HP Blade System c 7000 Enclosure Evolution October

HP Blade. System c 7000 Enclosure Evolution October 2014 Speaker name / Title © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

Standard Features: • 16 HH/8 FH blade bays • 6 Hot-plug power supply bays (N+1, N+N) • 8 I/O interconnect bays (4 redundant fabrics) • 10 Hot-plug fan bays with redundancy • All c-Class G 1 through Gen 9 Pro. Liant and Integrity server blades 3, 4 • All power input modules and power supplies 3 • Redundant OA option c 7000 Enclosure Evolution Overview 5 Initial Offering 4 XXXXX-B 21 3 Q-2006 1 Q-2013 • 4 Tb/s Midplane Initial Update Ro. HS Enclosure 4 XXXXX-B 22, -B 23 5 XXXXX-B 21, 68661 XB 21 3 Q-2007 2018 Platinum Enclosure 6 XXXXX-B 211, 7 XXXXXB 21 2 Q- 2009 • 7 Tb/s Midplane (40% increase), • Ro. HS compliance • 5 Tb/s Midplane (25% increase), improved signal integrity; adds: – 16 Gb FC – 20 Gb. E – 4 x. FDR IB (>1 port/server) – 4 x. QDR IB, 4 x. FDR IB (1 port/server) • 1 Phase intelligent input module – 6 Gb SAS • Location Discovery Services • 2400 W Platinum power supply • 2650 W Platinum power supply (2 Q 10)2, 3 (2 Q 13)2, 3 • 1 Gb/s OA connectivity • High voltage power solution (3 Q 14)2, 3 • Limited distribution with Platinum 1. Except 68661 X-B 21. enclosure midplane (SKUs 68661 X 2. Although introduced with this enclosure, this item is supported on all enclosures. See back-up slides for more information. B 21) 3. The enclosure OA firmware must be at a level to support all components within the enclosure. • 3” display (from 2”) – 10 Gb. E • 2400 W Gold power – 4 Gb/8 Gb FC supply (4 Q 08)2, 3 – 4 x. DDR IB – 3 Gb SAS • 2250 W AC, 2250 W 48 VDC power 2, 3 • 1 Phase/3 Phase 200 -240 AC, 48 VDC input modules 2, 3 • 100 Mb/s OA connectivity 4. 5. 2 Server generation mixing within an enclosure is allowed subject to the support requirements of the Onboard Administrator. See back-up slides for more information. © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice. All information applies to the commercial-grade/non-NEBs c 7000 enclosures.

c 7000 Enclosure Midplane Enhancements 7 Tb/s Platinum Enclosure Bandwidth 40% 5 Tb/s 25% 4 Tb/s Initial Offering Initial Update ü ü 10 Gb. E ü No midplane 8 Gb FC change 4 x. DDR IB (20 Gb) 3 Gb SAS 3 Q 06 3 Q 07 3 Adds: ü 16 Gb FC ü 4 x. FDR IB (56 Gb), >1 port Ro. HS Adds: Enclosure ü ü 20 Gb. E 4 x. QDR IB (40 Gb) 4 x. FDR IB (56 Gb), 1 port 6 Gb SAS 2 Q 09 1 Q 13 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

HP Blade. System c 7000 Platinum Enclosure Improvements over previous Ro. HS enclosure Enhanced fabric capabilities ü 40% increase in midplane bandwidth ü Enhanced midplane signal integrity § 2 x storage bandwidth with 16 Gb Fibre Channel § Multi-lane 56 Gb 4 x. FDR Infini. Band Intelligent infrastructure ü 2650 W Platinum Hot Plug Power Supply (80 Plus Platinum certified) ü Single Phase - Intelligent Power Module ü Location Discovery Services 4 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

Innovations in Intelligent Infrastructure Platinum Power Supplies 94% efficient 80 Plus certified 1 Improved efficiency reducing cost per enclosure 5 Power Discovery Services Location Discovery Services Eliminate power configuration errors and precisely track power usage 2 Optimize workload placement with servers that self-identify and inventory Minutes Eliminate vs. hours to deploy power manual error prone inventory tracking 1. See www. 80 plus/org © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice. 2. Supported with the single phase intelligent power input module

HP 2650 W Hot Plug Power Supply Designed for enhanced configurations • 10% increase in total enclosure wattage (versus 2400 W) • Enables higher performance server configurations with N+N power redundancy Available options • 733459 -B 21: HP 2650 W Platinum Hot Plug Power Supply • 733460 -B 21: HP 6 X 2650 W Platinum Hot Plug Power Supply www. 80 plus. org Requirements • Onboard Administrator firmware v 3. 73 or higher • Compatible with all enclosures 6 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

c 7000 Power Supply Comparison HP 2650 W Hot Plug Platinum Power Supply HP 2400 W Hot Plug Platinum Power Supply 2650 W 2450 W 15, 900 W 14, 700 W Power Efficiency 94% 80 PLUS Platinum Certified Yes Input Voltage Range (Vrms) 200 -240 V AC 50/60 All 733459 -B 21 (single) 733460 -B 21 (6 -pack) 588603 -B 21 (single) 517521 -B 22 (6 -pack) Maximum Output Total Enclosure Wattage Frequency Range (Nominal) (Hz) Enclosure Support Ordering 7 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

HP Blade. System c-Class Longevity On Jan 6, 2014 HP announced: • There’s no end-of-life date for HP Blade. System c-Class set at this time • HP remains committed to the c-Class architecture and plans to offer it through at least 2018 • HP plans to support the c-Class portfolio with spares for at least 5 years after any EOL date 8 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

c 7000 Enclosure Summary Ongoing enhancements • Higher performance I/O fabrics • Intelligent infrastructure • Increased power Investment protection • • 9 Pro. Liant and Integrity server blade support across all enclosures Power supply and power input module support across all enclosures Onboard Administrator firmware support across all enclosures c-Class availability to at least 2018 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

Thank you © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

Enclosure Evolution Enclosure SKUs* Initial Enclosure Offering 4 XXXXX-B 21 Intro Date Disc Date Aug 06 Oct 07 Interconnect Downlink Speeds 10 Gb. E 4 Gb FC 8 Gb FC 4 x. DDR IB 3 Gb SAS * The enclosure SKU can be found in the OA Rack Overview screen. For more information, see the Rack View section in the OA user guide. Note: The SKU is listed as a “part number”. Updates from Previous Enclosure Original c 7000 c-Class offering. Original midplane: o Supports 10 Gb. E, 4 Gb and 8 Gb FC, 20 Gb 4 x. DDR IB (via full-width switch), and 3 Gb SAS. o 4 Tb/s Bandwidth: 8 Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 8 x 16 x 2 = 4, 096 Gb/s = 4 Tb/s. Initial Offering Update 4 XXXXX-B 22, 4 XXXXX-B 23 Aug 07 Sep 09 Ro. HS Enclosure 5 XXXXX-B 21, 68661 X-B 21 May 09 Oct 13 Platinum Enclosure 11 6 XXXXX-B 21 (except 68661 XB 21), 7 XXXXX-B 21 Feb 13 Insight Display LCD from 2” to 3”. 2400 W Gold 92% efficient power supply (Nov 08). o Midplane same as above. Above plus: 20 Gb. E 4 x. QDR IB 4 x. FDR IB (1 port/server) 6 Gb SAS ~2018 Above plus: 16 Gb FC 4 x. FDR IB (>1 port/srvr) Ro. HS compliance. Midplane bandwidth increased by 25% and improved signal integrity, adds: o 20 Gb. E, 40 Gb 4 x. QDR IB (via full-width switch), 56 Gb 4 x. FDR IB (single port per server via full-width switch), and 6 Gb SAS support. o 5 Tb/s Bandwidth: 10 Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 10 x 16 x 2 = 5. 120 Gb/s = 5 Tb/s. 2400 W Platinum 94% efficient power supply (Jun 10). OA connectivity from 10/100 to 1 Gb. Updated Onboard Administrator (DDR 2 memory and Power. PC processor). Midplane bandwidth increased by 40% and improved signal integrity, adds: o 16 Gb FC and 56 Gb 4 x. FDR IB (via full-width switch) support. o 7 Tb/s Bandwidth: 14 Gb/s per lane x 16 lanes per device bay x 16 device bays x 2 directions for duplex = 14 x 16 x 2 = 7, 168 Gb/s = 7 Tb/s. Enclosure Location Discovery Services. © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice. Single phase intelligent power module. 2650 W Platinum 94% efficient power supply (Jun 13).

c 7000 Power Module- Power Supply Interoperability (For commercial grade/non-NEBS systems) Power Input Module Supported Power Supply Kits 1, 2 Supported c 7000 Enclosures 3 Single Phase AC Intelligent • Platinum 2650 W: 733460 -B 21(6 -pack), 733459 -B 21 (single) 4 XXXXX-B 21 (677595 -B 21) 4 XXXXX-B 22 • Platinum 2400 W: 517521 -B 22 (6 -pack), 588603 -B 21 (single) 4 XXXXX-B 23 Single Phase AC (413379 -B 21) • Gold 2400 W: 517521 -B 21 (6 -pack), 499243 -B 21 (single) 5 XXXXX-B 21 Three Phase AC NA/JPN 4 • 2250 W: 412138 -B 21 (single) 6 XXXXX-B 21 (413380 -B 21) 7 XXXXX-B 21 Three Phase AC International (413381 -B 21) -48 V DC (AH 331 A) • 2250 W -48 VDC (AH 332 A) High Voltage (753623 -B 21) • Universal 2650 W: 753619 -B 21 (6 -pack), 753618 -B 21 (single) 1. Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level or higher efficient power supplies. The Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all are matched. 2. The three phase power input modules (413380 -B 21 and 413381 -B 21) require a minimum of 3 power supplies. 3. The Onboard Administrator firmware must be at least the minimum version that supports all components installed within the enclosure. 4. No longer shipping. 12 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice.

c 7000 Power Supply Comparison (For commercial grade/non-NEBS systems) Power Supply Kit 1 SKU Rated Maximum Efficiency 2 Input output Voltage Hotplug HP Location Discovery Services Supported Power Input Modules 3 Supported c 7000 Enclosures 4 200 -240 VAC Yes Supported 6 4 XXXXXB 21 4 XXXXXB 22 4 XXXXXB 23 5 XXXXXB 21 6 XXXXXB 21 7 XXXXXB 21 2650 W Platinum AC 733460 -B 21(6 -pack) 733459 -B 21 (single) 2400 W Platinum AC 2400 W Gold AC 2450 W 2250 W AC 5 517521 -B 22 (6 -pack) 588603 -B 21 (single) 517521 -B 21 (6 -pack) 499243 -B 21 (single) 412138 -B 21 (single) 2250 W -48 VDC AH 332 A 2650 W Universal 40 -60 VDC 753619 -B 21 (6 -pack) 277 VAC 753618 -B 21 (single) 380 VDC 2650 W 94% 2450 W 92% 2250 W 89% 2250 W 90% Single Phase AC Intelligent (677595 -B 21) Single Phase AC (413379 B 21) Three Phase AC NA/JPN (413380 -B 21)3 Three Phase AC International (413381 -B 21)3 -48 V DC (AH 331 A) 2650 W 94% High Voltage (753623 -B 21) Not supported 1. Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level or higher efficient power supplies. The Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all are matched. 2. At 50% of rated load. Platinum and Gold power supplies are 80 Plus certified, see www. 80 plus. org. Power supplies with DC capability are not eligible for 80 Plus certification, efficiency is per HP internal testing. 3. Three phase power input modules require a minimum of 3 power supplies. 4. The Onboard Administrator firmware must be at least the minimum version that supports all components installed within the enclosure. 5. No longer shipping. 13 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice. 6. HP Power Discovery Services are enabled when used with an Intelligent Power Distribution Unit (i. PDU), i. PDU cables, and the single-phase intelligent power input module

Onboard Administrator/Virtual Connect Firmware Compatibility Matrix 1, 2, 3 HP Pro. Liant Server Blade: BL 460 c (G 1) BL 465 c (G 1) BL 480 c (G 1) BL 685 c (G 1) BL 260 c G 5 BL 465 c G 5 BL 495 c G 5 BL 680 c G 5 BL 685 c G 5 BL 280 c G 6 BL 465 c G 6 BL 490 c G 6 BL 495 c G 6 BL 685 c G 6 BL 2 x 220 c G 6 WS 460 c G 6 BL 2 x 220 c G 7 BL 465 c G 7 BL 490 c G 7 BL 685 c G 7 BL 620 c G 7 BL 680 c G 7 BL 420 c Gen 8 BL 465 c Gen 8 BL 660 c Gen 8 14 Onboard Administrator Firmware 4 Minimum Maximum 1. 00 4. 22 2. 20 4. 22 2. 31 4. 22 2. 41 4. 30 2. 60 4. 30 3. 11 4. 30 3. 20 4. 30 3. 50 4. 30 3. 60 4. 30 Virtual Connect Firmware 5 Minimum Maximum 1. 10 4. 20 1. 31 4. 20 2. 02 4. 20 1. 32 4. 20 1. 20 4. 20 2. 02 4. 20 2. 10 4. 30 2. 30 4. 30 3. 10 4. 30 3. 01 4. 30 3. 15 4. 30 3. 60 4. 30 3. 51 4. 30 3. 60 4. 30 3. 70 4. 30 HP Pro. Liant Server Blade Mixing Support All G 1, BL 260 c G 5 All G 1 to all G 5 4. 116 4. 30 1. Please review the HP Service Pack for Pro. Liant (SPP), Onboard Administrator, and Virtual Connect firmware advisories and release notes on www. hp. com/support for important information when determining the most appropriate firmware versions. 2. HP recommends the current firmware whenever possible for maximum compatibility and stability. All G 1 to all G 5, All G 6 except the BL 2 x 220 c G 6 and WS 460 c G 6 3. HP Service Pack for Pro. Liant (SPP) releases and important information can be found at www. hp. com/go/spp. 4. HP Onboard Administrator firmware and important information can be found at www. hp. com/support/OA. All G 1 to all G 6 All to all G 6, All G 7 except BL 620 c G 7 and BL 680 c G 7 All G 1 to all G 7, BL 420 c Gen 8, BL 465 c Gen 8 All G 1 to all Gen 8 © Copyright 2014 Hewlett-Packard Development Company, L. P. The information contained herein is subject to change without notice. WS 460 c Gen 8 3. 60 4. 30 3. 70 4. 30 BL 460 c Gen 9 Notes: All G 6 to Gen 9 5. HP Virtual Connect firmware and important information can be found at www. hp. com/support/VC. 6. For additional information, please see the Customer Notice ”Pro. Liant Gen 9 Servers - Onboard Administrator Firmware Version 4. 11 (or Later) Support for Gen 9 Server Blades and Possible Issues That May Arise”.