Gaseous Detector RD at USTC Gaseous Detector Group

  • Slides: 6
Download presentation
Gaseous Detector R&D at USTC Gaseous Detector Group State Key Laboratory of Particle Detection

Gaseous Detector R&D at USTC Gaseous Detector Group State Key Laboratory of Particle Detection and Electronics University of Science and Technology of China 26 -02 -2018 1

State Key Laboratory of Particle Detection and Electronics Research directions: Human resources: Ø Faculty:

State Key Laboratory of Particle Detection and Electronics Research directions: Human resources: Ø Faculty: 144 Ø Advanced particle detection technology Ø Postdoctor: 32 l Gaseous detectors Ø Student: 324 l Semiconductor detectors l Scintillation detectors Ø Front end electronics l ASIC design and applications Research projects in 2017: 108 l Radiation hardness electronics Funds in 2017: 9. 49 M l High speed waveform sampling l High precision FPGA TDC Ø Large capacity data acquisition and processing system € 2

Gaseous detector technology developed ØMulti-gas Resistive Plate Chamber (MRPC) p. Already applied on BES

Gaseous detector technology developed ØMulti-gas Resistive Plate Chamber (MRPC) p. Already applied on BES III ETOF, STAR TOF and MTD project; BESIII-ETOF: ~6 m 2, 60 ps overall TOF time resolution, eff>98%; STAR-TOF: ~60 m 2, ~80 ps overall TOF time resolution, eff>95%; STAR-MTD: >100 m 2, ~100 ps overall time resolution, eff>95%; ØLarge area GEM (30 cm× 30 cm, 100 cm× 50 cm) based on Slidable-NS 2 Gain uniformity is better than 16. 2%; ØSmall area (~ 20 cm× 20 cm) DLC resistive electrode, Uniformity of sheet resistivity is better than 22%; Ø Thermal bonding Micromegas, 20 cm× 60 cm prototype achieved Ø Sparking-resistant anode: Ø High purity Germanium: vacuum coating → 30 cm× 30 cm available Ø Carbon paste: silk-screen printing →m 2 scale p The prototypes are used for neutron monitor for CSNS and photon detector (+THGEM) for CEPC-PID RICH; Ø Double-mesh MM (DMM), small prototype (2 cm× 2 cm) has been made, Excellently low IBF (~ 0. 05%) and high gain (>7× 104) obtained; 3

R&D and Projects ongoing MRPC and RPC production ØThin floating glass MRPC → CBM

R&D and Projects ongoing MRPC and RPC production ØThin floating glass MRPC → CBM TOF project (Total area ~65 m 2; Time resolution <80 ps; rate ~1 k. Hz/cm 2); ØThin gap RPC → ATLAS phase II upgrade (rate >1 k. Hz/cm 2 ,Time resolution <1 ns; position resolution <1 mm); Large area Micromegas fabrication ØDeveloping the m 2 scale rolling machine → to make m 2 scale Micromegas based on thermal bonding technique; ØLarge area DMM → Photon detection application: RICH → Low IBF application: Picosecond Micromegas, CEPC-TPC, ILC-TPC; New materials ØLarge area resistive electrode based on DLC → New robust resistive electrode for lots of gaseous detectors: Resistive-GEM, Micromgas, μRWELL, …; ØCollaborating with photocathode experts who used to work for low-level light night vision device → Develop new photocathode to replace the fragile Cs. I : High quantum efficiency, robust enough; Human resources of the gaseous detector team: 7 Faculties: Y. Zhou, J. Liu, Z. Zhang, M. Shao, C. Li, Y. Sun, Z. Zhao 12 Students 4

Facilities for gaseous detector @ USTC Small mechanical workshop Ultrasonic bath & Oven Soldering

Facilities for gaseous detector @ USTC Small mechanical workshop Ultrasonic bath & Oven Soldering station & microscope Clean Room (~ 70 m 2) RPC Room (being built, ~ 90 m 2 ) GEM Tracker MRPC Test Room (~ 90 m 2) MPGD Test Room (~ 90 m 2) MCPPMTs μRWELL Micromegas Tracker GEM optical Readout 2 Test systems for general use Picosecond Micromegas system 213 nm Laser source 12 -channel 25 GHz/80 Gs scope 5

Other Facilities and infrastructure we can access Facilities at State Key Laboratory of Solid

Other Facilities and infrastructure we can access Facilities at State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics: DLC devices: l Teer 650 (~ 30 cm× 30 cm) l Hauzer 850 (>1 m× 0. 5 m) Many other PVD & CVD devices for foil coating The infrastructures at University of Science and Technology of China: Ø USTC center for Micro and Nanoscale research and Fabrication(NANO USTC): l l Exposure and etching: Electron beam lithography, UV Optical Aligner, Metal ICP Etching, Deep silicon etching etc. Thin film deposition or coating: UHV Ebeam Evaporator, Ibeam Sputtering depositor, PECVD, Rapid thermal processing etc. Measurement of microstructure: Ellipsometer, Stylus Profiler, Surface Profiler, Cold FESEM, etc. Others, such as bonding, polishing, cleaning, a series of Microscopes, NC machining equipment. Ø Experiment center of physical and chemical science : l Deep UV - visible - near infrared spectrophotometer, Automatic Surface Area and Pore Analyzer, etc. Ø More sharing centers: 6