IB module assembly A Di Mauro CERN WP

IB module assembly A. Di Mauro (CERN) WP 6 meeting 30. 01. 2014

Requirements • • • Chip position accuracy ~ 5 mm Time ~ 2 -3 h/HIC Minimum material budget Full repeatability/reliability “Reworkability” (as much as possible) 30/01/2014 2

IB module assembly steps 1) 2) 3) 4) 5) 6) 7) Placement of chips on vacuum table and position check Placement of flex on vacuum table and alignment Placement of soldering grid on flex and alignment Sn. Ag soldering balls deposition and check Soldering of one chip and check Repeat steps 4 and 5 for all chips Final check of chips position Comments related to use of artificial vision based automated system: • Steps 1 -3: positioning/alignment done at the same time by a. v. • Step 4: soldering balls presence checked by a. v. , possibility to intervene at level of single hole • Step 5: quality of each soldering checked by a. v. and pyrometer feedback (combination to be developed) 30/01/2014 3

Automated HIC assembly system from VEA Cycle time estimation Phase Normal time (s) Pessimistic time (s) Chip placement 5. 5 8. 1 FPC placement 5. 8 8. 5 Soldering balls grid placement 5. 8 8. 5 Soldering balls placement (group of 22) 3. 8 10. 5 5 10 Laser soldering (time per contact) A) Worst case scenarios: - 9 chips → 9 x 8. 1 + 8. 5 + 9 x(4 x 10. 5) + 9 x(88 x 10) = 8388” = ~ 2 h 20’ - 2 x 7 chips → 14 x 8. 1 + 8. 5 + 14 x(4 x 10. 5) + 14 x(88 x 10) = 13039” = ~ 3 h 38’ B) Normal case scenarios (soldering time/contact ~ 5 s*): - 9 chips → 9 x 8. 1 + 8. 5 + 9 x(4 x 10. 5) + 9 x(88 x 5) = 4428” = ~ 1 h 14’ - 2 x 7 chips → 14 x 8. 1 + 8. 5 + 14 x(4 x 10. 5) + 14 x(88 x 5) = 6878” = ~ 1 h 55’ * shorter time could also be possible 27/01/2014 4

Automated HIC assembly system from VEA Assuming 100 HICs for IB and 1800 HICs for OB and 8 h working day, 220 working days / year A) 234 h for IB + 6540 h for OB -> 850 d -> ~ 4 y B) 124 h for IB + 3450 h for OB -> 450 d -> ~ 2 y 27/01/2014 5