Glue Pitch Robot IJ 2500 Adaptors Glue Beetle

Glue Pitch Robot I&J 2500 Adaptors Glue Beetle Chip to Hybrid Back-End Bonding H&K 710 bonder Mike Wormald mpw@liv. ac. uk

Robot I&J 2500 The I&J 2500 has a work area of 510 x 510 mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue. Mike Wormald mpw@liv. ac. uk 2

Requirements Glue pitch adaptors to LHCB hybrids. • • Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads. Even spread of glue for planarity. (Bonding jigs vacuum this area down) Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips Correct location of the pitch adaptors. Mike Wormald mpw@liv. ac. uk 3

Process • Dispense Glue • Place pitch adaptors Mike Wormald mpw@liv. ac. uk 4

Process • Apply Weights • Leave to cure • In oven at 40◦c for 1 hour. • Visually inspect. • Remove any excess or fill unsupported areas. • Chips can be mounted at this stage • Place back in oven for further two hours Mike Wormald mpw@liv. ac. uk 5

Glue chips to Hybrid Requirements • Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces. • No overspill of conductive glue that may cause shorts on the hybrid • Accurate placement –ease of bonding front end- Mike Wormald mpw@liv. ac. uk 6

n Dispense Glue Mike Wormald mpw@liv. ac. uk 7

n Place Chips Mike Wormald mpw@liv. ac. uk 8

n Accurate Position Mike Wormald mpw@liv. ac. uk 9

Back End Bonding Mike Wormald mpw@liv. ac. uk 10

Screen shot of bonds with overlay Mike Wormald mpw@liv. ac. uk 11

• The End Mike Wormald mpw@liv. ac. uk 12