From Ashcroft and Mermin Solid State Physics NEMS

From Ashcroft and Mermin, Solid State Physics.

NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow. Roukes Group Cal Tech Tito

Biological Nanomotor

Gene chips, proteomics arrays.

Silicon wafer fabrication • Taken from www. egg. or. jp/MSIL/english/indexe. html

Silicon wafer fabrication – slicing and polishing • Taken from www. egg. or. jp/MSIL/english/indexe. html

Spin developer

Plasma Etchers Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/

LPCVD Systems Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/

IBM 7 -Level Cu Metallization

Micromachining Ink Jet Nozzles Microtechnology group, TU Berlin

Bulk micromachined cavities Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/ • Anisotropic KOH etch (Upperleft) • Isotropic plasma etch (upper right) • Isotropic Br. F 3 etch with compressive oxide still showing (lower right)

Surface Micromachining Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/ Deposit sacrificial layer Deposit/pattern structural layer Pattern contacts Etch sacrificial layer

NUMEM Microrelay Process

NUMEM Microrelay Process

Residual stress gradients Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/ More tensile on top More compressive on top Just right! The bottom line: anneal poly between oxides with similar phosphorous content. ~1000 C for ~60 seconds is enough.

Residual stress gradients Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/ A bad day at MCNC (1996).

Scalloping and Footing issues of DRIE <100 nm silicon nanowire over >10 micron gap 1 µm microgrid Footing at the bottom of Milanovic et al, IEEE TED, Jan. 2001. device layer

DRIE structures Taken from http: //www-bsac. EECS. Berkeley. EDU/~pister/245/ • Increased capacitance for actuation and sensing • Low-stress structures – single-crystal Si only structural material Thermal Actuator Comb-drive Actuator • Highly stiff in vertical direction – isolation of motion to wafer plane – flat, robust structures 2 Do. F Electrostatic actuator

Sub-Micron Stereo Lithography New Micro Stereo Lithography for Freely Movable 3 D Micro Structure -Super IH Process with Submicron Resolution. Koji Ikuta, Shoji Maruo, and Syunsuke Kojima Department of Micro System Engineering, school of Engineering, Nagoya University Furocho, Chikusa-ku, Nagonya 464 -01, Japan Tel: +81 52 789 5024, Fax: +81 52 789 5027 E-mail: ikuta@mech. nagoya-u. ac. jp Fig. 6 Schematic diagram of the super IH process Fig. 1 Schematic diagram of IH Process Fig. 5 Process to make movable gear and shaft (a) conventional micro stereo lithography needs base layer (b) new super IH process needs no base Micro Electro Mechanical Systems Jan. , 1998 Heidelberg, Germany

Sub-Micron Stereo Lithography New Micro Stereo Lithography for Freely Movable 3 D Micro Structure -Super IH Process with Submicron Resolution. Koji Ikuta, Shoji Maruo, and Syunsuke Kojima Department of Micro System Engineering, school of Engineering, Nagoya University Furocho, Chikusa-ku, Nagonya 464 -01, Japan Tel: +81 52 789 5024, Fax: +81 52 789 5027 E-mail: ikuta@mech. nagoya-u. ac. jp Fig. 10 Micro gear and shaft make of solidified polymer (b) side view of the gear of four teeth (d) side view of the gear of eight teeth Micro Electro Mechanical Systems Jan. , 1998 Heidelberg, Germany

Taken from: http: //www. imm-mainz. de/english/sk_a_tec/basic_te/liga. html