Ferrite Multilayer Technology Wire Wound Technology Molding Technology

功率电感产品系列 Ferrite Multilayer Technology Wire Wound Technology Molding Technology Assembling Technology MCL Series SWPA Series AMWPQ Series Size: L×W×H(mm) 1. 6× 0. 8 -2. 5× 2. 0× 0. 9 Inductance: 0. 1 -10μH Current: 0. 05 -1. 1 A Size: L×W×H(mm) 2. 5× 2. 0× 1. 0 -8. 0× 6. 5 Inductance: 0. 22 -10000 μH Current: 0. 065 -7. 5 A Size: L×W×H(mm) 20× 25× 15. 1 -33× 16 Inductance: 0. 75 -33μH Current: 0. 22 -22 A Ultra-large current; Satisfied with AEC-Q 200 MPH Series Size: L×W×H(mm) 1. 6× 0. 8× 0. 5 -2. 5× 2. 0× 1. 2 Inductance: 0. 1 -10μH Current: 0. 08 -1. 6 A Size: L×W×H(mm) 2. 0× 1. 6× 1. 0 -8. 0× 3. 0 Inductance: 0. 22 -100μH Current: 0. 2 -7. 5 A WPZ Series Size: L×W×H(mm) 4. 0× 4. 0 -15× 7. 0× 5. 0 Inductance: 0. 065 -0. 47 μH Current: 16 -140 A ASWPA Series AWPR-2 Series Size: L×W×H(mm) 4. 0× 3. 5 -8. 0× 5. 0 Inductance: 1. 0 -330μH Current: 0. 6 -14 A Satisfied with AEC-Q 200 Size: L×W×H(mm) 7. 0× 8. 4 -12. 8× 10. 5× 10. 8 Inductance: 3. 3 -22μH Current: 2. 8 -13. 0 A 2 in 1, Large current and low DCR; Satisfied with AEC-Q 200 WPN Series MWSC&MWSA Series Size: L×W×H(mm) 2. 0× 1. 6× 0. 8 -4. 0× 2. 0 Inductance: 1. 0 -330μH Current: 0. 6 -14 A Large current &Low DCR Size: L×W×H(mm) 4. 2× 4. 4× 1. 2 -12. 6× 13. 45× 5. 0 Inductance: 1. 0 -330μH Current: 0. 22 -22 A Ultra-high current & Low DCR Metal WTX Series Size: L×W×H(mm) 2. 0× 1. 2× 0. 65 -6. 6× 7. 1× 4. 0 Inductance: 0. 1 -47μH Current: 0. 3 -80 A Ultra-high current & High reliability AGP Series Sunlord Confidential Size: L×W×H(mm) 5. 5× 5. 2× 3. 0 -13. 5× 12. 5× 6. 5 Inductance: 0. 47 -22μH Current: 3. 1 -36 A Ultra-high current & High reliability; Satisfied with AEC-Q 200 Page 15 15 of of 27 42 Page

叠层小封装高Q值射频电感 - HQ 0402 series - HQ 0603 series 特征 ü 高Q值 ü 低DCR ü 高自谐频率 ü 最小英制 01005封装 不同系列的Q值对比-1 n. H 60 HQ 0402 Q 1 N 0 50 HQ 0402 H 1 N 0 40 高 25%@2 GHz SDCL 0402 H 1 N 0 Q 30 高 75%@2 GHz 20 10 100 1000 Frequency (MHz) Sunlord Confidential Page 21 21 of of 27 42 Page

绕线小封装射频电感 - MWSD 0603 C series - MWSD 0804 C series 特征 Ø 小尺寸，可表面贴装 Ø 陶瓷材料，高Q值、高自谐频率 Ø 高精度、高可靠性 Series Size (mm) Inductance Range (n. H) Rated Current (m. A) MWSD 0603 C 0603 0. 2~39 120~1000 MWSD 0804 C 0804 0. 2~27 100~990 应用 Ø 各类通讯设备的射频线路 Ø 蓝牙、Wi-Fi、NB-Io. T等 Sunlord Confidential Page 22 22 of of 27 42 Page

LTCC射频器件 Low Temperature Co-fired Ceramics <900℃ 烧结 陶瓷 Ø微型电路封装技术 Ø 降低分立器件公差的影响，提高射频电路的一致性 Ø 减小贴装面积 2 D Circuit (ADS) Sunlord Confidential 3 D Architecture (HFSS) Electrical Properties Simulation Page 23 23 of of 27 42 Page

LTCC低通滤波器 滤波器参数 Shape P/N S-Chart Bandwidth Insertion Loss Return Loss (MHz) (max. ) (min. ) Anttenuation (min. ) SLFL 15 -0 R 960 G -01 TF 698~960 0. 6 d. B 10 d. B 13 d. Bmin. at 1565~1610 MHz 35 d. Bmin. at 1805~1830 MHz 35 d. Bmin. at 2110~2170 MHz 30 d. Bmin. at 1710~2700 MHz SLFL 152 R 025 G-02 TF 1650~2180 0. 7 d. B 15 d. B 20 d. Bmin. at 3350~4360 MHz 40 d. Bmin. at 5085~6540 MHz SLFL 15 -0 R 960 G-01 TF 特征 Ø 英制 0402封装，体积小，插损小 Ø 可定制中心频率、抑制等参数特性 Ø 适用于Hisilicon Boudica 120、Boudica 150等 Ø 适用于各类智能设备的射频电路 Sunlord Confidential SLFL 15 -2 R 025 G-02 TF Page 24 24 of of 27 42 Page