Environmental Health and Safety Japan TC Chapter Liaison

Environmental, Health and Safety Japan TC Chapter Liaison Report SEMICON West 2015 Meetings July, 2015

Leadership • Committee Co-chairs – Hidetoshi Sakura/ Intel • GCS voting member • EHS Committee representative to the JRSC – Moray Crawford/ Hatsuta Seisakusho • GCS voting member – Supika Mashiro/ Tokyo Electron

Committee Organization EHS Japn TC Chapter Supika Mashiro/ TEL Hidetoshi Sakura/ Intel Moray Crawford/ Hatsuta Seisakusho FPD System Safety TF Naokatsu Nishiguchi/ Screen Semiconductor Solutions S 23 Revision Global TF George Hoshi / TEL Lauren Crane/ KLA-Tencor STEP Planning WG Kenji Sugihara/ Panasonic GHG Emission Characterization TF George Hoshi / TEL Tetsuya Kitagawa/ Sony Seismic Protection TF Eiji Nakatani/ Screen Semiconductor Solutions

Meeting Information • Last Meetings – April 17, 2015 during Japan Spring Meetings 2015 at SEMI Japan, Tokyo, Japan – June 5, 2015 during Japan Summer Meeting 2015 at SEMI Japan, Tokyo, Japan • Next Meeting – September 24, 2015 at SEMI Japan Office

Charter of Global EHS Technical Committee • Current Global Technical Committee Charter was reviewed at the TC Chapter meeting on April 17. – See next two slides.

Current Charter of Global EH&S Committee on SEMI Website • To identify and develop international environmental, health and safety (EH&S) standards fulfilling the technical needs of the semiconductor, flat panel display and other related industries. The Committee will focus on: – Standards that promote safe and environmentally responsible design, selection, facilitization, operation, maintenance, service, decommissioning, and disposition of equipment and materials – EHS issues related to the SEMI Standards Program – EHS support for other technical committees and SEMI divisions – Promoting and facilitating the use of SEMI EHS documents – Supporting technical educational programs on EHS-related subjects.

Charter of Global EH&S Committee proposed by Japan Chapter Need global discussion • To identify and develop environmental, health and safety (EH&S) Standards Documents fulfilling the technical needs of the semiconductor, flat panel display and other related industries internationally. The Committee will focus on: – Safety Guidelines and Standards (Guide) that promote safe and environmentally responsible design, selection, facilitization, operation, maintenance, service, decommissioning, and disposition of equipment and materials – EHS issues related to the SEMI Standards Program – EHS support for other technical committees and SEMI divisions – Promoting and facilitating the use of EHS related SEMI Standards Documents – Supporting technical educational programs on EHS-related subjects.

Ballot Result on April 17 • Doc. 5556: Line Item Revision to SEMI S 20712 b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revisions to § 19 “Seismic Protection” – Failed TC Chapter Review

Ballot Result on June 5 • Doc. 5874: Line Item Revision to SEMI S 20712 d, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment – passed with editorial changes – Passed A&R – Completed Publication Proof

Authorized Activities on April 17 • SNARF – 5875: Revision to S 26 -0415: Environmental, Health, and Safety Guideline for FPD Manufacturing System (Line Item Revision) • Ballot (Cycle 6, 2015) – 5556 A: Line Item Revision to SEMI S 2 -0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revisions to § 19 “Seismic Protection” • Will be postponed to later cycle…… – 5875: Revision to S 26 -0415: Environmental, Health, and Safety Guideline for FPD Manufacturing System (Line Item Revision)

Authorized Activities on June 5 • SNARF – Discontinued Activities • 5531: Revision to SEMI S 23 -0311, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment • Ballot – No ballot submission approved at the last meeting.

Upcoming Ballots • For Cycle 6, 2015 – 5556 A: Line Item Revision to SEMI S 2 -0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revisions to § 19 “Seismic Protection” – 5875: Revision to S 26 -0415: Environmental, Health, and Safety Guideline for FPD Manufacturing System (Line Item Revision)

TF/ WG/ SG Reports -1 • S 23 Revision Global Task Force – 5513 is discontinued. – New SNARF is under preparation. This is discussed during at the meeting in conjunction with SEMICON West. – Collaboration with ESEC TF of NA I&C TC (e. g. E 167, Doc#5821 A Specification for Subsystem Utilities Savings Mode Communication)

TF/ WG/ SG Reports -2 • Greenhouse Gas (GHG) Emission Characterization Task Force – TF continuously checks compatibility of SEMI S 29 and EPA. – Contacted SEMATECH about GHG Reporting Rule

TF/ WG/ SG Reports -3 • FPD System Safety Task Force – Doc. 5875: Revision to S 26 -0415: Environmental, Health, and Safety Guideline for FPD Manufacturing System (Line Item Revision) • is submitted for Cycle 6, 2015.

TF/ WG/ SG Reports -4 • Seismic Protection Task Force – Doc. #5556 A, Line Item Revisions to SEMI S 2 -0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revisions Related to Section 19 Seismic Protection • be submitted to Cycle 6, 2015 or later cycle.

TF/ WG/ SG Reports -5 • STEP Planning Working Group – STEP/ SEMI S 2 will be held on October or November, 2015 at the SEMI Japan, Tokyo

Thank you! Responsible Staff Junko Collins, SEMI Japan, jcollins@semi. org