atom Processor D 2000/ N 2800 w/NM 10 Chipset CRB Cedar Trail Intel Atom Processor D 2700 / N 2800 w/NM 10 Chipset Intel Board - ICBD LEPD Intel® Atom™ Processor & Chipset Roadmap Crown Bay Embedded Intel® Atom™ - Mainstream Cedar Trail Tunnel Creek Processor“B 1” Topcliff IOH CRB Intel Atom Processor D 2700/ N 2800 w/NM 10 Chipset Dev Kit w/3 rd Party TBD Crown Bay OT Seed Board Tunnel Creek Processor“B 1” Topcliff IOH Development Kit Intel Atom Processor Z 6 xx Intel SM 35 PCH IEI 3. 5” FF Alpine Bay Intel Atom Processor Z 6 xx Intel SM 35 PCH CRB Embedded Intel® Atom™ – Bat. Optimized Embedded Intel® Atom™ - Configurable Alpine Bay Intel Atom Processor Z 6 xx Intel SM 35 PCH Development Kit Foxbrook Intel Atom Processor E 6 x 5/CT CRB Foxbrook Intel Atom Processor E 6 x 5/CT Development Kit Lite Embedded Intel® Atom™ - App Specific Planning 64 INTEL CONFIDENTIAL In Development Shipping

Customer Reference Boards only for Early Access Seed Board : Limited Time Offer: -

Customer Reference Boards only for Early Access Seed Board : Limited Time Offer: - Commercially Available for purchase after expiration University Systems: Sponsored Systems based on commercially available boards Black Sand Boards: A series of low cost boards only available through edc. intel. com Development Kits : Systems based on CRB’s available after launch. RELEASE DATE CRB Crown Beach & N/A Swift Current 2 Crown Beach Schematics Swift Current 2 Schematics Q 1 2009 Roe River Ref Board Schematics Intel® Atom™ Processor Z 5 xx Series with Intel® System Controller Hub US 15 Wx. Formerly Embedded Menlow / Embedded Menlow-XL Intel® Atom™ Processor N 270 with Mobile Intel® 945 GSE Express Chipset. Formerly Navy Pier Seed Board Q 2 2008 Q 2 2010 Intel® Atom™ Processors 400 and 500 Series with Intel® 82801 HM I/O Controller. Formerly Luna Pier N/A AIMBMoon Creek Kit D 510 version SKU#: EMBAD 51 HMMCSDK 212 N from Moon Creek Kit N 450 version SKU#: EMBAN 45 HMMCMDK Purchase Price: $1, 400. 00 Advantech Product Brief Devboard N 450 Product -D 510 Brief Schematics Devboard Mini. ITX Schematics Q 3 2010 Intel® Atom™ Processor E 6 xx Series with Intel® Platform Controller Hub EG 20 TFormerly Queens Bay Intel® Atom™ Processor E 6 x 5 C Series Intel® Atom™ Processor Z 6 xx Series with Intel® SM 35 Express Chipset. Formerly Oak Trail 65 INTEL CONFIDENTIAL Q 2 2011 Crown Bay Kit SKU#: EMBTNCTCCBDVKT Purchase Price: $1, 300. 00 Product Brief Nano-ITX_Spartan-6 -fpga-dev-Kit featuring the NITX-315 Purchase Price $1695 Black Sand Embedded Development Board 1 -E 6 xx – Q 2/Q 3 2011 N/A Foxbrook Dev Kit – Contact PME Mathangi Ranganathan - mathangi. ranganathan@intel. com / (480) 552 -6416 IEI Alpine Bay EMBLNCWPTABDVK Development Kit Manual Alpine Bay Ref Board Schematics NITX-315 DEVKIT from Emerson Network Power Product Brief Fox Brook Black Sand Embedded Development Board 1 -N 450 SKU DEVBOARD-1 -N 450 Black Sand Embedded Development Board 1 -D 510 SKU DEVBOARD-1 -D 510 Purchase Price: $149 http: //bit. ly/devboard Luna Pier University Systems are based on the Advantech AIMB 212 D 510 board (see seed board) Crown Bay/ Little Bay / Shell Bay Little Bay Schematics Shell Bay Schematics Q 4 2010 - CRB Q 4 2011 – Dev Kit EMBAT 945 GSERRDK Product Brief Moon Creek Ref Board Schematics Development Kits and Boards – University Systems EMBATMSCHCBDVK featuring Crown Beach CRB $2, 100 Product Brief IEI Oak Trail evaluation boards will begin to ship late Q 3’ 11 Oak Trail dev kits due WW 21

Cedar Trail Platform Overview Cedarview Processor • Dual-Core, DX*10. 1, 640 MHz Graphics •

Cedar Trail Platform Overview Cedarview Processor • Dual-Core, DX*10. 1, 640 MHz Graphics • DDR 3 Memory Controller – Single Channel, 1067, 2 SODIMM/channel • Integrated HDMI/DP, LVDS, e. DP, HDCP 1. 3 Intel NM 10 Express Chipset • 2 x SATA Gen 2, 8 x USB 2. 0/1. 1 • 4 x PCIe* Gen 1 • Intel® HD Audio – 2 SDIN • LCI interface for 10/100 LAN Misc • Intel® Mobile Voltage Positioning (Intel® MVP)-7 VR for Cedarview Processor LVDS/ e. DP DDR 3 SO-DIMM 1 Channel 2 DIMMs Dual Core CPU DX 10. 1 Graphics DDR 3 Memory DP/HDMI VGA 32 nm PCIe Mini card x 4 DMI for Cedarview-D x 2 DMI for Cedarview-M 2 SATA Wi-Fi / Wimax / Bluetooth 4 x PCI Express* NM 10 Chipset Codec 8 ports HD Audio LAN SIO SPI LAN: 82552 V (Woodinville) 66 INTEL CONFIDENTIAL Slide 66

Current ECG Platforms 67 INTEL CONFIDENTIAL

Current ECG Platforms 67 INTEL CONFIDENTIAL

Intel® Xeon® 5600 series processor platform Overview Block Diagram Processor Core • Westmere Core

Intel® Xeon® 5600 series processor platform Overview Block Diagram Processor Core • Westmere Core (32 nm) [Next Intel TICK] • 6 C and 4 C options • SMT: 2 threads/core, Turbo Mode • New Instructions: AES-NI , CLMUL • Integrated Memory Controller • 12 MB shared last level cache Processor Options: ü E 5645 6 C/12 T - 1333/5. 86/12 M/80 W 2. 40 GHz ü E 5620 4 C/8 T - 1066/5. 86/12 M/80 W 2. 40 GHz ü L 5638 6 C/12 T - 1333/5. 86/12 M 60 W* 2. 00 GHz ü L 5618 4 C/8 T - 1066/5. 86/12 M 40 W* 1. 87 GHz *High Tcase of 85 C no more than 360 hrs/year Platform Features • Extended Product Support • Technologies: AES-NI, TXT-SX • Intel® Virtualization technology • ECG unique CPUs • One or two sockets supported • 2 Chip solution (CPU + Chipset) • RAS: Reliability, Availability and Serviceability: I/O, Memory, System RAS • Memory : UDIMM & RDIMM & LV Schedule Launch Q 1 2010 Six Core 2 S configuration shown Westmere-EP DDR 3 DDR 3 Intel® QPI ESI ICH 10 R Intel* QPI <=5. 8 GT/s Intel® QPI Tylersburg 36 D IOH 8 x 4 1 x 4 4 x 8 2 x 2 2 x 16 Configurable set of PCIe* Gen 2 ports 42 PCIe* Lanes: 36 Gen 2 lanes, 6 Gen 1 lanes (via ICH) Dual 10 Gb. E 82599 (Niantic) Oplin Dual Gb. E Kawela 82576 Dual Gb. E INTEL CONFIDENTIAL DDR 3 Intel® QPI 10 Gb. E 2. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note: 45 nm product is manufactured on a Lead Free process. Lead-free per EU Ro. HS directive July, 2006. Some E. U. Ro. HS exemptions may apply to other components used in the product package. Dates and plans subject to change. 68 Westmere-EP PXH-V PCI-X*

Intel® Xeon Processor C 5500/C 3500 Series Overview Block Diagram Processor Core • Nehalem

Intel® Xeon Processor C 5500/C 3500 Series Overview Block Diagram Processor Core • Nehalem Core (45 nm) QC, DC & Uni-core SKUs • 2 MB, 4 MB, 8 MB Shared Last Level Cache • SMT: 2 threads / core • Turbo Mode Platform Features • Integrated Memory Controller: 1 -3 Channels of Native DDR 3 Support w/ECC • Integrated Native PCI-E Gen 2: Supports 1 x 16, 2 x 8, 4 x 4 configurations • Additional 1 x 4 PCI-Express* Gen 1. 0 • Non Transparent PCI-E Bridge • VT-x 2, VT-d 2, DCA 1, CB 3 DMA 1, ADR 2 • OS Support: Linux, Windows Server 2003 2, Windows Server 20082 Jasper Forest DDR 3 QPI DDR 3 IIO DDR 3 4 x 4 Intel® 3420 Chipset ESI/ DMI DDR 3 4 x 4 2 x 8 1 x 16 PCI-E Gen 2. 0 1 x 4 PCI-E Gen 1. 0 Configurable set of PCIe ports Dual Gb. E Kawela/Zoar 10 Gb. E Niantic PXH-V Memory • DDR 3 -800/1067/1333 MT/s • 1 -3 Memory Channels • 32 GB/s Peak Memory Bandwidth Schedule Target • PRQ – Available Now 1 Software for DCA and DMA supported by Intel® NICs 2 Support for ADR and Software for NTB will only be provided on Linux. 69 INTEL CONFIDENTIAL Dual Gb. E 10 Gb. E • 42. 5 X 45 mm LGA Package PCI-X

Updated slide Sandy Bridge Scalable Platform – Bromolow / Sugar Bay Processor • Quad

Updated slide Sandy Bridge Scalable Platform – Bromolow / Sugar Bay Processor • Quad Core Processor with Processor Graphics and Integrated Memory Controller (Bromolow) • Quad Core Processor with Processor Graphics and Integrated Memory Controller (Sugar Bay) • Quad/Dual processing with Intel® Hyper. Threading Technology (2 threads per core) • Integration of high performance Processor Graphics w/ 2 independent displays • Support for DDR 3 1066/1300 • Advanced Encryption Standard (AES)** • ECC memory support** Platform Controller Hub (PCH) Display Ports HDMI/DVI/Display. Port* /SDVO Intel® High Definition Audio Integrated or Discrete Graphics HDMI/DVI/ DP DMI 5 GT/s 6 SATA Ports Intel® C 206 Chipset & Intel® Q 67/ B 65/H 61 Express Chipset 4 PCI Bus Masters 14 Hi-Speed USB 2. 0 Ports PCI Express Gen 2. 0 x 1 LPC or SPI Gb. E LAN PHY BIOS Support Bromolow Platform • Additional USB, PCIe*, and SATA ports Intel® Xeon® E 3 -1275 CPU Intel® Xeon® E 3 -1225 Intel® Core™ i 3 -2120 • Intel® Active Management Technology 7. 0 Sugar Bay Platform Intel® Core™ i 7 -2600 Intel® Core™ i 5 -2400 Intel® Core™ i 3 -2120 Intel® Celeron® G 850 and G 540 • Intel® Trusted Execution Technology TDP 65 W/95 W • Enhanced Security features ECC Yes No PCI-Express** Intel® C 206 Chipset Intel® Q 67/B 65/H 61 Express Chipset *Other names and brands may be claimed as the property of others. ** Certain features are available on select SKUs only. See configuration tables for details 70 2 CH DDR 3: 1066/1333 Sugar Bay 2/4 Core 4/8 T • Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA • Enhanced Manageability features: Bromolow 2/4 Core 4/8 T PCI Express* Graphics INTEL CONFIDENTIAL CPU I/O PCH

Sandy Bridge Low Power Platform – Huron River Processor • Quad/Dual Core Processor with

Sandy Bridge Low Power Platform – Huron River Processor • Quad/Dual Core Processor with Processor Graphics and Integrated Memory Controller • Integration of Processor Graphics w/ 2 independent displays • Support for DDR 3 1600/1333/1066** • Advanced Encryption Standard (AES)** • ECC memory support** Platform Controller Hub (PCH) • Two Display Streams supported in any combination of Display. Port*, HDMI, DVI and VGA • Additional USB, PCIe*, and SATA ports • Enhanced Manageability features: • Intel® Active Management Technology 7. 0 PCI Express* x 16 Graphics (Embedded Display Port (e. DP)** Or PCIe Graphics x 16 Huron River 2/4 Core 4/8 Threads Intel® Flex Display Interface DMI 1 or 2 CH DDR 3: 1066/1333/1600 Processor or Discrete Graphics SATA VGA & LVDS Display Interfaces 3 Ports – Can Mix: Display. Port*/DVI/HDMI/SVDO Intel® High Definition Audio PCI Express, 8 x 1 Lanes 2. 5 GT/s Mobile Intel® QM 67, HM 65 Express Chipsets PCH PCI Bus Masters USB 2. 0 Ports SPI BIOS Support • Intel® Trusted Execution Technology Huron River Platform • Enhanced Security features r. PGA: Intel® Core™ i 7 -2710 QE, Intel® Core™ i 5 -2510 E, Intel® Celeron® B 810 CPU TDP ECC *Other names and brands may be claimed as the property of others. ** Certain features are available on select SKUs only. See configuration tables for details 71 Huron River+ECC Processors** e. DP Or 2 x 8 I/O (2. 5 GT/s) Gb. E LAN PHY Updated slide INTEL CONFIDENTIAL CPU I/O Port Bifurcation PCH BGA: Intel® Core™ i 7 -2715 QE, Intel® Core™ i 7 -2655 LE, Intel® Core™ i 7 -2610 UE, Intel® Core™ i 5 -2515 E, Intel® Core™ i 7 -2310 E, Intel® Celeron® B 810 E, Intel® Celeron® 847 E, Intel® Celeron® 827 E, Intel® Celeron® 807 UE r. PGA: SV (35 W) BGA : SV (35 W), LV(25 W), ULV (17 W), ULV(10 W) Yes (BGA Pkg Only) PCI-Express** 1 x 16, 2 x 8, 1 x 8+2 x 4 Intel® QM 67/HM 65 Express Chipsets

Intel® Active Management Technology Intel Product Name Clarkdale & Arrandale Processors (2010) Sandy Bridge

Intel® Active Management Technology Intel Product Name Clarkdale & Arrandale Processors (2010) Sandy Bridge Processors (2011) Ivy Bridge Processors (2012) Platform Codename Piketon/ Fox. Hollow & Calpella+ECC Sugar Bay / Bromolow & Huron River Calow / Maho Bay & Chief River Intel® AMT Version AMT 6. 0 AMT 7. 0 AMT 8. 0 Boot Control X X X Power State Management X X X HW Inventory X X X SW Inventory X X X HW Alerting X X X Serial Over LAN X X X IDE Redirect X X X Agent Presence X X X System Defense Filters X X X ME Wake on LAN X X X Remote Configuration X X X Access Monitor Operation X X X Fast Call for Help, Remote Scheduled Maintenance, and Remote Alerts from outside corporate firewall via Wired LAN X X X Enhanced system defense filters X X X KVM redirection X X X IPV 6 and SHA-2 support X X X Dash 1. 1 with KVM Support X X Host-based setup X X Firmware rollback 7. 0 X X Out-of-Band (OOB) system management allows remote management regardless of system power or OS state • Remote troubleshooting and recovery significantly reduces onsite visits – reduces resource and maintenance overhead • Event Logging & Alerting decreases downtime & mean time to repair • Remote HW/SW asset tracking eliminates time-consuming manual inventory tracking to reduce accounting costs • Network Outbreak Containment protects against network outbreaks with real-time filtering • Agent Presence alerts when agent is unresponsive, enables ability to take action Reduce total cost of ownership for embedded applications 72 INTEL CONFIDENTIAL

Oak Trail Platform Value Proposition Choice of Operating Systems Lincroft Flexibility with Windows* 7,

Oak Trail Platform Value Proposition Choice of Operating Systems Lincroft Flexibility with Windows* 7, WES 2011 & Mee. Go* Intel® Atom™ Core Graphics Video LVDS Memory d Thinner & Innovative Form Factors 50% lower power 1, smaller and thinner packages Rich HD Media & Display Whitney Point HDMI SATA HD Audio I/O 1 Compared with Pine Trail-M (N 455/N 475) TDP 2 Compared with Pine Trail-M based on MM 07 OP Win 7 * Other names and brands may be claimed as the property of others 73 INTEL CONFIDENTIAL Stream & playback HD videos with HDMI support Longer Battery Life 50% silicon power reduction 2, power efficient video decode

Oak Trail Platform Overview DDR 2 -800 Enabling Thinner and Innovative Form Factors Lincroft

Oak Trail Platform Overview DDR 2 -800 Enabling Thinner and Innovative Form Factors Lincroft (45 nm) Microprocessor Memory LVDS Atom Core Video • Energy efficient Intel® Atom™ processor micro architecture based on 45 nm process • >50% component power reduction 1 • >45% package area and height reduction 1 2 D/3 D Graphics c. DMI c. DVO Rich Multimedia Whitney Point • HW acceleration for h. 264, VC 1/WMV 9 codecs & Flash PCH SD • Targeting video decode up to 1080 p HDMI SATA SDIO HD Audio USB I/O • Support for HDMI Lower Power • >50% reduction in component average power 2 Power Delivery PMIC & Platform VRs Sensors Third Party Kelsey Peak Wi. Fi / BT Wi. Max (SDIO or USB) (USB) 1) Compared to Pine Trail-M platform (N 455 / N 475) 2) Compared to Pine Trail-M based on MM 07 OP, Win 7 74 INTEL CONFIDENTIAL • Energy efficient HD video decode • SDIO enabled for support of lower powered communication solutions

Re-think Flexibility – Stellarton Benefits Customizab le SOC Customizable SOC: Single Chip Intel® Atom™

Re-think Flexibility – Stellarton Benefits Customizab le SOC Customizable SOC: Single Chip Intel® Atom™ Processor plus FPGA for customized differentiation Prevalidation & Support Ease of Design Ease of design: BOM consolidation with fewer chips, smaller footprint, and more features integrated. Pre-validated connection between processor and FPGA. Single support from Intel. Size, Thermal, Integration Performanc e Leadership Rich Ecosystem & Experience Performance Leadership: Better performance to meet embedded design needs. Size, thermal and integration: Bring Intel® Architecture to small form factor design. Rich ecosystem support enables scalable and flexible solutions and allows software reuse top to bottom. Platform and Technology Leadership anchored by Intel Architecture 75 INTEL CONFIDENTIAL

Stellarton Intel® Atom™ Processor + Altera* Arria* II GX FPGA Uniquely addressing your specialized

Stellarton Intel® Atom™ Processor + Altera* Arria* II GX FPGA Uniquely addressing your specialized requirements IA CPU + 512 KB L 2 (0. 6 G, 1. 0 G, 1. 3 GHz) DDR 2 PCIe DDR 2 (667/800) Graphics (2 D/3 D) SPI, SMBus Legacy GPIO (x 14) HDAudio PCIe Gen 1 (2 x 1) Intel Atom processor (Tunnel Creek) features: LVDS ü ü Integrated PCIe Integrated memory controller Integrated graphics engine Integrated hi-def video and audio OEM configured Altera FPGA OEM Logic PCIe Gen 1 SIP OEM I/O Blocks OEM Logic Blocks PCIe Gen 1 HIP Tunnel Creek Altera Arria* II GX 65 *Other names and brands may be claimed as the property of others 76 INTEL CONFIDENTIAL Program with items such as: ü ü ü ü Voice codecs Gb. E SD flash IPSec Signal processing kernels OEM proprietary IP Boot logic (BIOS)

WW 3 ISG Product Pricing is available to all Intel Field Sales at: http:

WW 3 ISG Product Pricing is available to all Intel Field Sales at: http: //price. intel. com/Default. aspx? page=Pricing. Guidelines&target Please select the file titled “Embedded/ISG RCP WWxx. pdf” where xx is the most current work week available. Customers should check with your local distributor or Intel Field Sales rep for pricing guidance. 77 INTEL CONFIDENTIAL