GBTSCA Status Planning Kostas Kloukinas 2 Feb 2015

GBT-SCA: Status & Planning Kostas Kloukinas 2 Feb. 2015

GBT-SCA: Status & Planning n 1 st Prototype submitted for fabrication in July 2014 q q Part of the “GBT-chipset” MPW run Delivery of 2 wafers (~520 die) in mid November 2014 n n 250 bare die chips 208 BGA packaged chips (possibility to package 150 additional die) For distribution to system developers upon successful prototype testing Testing q Use a stand-alone test bench for functional verification and irradiation performance testing n q q Setup adapted for bare-die and packaged parts First test results expected in the 2 nd week of February Use an industrial tester for ADC & DAC characterization and for setup preparation for the final production testing n Production q Upon successful prototype testing, production will follow using the GBT-chipset MPW reticle. 3 Feb. 15 Kostas. Kloukinas@cern. ch 2

Stand-alone test-bench Status: Test Board: Ready for use. Load Boards: Delivered last week. Currently in assembly. Firmware & software: Ready for use. Load Boards Test Board BGA socket XILINX development card CPGA ZIF socket 3 Feb. 15 Kostas. Kloukinas@cern. ch 3

Final Product Package n Package Type: LFBGA q Low Profile Fine Pitch BGA (Chip Scale Package) q q Ball Pitch: 0. 8 mm Size: 12 x 12 mm Height: 1. 2 -1. 7 mm Pin count: 196 3 Feb. 15 Kostas. Kloukinas@cern. ch 4

Users Manual n Documentation: q “Users Manual” document q Available on GBT sharepoint site: https: //espace. cern. ch/GBT-Project/GBTSCA/Manuals/Forms/All. Items. aspx 3 Feb. 15 Kostas. Kloukinas@cern. ch 5

Thank you 3 Feb. 15 Kostas. Kloukinas@cern. ch 6