IMD series Iljin Metal bond Diamond ILJIN DIAMOND

IMD series Iljin Metal bond Diamond ILJIN DIAMOND Co. , Ltd. Diamond

IMD series IMD-G IMD-F IMD-D Sawing of granite & ceramic tiles Core drill of glass Rough polishing of granite Crystal & glass decorating groove Reinforced glass edge Ferrite motor core CMP pad conditioner Silicon nitride OD grinding Middle stage grinding of Crystal & granite IMD-B IMD-A Glass (Normal, TFT -LCD, Motor) edge Fired tungsten carbide Cut-off wheel for crystal or glass Dental burrs Final polishing of granite Beveling of glass and mirror Cut-off wheel for glass & quartz Ferrite grinding Diamond

Toughness Index 80 Toughness Index 70 60 G F 50 D 40 B 30 20 10 A TP IGD II 80/100 100/120 120/140 140/170 170/200 200/230 230/270 270/325 325/400 400/500 Mesh Size Diamond

Grades equivalent IMD-G IMD-F IMD-D IMD-B IMD-A MBG-660 MBS-640 MBG-620 MBG-610 PDA-999 PDA-989 PDA-878 PDA-P 768 Diamond

Shape comparison As-grown Product IMD-TP Crushed Products IGD-II IGD-V Diamond

Ti coating MESH Weight Percent Spec. 80/100 2 wt% ± 0. 5 100/120 3 wt% ± 0. 5 120/140 4 wt% ± 0. 5 140/170 5 wt% ± 0. 5 170/200 6 wt% ± 0. 5 200/230 7 wt% ± 0. 5 230/270 8 wt% ± 0. 5 270/325 9 wt% ± 0. 5 325/400 10 wt% ± 0. 5 400/500 11 wt% ± 0. 5 Diamond

Ferrite Motor Core Grinding C Test Condition Area : Wheel Type : Bond : Workpiece Material : Mesh Size : Concentration : Peripheral Speed : DOC : Feed rate : Japan N/A Electroplated Ferrite motor core 100/120 N/A N/A A B D Company Diamond

Glass Grinding Test Condition Area : Japan Wheel Type : N/A Bond Material : Bronze (Cu-Sn) Work piece Material : Glass Mesh Size : 170/200 Concentration : N/A Peripheral Speed : N/A DOC : N/A Feed rate : N/A Diamond

Safety Glass Grinding Korea Industry Automotive Part Name Safety Glass Operation Glass Edge Grinding (Bando) Workpiece Material Glass Wheel Specific Metal Bond Φ 200 x 4 w x 75 H x 11 t Diamond & c. BN IMD-F Ti (Ti Coating) Process Parameters Metal Bond Wheel Vs : 1600 m/min Feed rate : 10~20 m/min Remark Part/hr (ea) Results 250 14000 200 12000 Wheel Life (m/wheel) Area 150 100 50 0 STD IMD-FTi 10000 8000 6000 4000 2000 0 STD IMD-FTi Diamond

Ti coated wheel grit ILJIN DIAMOND Co. , Ltd. Grit Business Unit Diamond

3. TRS test result Kg/mm 2 　 New coating As-is #1 1. 72 1. 32 #2 1. 96 1. 47 #3 1. 75 1. 43 #4 1. 61 1. 50 #5 1. 66 1. 60 Avg 1. 74 1. 46 2 Sintering Condition Bond system: 50%Cu-20%Sn 30%Fe Sintering Temp: 700℃/2 min TRS Test-Kgf/mm 3. 0 1. 74 Transverse Rupture Strength Test Dia grade/size: IMD-FTi 170/200 mesh Concentration: 100 Segment size: 6. 4*40 mm TRS M/C: ZWICK Z 050 Test condition: ISO B Type 1. 46 0 New coating As-is Diamond

Diamond for CMP Pad conditioner ILJIN DIAMOND Co. , Ltd. Diamond

Trend of CMP Process Metal vs. Oxide CMP : Million $ CMP growth by material § Metal CMP의 성장속도가 높으며, 이 중 Cu CMP의 성장율이 높음. § Cu CMP에서 scratching issue 및 고집적화에 의한 diamond의 fine, narrow 경향 심화 § Metal CMP에서 Diamond의 Shape, Narrow PSD, Diamond purity의 중요성이 강조 Diamond

CMP Process Logic Memory § Memory Semiconductor와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond는 틀리게 적용 Diamond

Tech. Trend of CMP Conditioner Typical Type of CMP Conditioner Pattern, Narrow Size, Special Shape • CMP Conditioner에서 요구되는 Cutting Rate가 높아지고, 고 집적화 되면서 Diamond는 fine, narrow한 PSD가 요구됨. • Conditioning 효과를 높이기 위하여 pattern 및 diamond의 돌출높이는 높이기 위한 개발, 적용 진행 중 Diamond

Tech. trend of diamond for CMP As was Coarse size 80/90 90/100 Blocky shape IMD – F, D PDA 999 MBG 660 As is Increased number of particles (High Density) Higher Cutting Rate (CR) Medium / fine size 100/120 140/170 170/200 200/230 Angular shape IMD – B, A, TP PDA 878 MBG 620 Diamond

Special process for CMP only PSD Shape § Narrow PSD (Double size → Single mesh → Micron size) § Over size particle removing process (3 stage sieving at clean room) § Precision heating control (HPHT) § Perfect shape sorting and consistency Impurity § Minimized metal inclusions using high magnetic field § Suitable for electroplating and vacuum brazing process Special Treatment – II § Removing the twin, sharp needles and weak crystal § No damage of normal crystal’s sharp edge § To prevent the Ni over plating and nodules on diamond crystal § Perfectly clean and non electric conductivity on the surface of diamond § De-magnetizing Diamond

Pressure (GPa) Shape – HPHT technology 6. 5 (100) 6. 0 (111)+(100) (111) (110) 5. 5 1300 1400 1500 Temp (0 C) A B C D E F G H I Diamond

Shape – HPHT technology IMD-F IMD-T Diamond

Shape – Sorting technology IMD-G IMD-F IMD-D IMD-B IMD-A IMD-TP Diamond

Special treatment I IMD-NB 1 IMD-NA 1 IMD-NB 2 IMD-NA 2 Diamond

Special treatment II Diamond

Special treatment II Metal impurities on the surface of diamond grit for CMP Element ILJIN 2 hrs 4 hrs DI 8 hrs 2 hrs (unit : ppb) E 6 4 hrs 8 hrs 2 hrs 4 hrs 8 hrs Li - - 0. 00 0. 01 Na 1. 54 1. 28 1. 22 1. 79 3. 37 3. 76 13. 34 12. 39 14. 53 Mg 0. 80 0. 89 1. 00 0. 13 0. 21 0. 20 6. 66 6. 02 6. 61 Al 0. 42 0. 39 0. 47 0. 34 0. 61 0. 33 0. 43 0. 50 K 0. 04 - - 0. 15 - - 2. 17 2. 25 2. 36 Ca 1. 22 1. 83 1. 94 1. 47 2. 01 2. 12 55. 72 54. 72 58. 23 Cr 0. 12 0. 36 0. 35 4. 71 4. 58 0. 52 9. 80 10. 52 Mn 0. 21 0. 27 0. 25 0. 10 0. 41 0. 44 0. 07 1. 14 1. 42 Fe 7. 25 23. 02 30. 47 5. 19 31. 41 44. 57 14. 38 97. 34 135. 27 Co - - - 0. 01 0. 03 0. 04 0. 01 0. 13 0. 15 Ni 1. 08 4. 30 6. 82 1. 39 5. 79 9. 25 4. 78 20. 64 31. 59 Cu 0. 92 0. 93 0. 83 1. 96 2. 23 2. 39 0. 28 0. 38 0. 44 Zn 0. 80 1. 10 1. 29 0. 67 0. 90 1. 15 0. 52 1. 36 1. 92 As 0. 01 - - - 0. 01 0. 02 Sr 0. 03 0. 01 0. 03 0. 17 0. 18 Cd 0. 01 0. 00 0. 05 0. 02 Ba 0. 03 0. 01 0. 04 0. 05 1. 17 1. 20 Pb 0. 81 0. 77 0. 69 0. 06 0. 13 0. 14 0. 35 0. 43 0. 48 Diamond

Special treatment II Metal impurities on the surface of diamond grit ILJIN DI E 6 150 135. 27 100 58. 23 (ppb) 50 44. 57 31. 59 30. 47 14. 53 10. 52 10 9. 25 6. 82 4. 58 3. 76 2 1. 94 2. 39 2. 12 1. 22 0. 83 0. 44 0. 35 0 Na Ca Cr Cu Fe Ni Diamond

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