FPGA Process Flowchart Backup FPGA Configurability Basis of

FPGA Process Flowchart Backup

FPGA Configurability • Basis of configurability – Nature of transistor based FPGA • Physical limitations – Through header on PCB using Xilinx provided development tools Backup

FPGA Configurability • Customer configurable – Configuration languages • Knowledge of VHDL/Verilog – Development packages • Xilinx provided development tools – Physical configuration requirements • Connect programmer and download data file, restart board Backup

Processing Elements FPGA • Transistor based • VHDL/Verilog DSP • CPU based • C Language Backup

Customer Needs • Use Supplied Components – – – 10 MP Visual Camera IR Camera 1 of the 2 Inertial Navigation Systems depending on availability • OEM Camera Processing Board • • • – • • Nov. Atel OEM Board OEMV 3 Nov. Atel OEM Board OEMV 2 Interface to single 10 Mpixel Camera through proprietary “D 3 Camera” connector. Interface to single Thermal Camera through Camera Link Interface. Capture 10 MP data at 1 FPS Capture the Thermal Camera data synchronized with the 10 Mpixel camera. Capture INS data and store to match corresponding photos. Accept data from auxiliary external cameras and INS units • • Make data overlay and processing possible on-board Output data from the supplied OEM Board connection for real-time viewing Store data internally during flight using a SSD SATA drive. Package must include mounting and space necessary for four cameras. Package everything (except for the IR camera) to protect it against the environment and to minimize the size. “Everything” Includes: – – • • • (4) visual cameras and their lenses (1) INS sensor (1) OEM Camera Processing Board Any other components necessary for operation Position images for ground observations Make cameras separable from the processing hardware Interface package to a light passenger aircraft.

Backup slide: Final Output Color Aerial Photograph IR Camera with INS Data overlay

Customer provided devices • • • OEM Digital Signal Processing Board Camera. Link® to D 3 Conversion Chips Novatel OEM Board IMU System Cameras – (2) Using D 3 Connector interface – (1) IR using Camera Link

Appendix: Radiation Assumptions: Treat enclosure as a black box Neglect Convection Neglect Conduction Temperature at surface of chassis = temperature inside of chassis All Power consumed by electronics is output as heat radiating out e=. 89 qc =. 5 qb

Appendix: Humidity • Dew point temperature is given as: – Constants defined as follows: constants temp range Tn ( C) m 0 to 50 243. 12 17. 62 -40 to 0 272. 62 22. 46 • Variables: – Td - Dew point ( C) – T - Ambient temperature ( C) – RH - Relative humidity (%) – m - Temperature range dependant constant (nondimensional) – Tn - Temperature range dependant constant ( C)