IBM System p 570 2007 6 30 IBM

IBM System p 570 서버 제안서 2007. 6. 30 한국 IBM 시스템 & 테크놀러지 그룹 (TSS, Techline)

IBM System p 570 서버 표준제안서 목차 1. IBM System p 570 서버 소개 (특장점 포함) 2. IBM P 5/6 UNIX 서버 제품 군 3. IBM System p 570 서버 사양 4. IBM System p 570 서버 성능 5. IBM System p 570 서버 아키텍쳐 6. P 570. vs. P 5 570

IBM System p 570 서버 표준제안서 1. IBM System p 570 서버 소개 제품 특징 § 19 -inch rack-mount packaging § Building block 구조의 2개 ~ 16개-core SMP design § 64 -bit 3. 5, 4. 2 or 4. 7 GHz POWER 6 processor cores § Mainframe 에서 이어져온 RAS 기능 § 동적 LPAR 기능 § Advanced POWER Virtualization (옵션) – AIX 5. 3 이상 §IBM 마이크로 파티셔닝™ (up to 160 micropartitions) § 공유 프로세스 풀 § 가상 I/O 서버 § 파티션 유동화 기능 (Mobility) – 2007년 말 정 제공 예 *Available as separately-priced software product § 최대 32개(7314 -G 30 경우) I/O § Partition Mobility : The announcement of this item is an IBM drawers Statement of가능 General Direction. All statements regarding IBM’s future direction and intent are subject to change or § 준 연속without 작업(HA)을 IBM withdrawal notice, 위한 and represent goals and objectives © Copyright IBM Corporation 2007 3 only.

IBM System p 570 서버 표준제안서 1. IBM System p 570 서버 소개 IBM System p 570 사양 표준 구성 빌딩 블록 당 최대 Processor cores 첫 번째 빌딩 블록에 2개 또는 4개의 64비트, 3. 5, 4. 2 또 16개의 64비트 3. 5, 4. 2 또는 4. 7 GHz POWER 6 는 4. 70 GHz POWER 6 프로세서, 다른 블록에 모두 4개 의 프로세서 캐시 코어 당 4 MB L 2 cache 시스템 당 64 MB L 2 cache Cache 두개 코어 당 32 MB L 3 cache 공유 시스템 당 256 MB L 3 cache 메모리 2 GB to 48 GB of 667 MHz buffered DDR 2 또는 16 GB to 192 GB of 667 MHz buffered DDR 2 또는 RAM (memory) 16 GB to 96 GB of 533 MHz buffered DDR 2 또는 128 GB to 384 GB of 533 MHz buffered DDR 2 또는 32 GB to 192 GB of 400 MHz buffered DDR 256 GB to 768 GB of 400 MHz buffered DDR 2 내장 디스크 베이 6개 SAS drives 24개 SAS drives 내장 디스크 스토리지 최대 1. 8 TB (30. 6 TB I/O drawers 장착 시 ) 최대 7. 2 TB (79. 2 TB : I/O drawers 장착 시 ) 미디어 베이 (옵션) 1개 핫 플러그 슬림형 4개 핫 플러그 슬림형 PCI 어댑터 슬롯 4개 PCI Express 8 x slots; 2개 PCI-X DDR @ 266 MHz. 16개 PCI Express 8 x slots; 8개 PCI-X DDR @ 266 MHz. All slots are blind-swap 프로세서 코어 © Copyright IBM Corporation 2007 6

IBM System p 570 서버 표준제안서 1. IBM System p 570 서버 소개 IBM System p 570 사양 표준 구성 빌딩 블록 당 최대 Standard I/O adapters Ethernet Standard: 1개 dual-port Gigabit Ethernet and 2개 system ports 또는 4개 dual-port Gigabit Ethernet and 2개 system ports 또 는 Options: 1개 quad-port Gigabit Ethernet 와 1개 system port 또는 Options: 1개 dual-port 10 Gigabit Ethernet and 1개 system port 4개 quad-port Gigabit Ethernet and 1개 system port 또 는 4개 dual-port 10 Gigabit Ethernet and 1개 system port Integrated disk 1개 SAS controller 4개 SAS controllers Other ports 2개 USB; 2개 HMC; 2개 SPCN 8개 USB; 2개 HMC; 8개 SPCN 확장 기능-Expansion features (optional) I/O 확장 최대 8개 I/O drawers 최대 20개 I/O drawers ( 7311 -D 11, 7311 -D 20의 조합 또는 이거나 7314 -G 30) (7311 -D 11 and 7311 -D 20) 또는 최대 32개 7314 -G 30 ** Not all configuration options are available Connectivity support 4 Gigabit Fibre Channel ; 10 Gigabit Ethernet ; 12 x GX HCA ; Ultra 320 SCSI GX slots 2개 (second slot shares space with one PCI Express 8 x 8 개 slot과 함께 두번 째 슬럿 공유 ) © Copyright IBM Corporation 2007 7

IBM System p 570 서버 표준제안서 1. IBM System p 570 서버 소개 IBM System Power 6 570 사양 System p Virtualization Technologies POWER Hypervisor 동적 LPAR, 가상 LAN（메모리에서 메모리로 파티션 간 통신） - AIX 5 L V 5. 3 이상 Advanced POWER Virtualization (옵션) 마이크로 파티셔닝, 프로세서 풀 공유, 가상IO서버, 파티션 Mobility- only 2007년 말 제공 예정 Do. D 프로세서 CUo. D (Capacity on Demand) 메모리 CUo. D features (옵션) 프로세서 Co. D 켜기/끄기 메모리 Co. D 켜기/끄기 Utility Co. D (2007. 3 Q 이후) 시험적 프로세서 Co. D 시험적 메모리 Co. D 운영 체제 AIX 5 L V 5. 2 이상 SUSE LINUX Enterprise Server 10 SP 1 for POWER （SLES 10 SP 1 )이상 Red Hat Enterprise Linux 4 update 5 for POWER （RHEL AS 4. 5）이상 -2007 3/4분기 시작 소비 전력 200 V ~ 240 V AC 시스템 규격 p 570 빌딩 블록 : 6. 85"H (4 U) x 19. 0"W x 32. 4"D (174 mm x 483 mm x 824 mm); 무게: 140. 0 lb (63. 6 kg) -Weight will vary when disks, adapters and peripherals are 7311 -D 11 I/O drawer: 6. 9"H (4 U) x 17. 5"W x 28. 0"D (175 mm x 445 mm x 711 mm); 무게: 86. 0 lb (39. 1 kg) installed. 7311 -D 20 I/O drawer: 7. 0"H (4 U) x 19. 0"W x 24. 0"D (178 mm x 482 mm x 610 mm); 무게 101. 0 lb (45. 9 kg) 7314 -G 30 I/O drawer: 7. 0"H (4 U) x 17. 5"W x 24. 0"D (178 mm x 445 mm x 610 mm); 무게 101. 0 lb (45. 9 kg) 보증 (varies by country) © Copyright IBM Corporation 2007 오전 8시 ~ 오후 5시, 1년간 무료 NBD（next-business-day） 서비스（제한적), 특정 부품의 경우 현 장 교체, 그 밖의 모든 부품（국가에 따라 다름）은 CRU（고객 교체 품목）입니다. 보증 서비스 업그 레이드 및 관리가 가능 8

IBM System p 570 서버 표준제안서 2. IBM UNIX 서버 제품 군 IBM UNIX 서버 Line-up System p 570 § 1개에서 최대 64개까지의 core를 제공하는 중소형 서 버에서 대형 서버까지의 Full Line up § IBM Power 5+, Power 6 chip 테크놀러지를 기반으로 하는 최신 듀얼코어 및 쿼드코어 chip 을 장착 한 제품 System p 5 575 § AIX 5 L 과 Linux OS 최적화 제공 70개 이상의 업계 최고 벤치마크 성능 보유 !!! * System p 5 185 Express System p 5 510 & 510 Q Express System p 5 520 & 520 Q Express System p 5 590/595 System p 5 570 System p 5 550 & 550 Q Express System p 5 560 Q Express System p 5 505 Express IBM Blade. Center JS 20 & JS 21 제품 라인업 : 2007년 6월 기준 *Source for ~(R) p 5 systems benchmarks: http: //ibm. com/eserver/benchmarks 3. Uses Power. PC 970 processor © Copyright IBM Corporation 2007 IBM Intelli. Station POWER 185 & 285 Express 10

IBM System p 570 서버 표준제안서 3. IBM System p 570 서버 사양 IBM System p 570 설치 환경 CEC enclosure(1개 기준) 구 분 랙 unit 크기 무게 적정 운영 온도 운영 전압 운영 주파수 최대 소비 전력 소음 상대 습도 최대 발열량 © Copyright IBM Corporation 2007 4 U 높이 174. 1 mm 너비 483 mm 깊이 824 mm 본체 63. 6 Kg 5` - 35` degrees C operating 5` ~ 45` degree C non-operating 단상, 200 -240 volts AC 50/60 Hz 1400 W maximum (4 core 운영 / enclosure) 3. 5, 4. 2 GHz processor 7. 1 bels (with acoustic rack doors : 6. 7 bls) 4. 7 GHz processor 7. 4 bels (with acoustic rack doors : 6. 9 bls) 8 % ~ 80 % operating 5% ~ 100% non-operation 4778 Btu/hr maximum (4 core 운영 / enclosure) 13

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 성 능§ 세계 최초 16 core 시스템으로는 유일하게 1, 600, 000 이상 의 tpm. C 성능 돌파 § http: //www. tpc. org/tpcc/results/tpcc_perf_results. asp § http: //www-03. ibm. com/systems/p/hard 128=31 K/core 64=62 K/core 64=50 K/core 16=100 K/core 64=50 K/core 32=39 K/core 64=19 K/core © Copyright IBM Corporation 2007 14

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 능 Business 성 16 core 일하게 시스템으로는 비 즈 니 스 Application Performance: SAP SD 2 -tier 유 SAP 에서 2500 saps / cores 기록 SAP SD 2 tier Benchmark – SAPS per Core Technology SAPS per Core Vendor / System IBM POWER 6 2. 500 IBM System p 570 - 16 Core – 4, 7 GHz IBM POWER 5+ 1. 729 IBM p 570 - 16 Core - 2, 2 GHz Intel Itanium 2 725 Intel Itanium 2 1. 370 HP Integrity SD - 64 Core - 1, 6 GHz HP rx 2660 - 4 Core - 1, 6 GHz Fujitsu SPARC 64 VI 1. 143 Sun/Fujitsu SPARC Enterprise M 8000 - 32 Core - 2, 4 GHz AMD Dual-Core Opteron 1. 313 HP Pro. Liant DL 585 - 8 Core - 3 GHz Intel Quad-Core XEON 1. 100 IBM System x 3250 - 4 Core - 2, 13 GHz Sun Ultra. Sparc IV+ 642 Sun Fire E 6900 - 48 Core - 1, 95 GHz Sun Ultra. Sparc T 1 598 Sun Fire T 2000 - 8 Core - 1, 2 GHz © Copyright IBM Corporation 2007 15 자료 출처 : Source: www. sap. com/benchmark/ All results as of 05/22/2007; see accompanying table for additional detail

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 성 능 IBM system p 570시스템으로 동일 코어 수 비교 시 경쟁사 대비 탁월한 비 용 대비 $/Tpm. C 및 TPC-C: System p with POWER 6 SPECjbb 2005 성능비 제공 Java: System p with POWER 6 TPC-C SPECjbb 2005 System (Processor, Chip/Core/Thread) tpm. C Avail. $/tpm. C System (Processor, Cores) BOPS Date. BOPs/JVM IBM p 570 (4. 7 GHz POWER 6 ™, 16/32/64) IBM p 5 -595 (2. 3 GHz POWER 5+™, 32/64/128) HP Superdome (1. 6 GHz Itanium 2, 64/128/256) 1, 616, 162 4, 033, 378 4, 092, 799 11/21/07 01/22/07 8/23/07 $3. 54 $2. 97 $2. 93 IBM p 570 (4. 7 GHz POWER 6 ™, 16 -core) IBM p 5 -570 (2. 2 GHz POWER 5+™, 16 -core) Sun Fire E 6900 (1. 95 GHz Ultra. SPARC VI+, 48 -core) Sun Enterprise M 8000 (2. 4 GHz SPARC 64 VI, 32 -core) 691, 975 326, 651 354, 733 440, 207 2007/05 2006/03 2007/04 2007/05 86, 497 40, 831 22, 171 27, 513 자료 출처 : Source: www. tpc. org/ All results as of 05/22/07 © Copyright IBM Corporation 2007 16

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 성 능Power 6 Core 를 탑재한 Server가 Workload에 대한 성능 비교 보고서 에서 주요 모든 종목 석권 - Gland Slam § SPECjbb 2005 comparisons (Source: http: //www. spec. org/ IBM p 570 POWER 6 results to be submitted on 5/21/07: All other results as of 04/27/07) • IBM POWER 6 p 570 (8 chips, 16 cores) @ 4. 7 GHz with 691, 975 bops (86, 497 bops/JVM) and 43, 125 bops per core • Fujitsu PRIMEQUEST 580 (32 chips, 64 cores) @ 1. 6 GHz with 1, 214, 251 bops (75897 bops/JVM) and 18, 974 bops per core • Sun Fire M 8000 (16 chips, 32 cores) @ 2. 4 GHz with 440, 207 bops (27, 513 bops/JVM) and 13, 756 bops per core • Fujitsu RX 800 (8 chips, 16 cores) @ 3. 5 GHz with 336, 653 bops (42, 082 bops/JVM) and 21, 041 bops per core • Fabric 7 Q 80 (8 chips, 16 cores) @ 2. 6 GHz with 180, 418 bops (22, 552 bops/JVM) and 11, 276 bops per core • TPC-C comparisons (Source: www. tpc. org/ IBM p 570 POWER 6 result to be submitted on 5/21/07; All other results as of 04/27/07) • IBM POWER 6 p 570 (8 chips, 16 cores, 32 threads) @ 4. 7 GHz with tpm. C of 1, 616, 162 @ $3. 54 $/ tpm. C with availability of 11/20/07 and 101, 010 tpm. C per core • HP Integrity Superdome (64 chips, 128 cores, 256 threads) @ 1. 6 GHz with tpm. C of 4, 092, 799 @ $2. 93 $/ tpm. C with availability of 8/23/07 and 31, 953 tpm. C per core • Unisys ES 7000 (8 chips, 16 cores, 32 threads) @ 3. 4 GHz with tpm. C of 520, 467 @ $2. 73 $/ tpm. C with availability of 5/1/07 and 32, 529 tpm. C per core • SPECint_rate 2006 (Source: http: //www. spec. org/ IBM p 570 POWER 6 results to be submitted on 5/21/07: All other results as of 04/27/07) • IBM POWER 6 p 570 (4 chips, 8 cores) @ 4. 7 GHz with 240 and 30 per core • HP rx 6600 (4 chips, 8 cores) @ 1. 6 GHz with 102 and 12. 75 per core • Sun Fire M 8000 (16 chips, 32 cores) @ 2. 4 GHz with 298 and 9. 3125 per core • Fujitsu RX 300 (4 chips, 8 cores) @ 2. 66 GHz with 91. 2 and 11. 4 per core • HP Pro. Liant DL 585 (4 chips, 8 cores) with 98. 3 and 12. 29 per core • SPECfp_rate 2006 (Source: http: //www. spec. org/ IBM p 570 POWER 6 results to be submitted on 5/21/07: All other results as of 04/27/07) • IBM POWER 6 p 570 (4 chips, 8 cores) @ 4. 7 GHz with 213 and 26. 625 per core • HP rx 7640 (4 chips, 8 cores) with 90. 8 and 11. 35 per core • Sun Fire M 8000 (16 chips, 32 cores) @ 2. 4 GHz with 313 and 9. 7813 per core • Fujitsu RX 300 (4 chips, 8 cores) @ 2. 66 GHz with 60. 9 and 7. 61 per core • HP Pro. Liant DL 585 (4 chips, 8 cores) with 91. 3 and 11. 41 per core © Copyright IBM Corporation 2007 17

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 타사 제품 비교 : 성 능 / SUN 관리, SW 비용 IBM / 시스템 점유 공간 HP IBM 60% 사용률 20% 사용률 § 480 total cores @ 1. 5 GHz § $5, 625 annual space costs @ $62. 50 sq ft § $113, 607 annual energy costs @ $0. 09 / k. Whr § 32 total cores @ 4. 7 GHz § $375 annual space costs @ $62. 50 sq ft § $13, 667 annual energy costs @ $0. 09 / k. Whr § 240 total cores @ 1. 6 GHz §$38, 538 annual energy costs @ $0. 09 / k. Whr §$1, 500 annual space costs @ $62. 50 sq ft ** 잠재적 비용 절감 부문 + 최대 90% 의 점유 공강 절약 + + + 최대 87% 의 전력량 절약 + core 당 최대 90% 의 SW 비용 절감 core 당 최대 85% 의 SW 비용 절감 최대 75% 의 점유 공강 절약 최대 65% 의 전력량 절약 최대 14% 의 성능 향상 *Datacenter floor space cost was estimated as of 5/3/2007 based on Alinean, Inc. ’s ROI Analyst software. The reduction, if any, in floor space, power, cooling and software costs depends on the specific customer, environment, application requirements, and the consolidation potential. SPEC® results source: www. spec. org as of 05/22/2007: System p 570 (16 -core, 4. 7 GHz): SPECint_rate 2006: 478, HP Integrity rx 7640 16 -core, 1. 6 GHz SPECint_rate 2006: 167 Energy cost of $. 0928 per k. Wh is based on 2007 YTD US Average Retail price to commercial customers at $. 0928 per US DOE at http: //www. eia. doe. gov/cneaf/electricity/epm/table 5_6_b. htm as of 05/18/2007 *Datacenter floor space cost was estimated as of 5/3/2007 based on Alinean, Inc. ’s ROI Analyst software. Energy cost of $. 0928 per k. Wh is based on 2007 YTD US Average Retail price to commercial customers at $. 0928 per US DOE at http: //www. eia. doe. gov/cneaf/electricity/epm/table 5_6_b. htm as of 05/18/2007 The reduction, if any, in floor space, power, cooling and software costs depends on the specific customer, environment, application requirements, and the consolidation potential. Sun system power requirements based on http: //www. sun. com/products-n-solutions/hardware/docs/html/817 -3956 -12/system_specs. html#pgf. Id-1001301 Air conditioning power requirement estimated at 50% of system power requirement. SPEC® results source: www. spec. org as of 05/22/2007: System p 570 (16 -core, 8 chips, 2 chips per core, 4. 7 GHz): SPECjbb 2005 691, 975 bops 86497 bops/JVM; Sun Fire v 890 (16 -core, 8 chips, 2 chips per core) 1. 5 GHz SPECjbb 2005 117, 986 bops, 29, 497 bops/JVM © Copyright IBM Corporation 2007 § 32 total cores @ 4. 7 GHz § $13, 254 annual energy costs @ $0. 09 / k. Whr §$375 annual space costs @ $62. 50 sq ft 18

IBM System p 570 서버 표준제안서 4. IBM System p 570 서버 성능 시스템 P 에 대한 ISV (Independent S/W Vendor) 의 평가 세계 유명의 독립적인 은 평가 와 찬사. ISV 회사 © Copyright IBM Corporation 2007 S/W Vendor로 부터 시스템 P의 성능과 기능에 대한 높 IBM 시스템 P에 대한 평가 Comment "In recent testing, we demonstrated how KANA IQ can take advantage of IBM’s Advanced POWER™ Virtualization and micro-partitions to help reduce overall system resources …. ” --Charlie Isaacs, CTO 기능 “IBM has tested the System p 570 server using the Oracle Application Standard Benchmark and the results demonstrate outstanding performance. -- Carolyn Chambers, Group Vice President, Application Platforms, Quality and Release 성능 “SAS is pleased to team with IBM to offer SAS BI solutions that run on IBM’s next generation of System p™ server. ” -- Scott Van Valkenburgh, Director of Global Platform and ISV Partners 기능 “In a recent test of the Sybase Risk Analytics Platform using our Sybase IQ analytics engine, the new 8 -core system demonstrated a 58 percent performance improvement in mixed query workloads over the IBM System p 5™ 570 server based on POWER 5+™ processor technology. ” -- Raj Nathan, SVP and Chief Marketing Officer 성능 “The enhancements continue to demonstrate IBM’s leadership in UNIX® servers… We are looking forward to supporting the first p 570 customers. ” -- Douglas Kim, Managing Director, Global Partners and Alliances, Pega. Systems 기능 “SAP Net. Weaver 7. 1 implements industry standard support for Hardware Decimal Floating-Point (DFP). The new POWER 6 hardware DFP acceleration feature provides an ideal hardware environment for the execution of SAP-related DFP operations. ” -- Stephan Rossius, Senior Vice President, Global Partner Management 기능 19

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 Power 6 프로세서 아키텍쳐 POWER 6 design POWER 5+ POWER 6 Chip 내부 design 특징 Frequenc. Transistors 간격 ies 3. 5, 4. 2 and 4. 7 GHz >750 M . 065 Micron 1. 5, 1. 9 and 2. 2 GHz 276 M . 090 Micron § Ultra-high frequency dual-core chip: > 3. 5 GHz -. 7 -way superscalar, 2 -way SMT core -. 8 execution units 2 LS, 2 FP, 2 FX, 1 VMX, 1 DP -. 790 M transistors, 341 mm 2 die -. 2 x 4 MB on-chip L 2 – point of coherency -. On-chip L 3 directory and controller § Technology -. CMOS 65 nm lithography, SOI Cu § High-speed elastic bus interface at 2: 1 freq § Full error checking and recovery § Dynamic power saving -. Advanced Clock gating 65 나노 기술의 특징 30% performance improvement over 90 nm at constant power § 65 nm SOI technology with 10 levels of metal (low-k dielectric on first 8 levels) § Pitches: 180 nm M 1, 200 nm M 2 to M 4, 400 nm M 5 -M 6, 800 nm M 7 -M 8, and 1600 nm M 9 -M 10 § 250 nm contacted gate pitch § 35 nm gate length, 1. 05 nm gate dielectric thickness § dual stress liners 0. 65 um 2 high-performance SRAM cell © Copyright IBM Corporation 2007 20

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 Power 6 프로세서 아키텍쳐 POWER 6 design POWER 5+ design POWER 6 § Chip 주요 POWER 5™와 동일한 에너지 사용 하 에서 업계 최초로 4 GHz이상의 프로세 서 속도 구현 § 이전 시스템과의 바이너리 호환성 유 지 § 8 MB의 On-Chip L 2 Cache와 2개의 On-Chip 메모리 컨트롤러 § § § 9개의 실행 단위 – 2 Fixed Point, 2 Load/Store, 2 Binary Floating Point, 1 Decimal Floating Point, 1 Branch, 1 SIMD (VMX) 더 향상된 동시 다중실행 쓰레드 (SMT) – 한 쓰레드에서 싸이클당 최대 5 개의 인스트럭션 실행 – 동일 싸이클의 다른 쓰레드에서 최대 2개의 추가 인스트럭션 실 행 POWER 4/POWER 5 아키텍쳐에 향상 © Copyright IBM Corporation 2007 특징 Frequenc. Transistors 간격 ies 3. 5, 4. 2 and 4. 7 GHz >750 M . 065 Micron 1. 5, 1. 9 and 2. 2 GHz 276 M . 090 Micron POWER 6 Chip ~ 4 -5 GHz POWER 6 SMT 2 Core 4 MB L 2 POWER 5/+ Chip 1. 5 -2. 3 GHz POWER 5 SMT 2 Core ~2 MB L 2 32 MB L 3 Chip(s) 32 MB L 3 Controller SMP Interconnect Fabric 36 MB L 3 Controller SMP Interconnect Fabric Memory Controller Buffer Chips 21 1. 5 -2. 3 GHz Memory Controller Buffer Chips 36 MB L 3 Chip

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 Power 6 프로세서는 한층 강화된 동시간 처리 멀티쓰레딩(Simultaneous Multithreading) 기술을 통해 보다 향상된 시스템의 효율화를 제공한다. POWER 6 Enhanced Simultaneous Multithreading FX 0 FX 1 LSO LS 1 FP 0 FP 1 VMX DP Thread 0 active No thread active Thread 1 active Appears as four CPUs per chip to the operating system (AIX 5 L™ V 5. 3 and Linux®) System throughput POWER 5 Simultaneous Multithreading ST POWER 5 POWER 6 SMT 사용함 § 사용하지 않던 실행 단위 사이클(unused execution unit cycles) § 기 존재 트랜지스터의 재사용. vs. 새로 추가된 트랜지스터의 성능 § (Reuse of existing transistors vs. Performance from additional transistors) § 소프트웨어적인 symmetric multiprocessing (SMP) programming 모델 제시 § 프로세서 당 두개의 쓰레드 처리(Dispatch two threads per processor) : “It’s like doubling the number of processors. ” § Net result: -. 보다 향상된 성능(Better performance) © Copyright IBM Corporation 2007 22

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 § § § 상 세 – 내부: POWER 6 570 Processor Dual-core chip 2 -way SMT core Ultra High Frequency 3. 5 – 5 GHz > 750 M Transistors Superscalar Large On-chip L 2 cache 2 * 4 MB § On-Chip L 3 directory & controller § Memory Controllers on-chip § Alti. Vec. TM / SIMD Instructions § Hardware Decimal floating Point § Power-Management capabilities POWER 6 3. 5 -5. 0 GHz Alti. Vec Cache Advanced System Features Very High Frequencies 4 -5 GHz Enhanced Virtualization Advanced Memory Subsystem Alti. Vec / SIMD instructions Instruction Retry Hardware Decimal Floating Point Dynamic Energy Management Partition Mobility Memory Protection Keys Alti. Vec is a trademark of Freescale Semiconductor, Inc. © Copyright IBM Corporation 2007 23 § Technology -. CMOS 65 nm lithography, SOI § Error checking and recovery POWER 5 / 5+ 1. 65+ GHz Core 1. 9 GHz 1. 5+ Core GHz Core Shared L 2 Shared. Distributed L 2 Switch Distributed Switch 2. 3 GHz POWER 5+ Enhanced Scaling Simultaneous Multi-Threading (SMT) Enhanced Distributed Switch Enhanced Core Parallelism Improved FP Performance Increased memory bandwidth Reduced memory latencies Virtualization

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 상 세 – 내부: POWER 6 570 Processor Card § Dual-core SCM (Single Chip Module) in Ceramic package – Includes Memory Controller plus L 3 Cache Directory and Controller § 32 MB L 3 cache SCM – 16 -way Associativity § Up to 3 QUADS of DDR 2 Memory DIMMs at higher frequency – Every CPU card must have at least 2 GB of Memory installed L 3 cache Memory DIMMs Buffer chip CPU DDR 2 Memory 0. 5 -32 GB GX+ bus SMP Flex-bus connector Fabric connector IBM System p 6 570 Processor card : Dual-Core Module © Copyright IBM Corporation 2007 24

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 상 세 – 내부: 훨씬 많아진 메모리 quantity 및 bandwidth 와 향상된 메모리 기능 Memory POWER 6 RAS 570 12 DIMM Sockets Memory installed in QUADS DDR-II at 400, 533, 667 MHz Max 96 GB ( 12 * 8 GB ) Buffer Chip on Each DIMM card – Both data and commands are re-powered through a buffer Buffer Chip Cascaded bus structure – One DIMM re-powers and drives the next, allowing multiple commands at once Improved RAS – IBM proprietary fault detection and correction Buffer Chip: The next generation Synchronous Memory Interface ASIC that connects memory controllers to DDR-II memory devices which implements the above features. It may reside on the memory module (DIMM) itself to buffer the address/command as well as data or in the case of the p 570 “upgrade” systems, on the processor board. Memory : RAS 기능 § Fault Isolation Register and error detection § Service Processor Interface § Attention Indicator to Service Processor Interface § ECC Protection on all controller busses § Segment level sparing on controller busses § Support for system level main store data ECC § Clock generation logic Built-in Self Test (BIST) § Memory Card Built-in Self Test (BIST) © Copyright IBM Corporation 2007 RAS Function System p ECC Detection ECC Correction 2 -bit or 2, 8 -bit packets 1 -bit or 1, 8 bit packet 25 Steering Bit Chipkill Detection 2 -bit or 2, 4 -bit packets Yes, 2, 8 -bit packets (Chips) Chipkill Lane Correction Steering Sparing Yes, 1, 8 -bit packet (Chip) Yes, 1 Chip 1 each direction

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 상 세 – 내부 : 훨씬 많아진 메모리 슬롯 quantity 및 Bandwidth 와 향상된 메모리 RAS 570 기능 Memory POWER 6 증가 Buffer Chip DIMM slot SCM @3. 5 – 4. 7 Ghz Up to 96 DDR 2+ Memory 2 Cores / book P 5 -570+ DCM@ 2. 2 Ghz Up to 64 GB DDR 2 Memory 2 Cores / book P 5 -570+ DCM@ 1. 9 Ghz Up to 32 GB DDR 2 Memory 2 Cores / book © Copyright IBM Corporation 2007 26 최대의 Memory 가용성을 위해 50% 이상 확장된 DIMM 슬롯

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 상 세 – 외부 전면 • § 4 U p 570 시스템 드로어 6개의 SAS DASD 드라이브 • 1개의 SAS & SATA DASA 콘트롤러 / Media Controller • SAS 핫 스왑 가능 디스크 드라이브 : - 15 K rpm: 73 GB, 146 GB, 300 GB • Internal 디스크 최대 용량 1. 8 TB (7. 2 TB : I/O 드로어 추가시) Operator Panel CPU 프로세서/메모리 북 Slimline DVD media Minimum of 3 DC-DC Regulators for 4. 2 & 4. 7 GHz CPUs Minimum of 2 DC-DC Regulators for 3. 5 GHz CPUs * 16 코어 시스템에서 추가 I/O 드로어 구성시 최대 79. 2 TB © Copyright IBM Corporation 2007 27

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 제 품 상 세 – 외부 후면 § 4 U p 570 시스템 드로어 Dedicated GX bus slot (with RIO adapter) Integrated Virtual Ethernet (IVE) port VPD chip PCI Card slot Dual POWER Supply Hot Dedicated PCI-e slot Dedicated PCI-x slot Shared PCI-e Or GX Bus slot 2 USB ports System Serial Ports Note: GX+ slot 2 is ONLY available when 2 nd CPU card is installed © Copyright IBM Corporation 2007 SPCN ports Plug 전원공급장치 HMC ports FSP Service Processor Connector *Note: The System ports are not operative if the HMC is attached. One or the other may be used, but not both. 28

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 Mainframe으로 부터 이어진 RAS 기능 General ŸCopper & SOI Chip Technology ŸMCM Packaging ŸFFDC & Repeat Gard ŸLight Path Diagnostics ŸMicrocode Discovery Service ŸCapacity Advantage Service Processor ŸBoot time and operational surveillance ŸEnvironmental monitoring ŸLocal / remote console subsystem and line cords ŸOptional internal batteries Processor ŸDynamic Processor Deallocation ŸCEC Bus retry and recovery ŸLPAR fast reboot Cache ŸSpare L 1 & L 2 cache bits ŸSpare L 2 & L 3 directory bits ŸL 2 & L 3 cache deallocation ŸL 3 cache line delete I/O Drawers ŸRedundant I/O links ŸRedundant power supplies Memory ŸECC Chipkill. TM memory ŸSpare memory chips ŸHardware memory scrubbing ŸBook packaging Cooling Ÿz. Series N+1 Hot plug fans Disk and Adapter ŸHot swap PCI adapters ŸHot swap disk drives ŸPCI bus recovery ŸPCI bus deallocation ŸBad block relocation Hardware Management Console ŸRedundant HMC ŸService Focal Point ŸService History Log ŸPhone Home capabilities © Copyright IBM Corporation 2007 Power Ÿz. Series N+1 hot plug power 32

IBM System p 570 서버 표준제안서 5. IBM System p 570 서버 아키텍쳐 System P 서버 RAS 기능 요약 구분 장애 유형 Service Processor, First Failure Data Capture System Monitoring 자가 진단 및 통보 원격 유지보수 지원 장애 시점의 Log Data 저장 CPU/Memory 물리적 장 애 CPU Error 해결책 기능 외부 충격에 의한 파손 정전기적 장애 Book Package 물리적 충격으로부터의 보호 정전기적 장애로부터의 보호 과열 방지 사전 감지되는 장애 Dynamic CPU Deallocation Dynamic CPU Sparing (DLPAR & CUo. D) 문제의 CPU에 대한 Isolation 보유하고 있는 CPU를 활성화하여 사용 Memory Error 사전 감지되는 장애 ECC Memory Chip Kill Memory 1 bit error에 대한 Check & Correction 복수의 에러 발생시 데이터를 다른 메모리의 여분 의 공간으로 분산시켜 Error Correction을 하고 자동 적으로 Isolate됨 Main Memory, L 1, L 2, L 3 Cache의 여분의 Spare Memory bit Internal Disk 물리적 손상/노후화 Hot Swap Mirroring Shut Down 없이 교체 가능 Disk 이중화로 안정성 증대 PCI Adapter 물리적 손상/노후화 Hot Plug & Swap Dynamic Deallocation Shut Down 없이 교체 가능 문제 발생 시 자동 Isolation Power 물리적 손상/노후화 Hot Swap Redundant Fan 물리적 손상/노후화 Hot Swap Redundant Shut Down 없이 교체 가능 이중화로 안정성 증대 © Copyright IBM Corporation 2007 33

IBM System p 570 서버 표준제안서 6. p 570. vs. p 5 570 P 570. vs. P 5 570 차이점 POWER 6 P 570 이름 POWER 5 P 570 기종 명 9117 -MMA 9117 -570 서버 명 IBM System p 570 IBM System p 5 570 P 570 p 5 -570 Rack 연결 관계 Point to Point Cabling Architecture Ring Cabling Architecture DIMM 소켓 갯수 12 DIMM sockets / CPU Card 8 DIMM sockets / CPU Card DIMM Fully Buffered DIMMS DDR 2 DIMMS DASD SAS DASD (3. 0 Gbits/sec full duplex, roadmap to 12. 0 Gbits/sec) SCSI DASD (320 MBytes/Sec-Ultra 320 SCSI) 4 개 PCIe & 2개 PCI-X slots 6개 PCI-X slots 1 2 Same controller for DASD & Media Separate DASD & Media Controllers One SAS & SATA DASD / Media Controller Two DASD Controllers Integrated Virtual Ethernet(필수) 아래 중 에 1가지 선택 필수: –Two 1 Gb Ethernet ports –Four 1 Gb Ethernet ports –Two 10 Gb Optical SR Ethernet ports Two port 1 Gb Ethernet ports NO Rack Indicator Port 7310 -HMC Machine Code V 7 업그레이드 요망 필수 공식 명칭 PCI slot Media devices Media Controller Disk Controller Hosted Ethernet Adapter Rack Indicator HMC 2007. 11 Non-HMC 가능 IO Drawer 확장 © Copyright IBM Corporation 2007 7311 -D 11 I/O drawer 7311 -D 20 I/O drawer 7314 -G 30 I/O drawer-6 PCI-x 266 Mhz(기존 대비 성능 월등) 34 7311 -D 11 I/O drawer-6 PCI-x 133 Mhz 7311 -D 20 I/O drawer-6 PCI-x 133 Mhz