Integration and Test Critical Design Review Rick Sterling

Integration and Test Critical Design Review Rick Sterling University of California – Berkeley Thm_CDR_IT_Revc THEMIS Instrument CDR 1 UCB, April 19 -20, 2004

Agenda • • Requirements and Responsibilities Facilities (Integration and Environmental) Instrument I&T Requirements Instrument I&T Set-up (MGSE, EGSE) Instrument I&T Flows Instrument-Spacecraft Integration Issues THEMIS Instrument CDR 2 UCB, April 19 -20, 2004

Responsibilities • • • Provide Clean Room Facility (Room 125) Access Control & Clean Room Training Develop MGSE – • • Fabricate Instrument Harnessing Support Instrument-Provided GSE – – – • • Instrument Harness Mockups & Test Platforms Mu-Metal Enclosures for FGM & SCM N 2 Purge Systems for ESA, SST Sphere Sensor Boxes for EFI Integrate & Functional Test of EM, F 1 -F 6 Provide EMC, MAG, Vibration & TV Testing Daily Logistic Planning & “Standup” meetings Deliver & Support to Swales for Spacecraft I&T THEMIS Instrument CDR 3 UCB, April 19 -20, 2004

Facilities – Integration Lab Instrument Integration Lab • • • Secure Key-Coded Lock Class 100 K Clean room Air Quality Monitored Weekly by Assurance Positive Air Flow Feed Thru’s to Adjacent Lab Gowning Area Storage Shelving for Component Storage Separate Flight and non-Flight Storage Oxygen Sensor (when Nitrogen Purge used) Used for HESSI, CHIPSAT, Stereo Impact THEMIS Instrument CDR 4 UCB, April 19 -20, 2004

Facilities - Environmental Thermal Chambers • • • Available Chambers Hi. Bay L 1 Hi. Bay L 2 320 T 10 320 Cal 320 “Mini” B 20 -TV “Bayside” B 20 -Large TV B 20 -Cal VAC 2 B 20 -TV “Snout” 339 -TV Cal Space Sciences Lab New Chamber for EFI Booms Cal Chamber Upgrade for SST Test Chamber Requirements • • • Pre-Test Clean Pre-Test Bakeout TQCM Monitoring Cryo-Pump Final Bakeout GN 2 Backfill Type TV TV TV Vac TV Comment AXB Booms STEREO ESA Cal SCM, Bake-outs EFI Payload TV SST Cal SST, IDPU, EFI ESA MCPs Vibration Facilities • • Wyle AMES EMI/EMC • EMCE Engineering – Fremont THEMIS Instrument CDR 5 UCB, April 19 -20, 2004

“Large Chamber(“Bertha”) • Developed for EUVE • 8’ diam x 16’ depth • Adding thermal capability • Can do two Themis units at a time if desired. THEMIS Instrument CDR 6 UCB, April 19 -20, 2004

Other Chambers • Basement SSL • Being refurbished THEMIS Instrument CDR 7 UCB, April 19 -20, 2004

Chamber for Boom Deploy • “Jeffrey” • EFI AXB scheduled for 5/04 • Developed for Stereo • Sharing with Stereo • There is another chamber with “snout” extension for boom deploy testing. THEMIS Instrument CDR 8 UCB, April 19 -20, 2004

Chamber Schedule THEMIS Instrument CDR 9 UCB, April 19 -20, 2004

Chamber Schedule THEMIS Instrument CDR 10 UCB, April 19 -20, 2004

Thermal Testing TV Plan • • • 2 Component-Level TV Cycles Prior to Instrument-Level I&T 6 Instrument Level TV Cycles at Instrument-Level Survival, Cold Start, Cycles (Functional at extremes), Bake-out Deployments in Vacuum • • • SPB: Full Deploy w Takeup reel AXB: Deploy Hot & Cold MAG: First Motion Hot & Cold Typical TV Profile: THEMIS Instrument CDR 11 UCB, April 19 -20, 2004

Instrument Requirements Instrument Cleanliness/Contamination Requirements • • • ESA and SST require continual nitrogen gas purge Regulate and use viewcam to monitor remotely Oxygen meter following instruments and gas purge equipment Normal ESD concerns Magnetometer sensor to be boxed except when under test and before flight Instrument-Provided GSE Accommodation • • • Mu-Metal Enclosures for FGM & SCM N 2 Purge Systems for ESA, SST Sphere Sensor Boxes for EFI Instrument Red/Green Tag Items Tracking • • • IDPU - Arming plug enables actuators causing boom deployment EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers SST - Covers to be removed before flight ESA - Cover; Arming plug; purge fitting; cocking pin nut THEMIS Instrument CDR 12 UCB, April 19 -20, 2004

Integration Set-up - Instruments at SSL integrated on platform same form factor as probe - 80/20 framing supports platform and sets comfortable work height - Metal rack alongside holds electrical GSE (power supply, UPS, scope) - GSE communicates with BAU Simulator via hardwire or ethernet INSTRUMENT PAYLOAD ASSEMBLY PLATE THEMIS Instrument CDR 13 UCB, April 19 -20, 2004

Instrument Payload I&T Flow MAG INTEGRATION Harness Bake-out EFI INTEGRATION IDPU-Harness Safe-to-Mate FGM Functional (Level 2) SCM Functional (Level 2) Mag Boom Deploy Mag Alignment EFI Functional (Level 1) EFI AXB Deploy EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing SST Functional (Level 2) ESA/SST Timing Payload CPT Payload EMC/EMI/MAGl Payload T-V Payload Vibration Payload Acceptance ESA/SST INTEGRATION PAYLOAD ENVIRONMENTAL Instrument PER • ONLY if req’d (workmanship) THEMIS Instrument CDR 14 • Test Review UCB, April 19 -20, 2004

FGM I&T Flow FGB Vibration FGM BOOM (FGB) FGB/SCB Thermal FGB Acceptance • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics FGS Vibration FGM SENSOR (FGS) • Boom Levels FGM ELECTRONICS (FGE) FGE Acceptance • Inspection FGM / PAYLOAD INTEGRATION IDPU Safe-to-Mate • Backplane Payload Safe-to-Mate • Harness FGS Thermal FGS Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics FGM Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration • Without FGS FGM Functional (Level 2) IDPU Thermal IDPU Acceptance • 2 cycles T-V • Bake-out +60 C • FGS Functional (Level 1) • Inspection • Mass Properties • DC Magnetics Mag Boom Deploy Alignment EFI/SCM/FGM Phasing Payload T-V Payload Vibration Payload Acceptance • Sensor in TCU PAYLOAD ENVIRONMENTAL Instrument PER Payload EMI/EMC/MAGl • ONLY if req’d • 6 cycles T-V (workmanship) • FGM Functional Lev 1) THEMIS Instrument CDR 15 • Test Review UCB, April 19 -20, 2004

FGM Test Configurations FGM Level 0 – Without Sensor (Aliveness) • • B-field about zero if FGM in Cal Mode (preferred mode) B-field saturated if feedback is closed Interface full functional Power consumption reduced by about 200 m. W FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test) • • B-field about 10, 000 n. T, Noise about 1 n. T Full functionality, but B-field not representative FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) • • • B-field < 10 n. T, Noise <10 p. T/sqrt (Hz) B-field has to be available in full quality Delta in calibration coefficients known THEMIS Instrument CDR 16 UCB, April 19 -20, 2004

SCM I&T Flow SCB Vibration SCM BOOM (SCB) • 14. 1 g RMS SCM SENSOR (SCM) SCM PRE-AMP FGB/SCB Thermal SCB Acceptance • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics SCM Sensor Vibration SCM Sensor Thermal SCM Sensor Bake-out SCM Sensor Acceptance • Inspection • Mass Properties • DC Magnetics • Boom Levels • 3 cycles (air) • Bake-out +60 C SCM Pre-Amp Thermal SCM Pre-Amp Bake-out SCM Pre-Amp Acceptance IDPU/ESA/ SCM Pre-Amp Vibration • 3 cycles (air) • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics Payload Safe-to-Mate Functional (Level 3) SCM / PAYLOAD INTEGRATION • Harness PAYLOAD ENVIRONMENTAL Instrument PER Mag Boom Deploy IDPU Thermal IDPU Acceptance • 2 cycles T-V • Bake-out +60 C • SCM Functional (Level 1) • Inspection • Mass Properties • DC Magnetics Alignment EFI/SCM/FGM Phasing Payload Vibration Payload Acceptance • SCM Sensor in Mu Metal Payload EMI/EMC/MAGl Payload TV • 6 cycles T-V • ONLY if req’d • SCM Functional (Lev 2) (workmanship) THEMIS Instrument CDR 17 • Test Review UCB, April 19 -20, 2004

SCM Test Configurations SCM Safety – Feedback Plug • Required when SCM Pre-Amp is powered and sensor is not connected SCM Level 0 – With SCM EGSE I/F Box (Aliveness) • • • Same Power, Command, Analog output interfaces Power and Cal Mode identification by LED Cal Signal re-injected to the input Signal generator connected to input Validation by analysis of data SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) • • • Sensor kept in mu metal box during integration Axis identification Re-verification of end-to-end calibration Phase relation Check of conducted noise SCM/EField timing reference THEMIS Instrument CDR 18 UCB, April 19 -20, 2004

ESA I&T Flow ESA Thermal ESA Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics ETC Acceptance IDPU Safe-to-Mate ESA SENSOR ESA ELECTRONICS (ETC) • Inspection ESA / PAYLOAD INTEGRATION IDPU/ESA/ SCM Pre-Amp Vibration • Backplane Payload Safe-to-Mate • Harness PAYLOAD ENVIRONMENTAL ESA Functional (Level 0) Instrument PER ESA Functional (Level 2) IDPU Thermal IDPU Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics Payload Vibration Payload Acceptance ESA/SST Timing • Instrument Functional • Cover Simulator Test Payload EMI/EMC/MAG Payload T-V • ONLY if req’d • 6 cycles T-V • ESA Functional (Lev 1) (workmanship) THEMIS Instrument CDR 19 • Test Review UCB, April 19 -20, 2004

SST I&T Flow SST Vibration SST SENSOR SST Thermal SST Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics DAP Acceptance SST ELECTRONICS (DAP and ETC) • Inspection ETC Acceptance IDPU Safe-to-Mate • Backplane SST Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration • Without SST IDPU Thermal IDPU Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics Payload Vibration Payload Acceptance • Inspection SST / PAYLOAD INTEGRATION Payload Safe-to-Mate • Harness PAYLOAD ENVIRONMENTAL Instrument PER SST Functional (Level 2) ESA/SST Timing • SST w/ Radiation Source • Attenuator Test Payload EMI/EMC/MAGl Payload T-V • 6 cycles T-V • SST Functional (Level 1) THEMIS Instrument CDR 20 • ONLY if req’d (workmanship) • Test Review UCB, April 19 -20, 2004

EFI I&T Flow AXB Vibration EFI AXIAL BOOM (AXB) AXB Thermal • 1 cycle T-V • Hot/Cold Deploy EFI RADIAL BOOM (SPB) EFI Pre-Amp Vibration EFI PRE-AMP EFI Pre-Amp Thermal • 3 cycles (air) BEB Acceptance EFI ELECTRONICS (BEB and DFB) • Inspection DFB Acceptance IDPU Safe-to-Mate • Backplane AXB Acceptance • Inspection • Mass Properties • DC Magnetics SPB Vibration EFI Pre-Amp Bake-out EFI Pre-Amp Acceptance • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics EFI Functional (Level 0) IDPU/ESA/ SCM Pre-Amp Vibration • Without sensors • Inspection EFI / PAYLOAD INTEGRATION Payload Safe-to-Mate • Harness PAYLOAD ENVIRONMENTAL Instrument PER EFI AXB Deploy SPB Acceptance • 1 cycle T-V • Hot/Cold Deploy • Inspection • Mass Properties • DC Magnetics IDPU Thermal IDPU Acceptance • 2 cycles T-V • Bake-out +60 C • Inspection • Mass Properties • DC Magnetics EFI SPB Deploy EFI Functional (Level 2) EFI/SCM/FGM Phasing Payload T-V Payload Vibration Payload Acceptance • Sensor in Mu Metal Payload EMI/EMC/MAGl • 6 cycles T-V • EFI Functional (Lev 1) THEMIS Instrument CDR SPB Thermal 21 • ONLY if req’d (workmanship) • Test Review UCB, April 19 -20, 2004

Instrument I&T with SC Berkeley to Provide: • GSE Equipment for independent verification instrument operation. • Purge monitoring support • Safety control support (securing of deployable items etc) THEMIS Instrument CDR 22 UCB, April 19 -20, 2004

Instrument Delivery to SC Schedule – Overview of Key Dates • • ETU: I & T 7/04 – 8/04 Integrating and Testing Flight Units Fall 2004 – Spring 2005. Delivery P 1: 2/10/05 Delivery P 2: 4/6/05 Delivery P 3: 5/4/05 Delivery P 4: 6/6/05 Delivery P 5: 7/1/05 With each instrument suite we deliver harnesses, GSE computer, booms, sensors in protection boxes. THEMIS Instrument CDR 23 UCB, April 19 -20, 2004

Issues Transportation/Shipping Berkeley to Swales • Ground or commercial air? Under consideration. Access for Red/Green Tag Instrument Items when all probes on PCA • Logistics and timing of removal/addition of red and green tag items still to be detailed. Detailed I & T Plans, Functional Procedures, etc. • In development. THEMIS Instrument CDR 24 UCB, April 19 -20, 2004