Fujitsu Microelectronics America Corporate Profile Fujitsu Microelectronics in

Fujitsu Microelectronics America Corporate Profile

Fujitsu Microelectronics in Review Fujitsu N. A. Headquarters in Sunnyvale, CA n n n 1976 1979 1980 2001 2003 FMA (Bldg E) In Fujitsu N. A. Headquarters in Sunnyvale, CA Predecessor to Fujitsu Microelectronics, Inc. (FMI) formed under Fujitsu America, Inc. FMI formed as a subsidiary of FAI, headquartered in Santa Clara, CA FMI became a wholly owned subsidiary of Fujitsu Limited Fujitsu Microelectronics America, Inc. formed FMA moved headquarters to Fujitsu North America Headquarters in Sunnyvale, CA 2 © Fujitsu Microelectronics America, Inc. 2008

Fujitsu Organization President and Representative Director H. Kurokawa Chairman and Representative Director N. Akikusa Corporate Senior Executive VP : M. Ogura (CFO) Corporate Senior Executive VP : C. Ito (Global Business) Corporate Senior Executive VP : M. Mazuka (Japan Business) T. Ono Corporate Senior Executive VP ( Manufacturing innovation & Electronic Device business ) S. Fujii Electronic Devices Business Corporate Senior VP 　　 President, Electronic Device Business Group K. Ishizaka Technology Solution Corporate VP, Executive VP, Electronic Device Business Group ( Operational Management ) H. Yagi System Product Business Service Product Business Solution Business Support Infrastructure Solution Business Financial Solution Business Government & Public Solution Corporate VP, Executive VP, Electronic Device Business Group ( Advanced & common technologies ) J. Murakami Executive VP, Electronic Device Business Group ( Marketing & Product ) Ubiquitous Product Solution Ubiquitous Product Business Support 3 © Fujitsu Microelectronics America, Inc. 2008

Regional Headquarters Global Presence / R&D and Design Centers America, Inc. cc 4 © Fujitsu Microelectronics America, Inc. 2008

FMA Channel Partners n Sales Reps (U. S. and Canada) n n n n Northwest • Paragon (Northern CA) • Si. Fore Technical Sales (OR, WA) Southwest • Innovation Sales (Southern CA) • Luscombe Engineering (AZ) Central • Technical Marketing (TX) • Innovation Sales (CO, UT) Northeast n • Pipe-Thompson Technologies (Canada) • Quality Components (NY) • Procomp (MA) • Synergistic Sales (IL, WI, MN) Southeast • Comrep (Al, NC, GA) • Semtronic (FL) • Arbotek (MD, VA) Middle Atlantic • Victory Sales (MI, OH) • Bear VAI Technology (IN, PA, OH) • T. A. M. (NJ) Sales Reps (Americas) Puerto Rico • Semtronic n Mexico • Insight Demand Creation n Argentina • Phoenix REP Sales n Brazil • Phoenix REP Sales n Distributors n U. S. and Canada • Arrow Electronics n Puerto Rico • Arrow Electronics n Brazil • Arrow Electronics n Argentina • Elko / Arrow 5 © Fujitsu Microelectronics America, Inc. 2008

FMA’s Advanced Logistics n Warehouse Located in the Exel Inc. facility (Coppell, Texas) n Close to the Dallas / Fort Worth airport n Provides logistic services, including: § Buffer stock program § Demand pull program § Just In Time (JIT) program § Quick shipment options § Drop shipment options n 6 © Fujitsu Microelectronics America, Inc. 2008

Providing Total IC Solutions 7 © Fujitsu Microelectronics America, Inc. 2008

Market Segment and Application Focus § Key Market Segments § § § Key Product Groups and Services § Custom LSI § Services and Manufacturing § Wireless Solutions § Wi. MAX So. Cs § Networking Solutions § 10 Gbps Ethernet Switch ICs § Embedded Solutions Networking § Enterprise / Access § Storage § Wireless Automotive Consumer Industrial Security § MCUs, GDCs, IDB 1394 § Biometric Sensor ICs § FRAM § New Products § H. 264 Codec & Transcoder § Milbeaut § Tuner 8 © Fujitsu Microelectronics America, Inc. 2008

Fujitsu’s IDM Business Strategy As we move to 65 nm process technology, design and manufacturing become more complex while time-to market schedules continue to compress. The solution for companies developing new ASICs, So. Cs and ASSPs is to work very closely with their foundry and fab partners. System Arch / Design Logic Design Physical Design ASIC So. C Manufacturing Foundry Technology Conventional Business New IDM 9 © Fujitsu Microelectronics America, Inc. 2008

Leadership in IDM § § 90 nm / 65 nm Technology and Beyond n Designs are complex n Design processes are difficult and manufacturability is questioned Fujitsu’s Answer n Integrated Device Manufacturing service business model n Building strategic customer relationships n Strong and close collaboration with customers from development, design to manufacture n Emphasize partnerships with third parties, e. g. IP vendors and EDA vendors FMA Integrates Design and Manufacturing Services n Advanced process technology at 90 nm and 65 nm n Expanded foundry services, including 300 mm n Global packaging leadership FMA Adds a Full Set of Capabilities n n Accel. Array / ASIC / COT Robust design methodology Broad portfolio of complex and differentiated IP families LSI solutions – application platform approach 10 © Fujitsu Microelectronics America, Inc. 2008

Fujitsu’s 300 mm (90 nm/65 nm) Wafer Plant in Mie Building 2 Building 1 Capacity (300 mm) (wafers / month) 25, 000 Building 2 20, 000 15, 000 Building 1 10, 000 5, 000 Sept 2006 March 2007 11 Sept 2007 0 March 2008 © Fujitsu Microelectronics America, Inc. 2008

65 nm Custom LSI Products (CS 200/CS 200 A) § Fujitsu is now accepting ASIC designs for production using its 65 nm process for its North American customers § 10 products under development § High-performance Products Logic Chip § § § PC CPU Large scale FPGA Graphics § § Image processors Digital AV products § Low-power Products SRAM Chip 12 © Fujitsu Microelectronics America, Inc. 2008

Wi. MAX – Fujitsu’s End-to-End Advantage 13 © Fujitsu Microelectronics America, Inc. 2008

Features Mobile Wi. MAX Applications + + Ubiquitous Quad Play Mobile Vo. IP & Data Ubiquitous Broadband Target Product Roadmap 14 © Fujitsu Microelectronics America, Inc. 2008

Industry's Most Powerful 20 -port 10 Gigabit Ethernet Switch IC § Industry Firsts § 10 Gb. E serial – direct XFP compatible interface § Congestion management – BCN and priority pause § On-chip micro-engine § § Reduces S/W development time n VLAN virtualization Applications § Blade-server switching blade § ATCA carrier node blade § Mesh configuration § Centralized switch § Micro-TCA hub § Enterprise switching § High-performance computing 15 MB 8 AA 3020 Evaluation Board © Fujitsu Microelectronics America, Inc. 2008

MCU Roadmap – Expansion § 8 -bit F MC-8 FX: Further expansion of low-end MCU family 2 § § High-performance 8 -bit CISC CPU and low power consumption Improves 10 MHz single-cycle operation to 16 MHz single-cycle operation § 16 -bit F MC-16 LX and -16 FX: New products for mid-range MCUs 2 § § Technology migration to 0. 18µm 16 FX series provide more than 20 MIPS, five times the performance of the predecessor 16 LX, or one fifth of the power consumption for the same task § FR 60: New family of high-end MCUs § § Technology migration to 0. 18µm, while supporting 5 V power supply Up to 4 MB of Flash 100 MHz operation up to 105ºC, automotive environment Up to 6 CAN I/F with support for 128 -message buffer per channel 16 © Fujitsu Microelectronics America, Inc. 2008

MCU – Target Markets § Automotive § § § Embedded Flash High-end CAN / LIN Flex. Ray § § Embedded Flash Security features Low power Motor controller § § Embedded Flash High performance Low power Display controller § Industrial / home appliances § Consumer 17 © Fujitsu Microelectronics America, Inc. 2008

Flex. Ray™ ASSP – MB 88121 A § Fujitsu Flex. Ray: a part of full support for automotive networks § § Support Flex. Ray Protocol Spec 2. 1 § § Deterministic time-trigger protocol, max 10 Mbps x 2 ch Redundancy for safety, suitable for x-by-wire applications Support for flexible topology – bus, star, hybrid Flexible segment structure of the date – static and dynamic segment Provides total support covering MCUs, software, transceivers, and analysis tools required for development Flex. Ray Evaluation Kit 18 © Fujitsu Microelectronics America, Inc. 2008

IDB-1394™ ASSP – MB 88387 § Fujitsu IDB-1394: full support for automotive networks § Provide automotive multimedia infrastructure at 400 Mbps using 1394 b standard § § Scheduled to support direct BT. 601 I/F at next-generation ASSP MB 883 xx Near loss-less compression technology Smart. CODEC will provide full use of 1394 bandwidth for video applications Rear-seat Entertainment System Example Efficiency of Smart. CODEC 19 © Fujitsu Microelectronics America, Inc. 2008

Graphics Display Controllers (GDC) § Product family continues to expand § New product announcement at Convergence § Significant announcements to follow § Fujitsu GDCs are high-powered 3 D GPUs that include many special display-control capabilities § Co-processor architecture completely off-loads graphic and display operations from the MCU 20 © Fujitsu Microelectronics America, Inc. 2008

FMA Summary n FMA’s Advantages n Global Operations • Fujitsu’s global presence and resources • Ability to offer global solutions and engage the customer irrespective of geographic boundaries • Established sales and operations network • Advanced logistics • Business development function offering partnership options to earlystage companies n Technologies, Products and Services • System-level expertise • Leadership in IDM • Flexible engagement models including COT, ASIC and Accel. Array • Taking advantage of U. S. centric partnerships, technology and innovation to develop complex So. Cs for the worldwide market • Wide portfolio of MCUs with in-depth local technical support • Differentiated ASSPs and local applications engineering support 21 © Fujitsu Microelectronics America, Inc. 2008

22 © Fujitsu Microelectronics America, Inc. 2008