Environmental Health and Safety Japan TC Chapter Liaison

Environmental, Health and Safety Japan TC Chapter Liaison Report North America EHS TC Chapter Meeting November 10, 2016

Leadership • Committee Co-chairs – Hidetoshi Sakura/ Nuflare • GCS voting member • EHS Committee representative to the JRSC – Moray Crawford/ Hatsuta Seisakusho • GCS voting member – Supika Mashiro/ Tokyo Electron • Leadership Changes – None

TC Chapter Organization EHS Japn TC Chapter Hidetoshi Sakura/ Nuflare Moray Crawford/ Hatsuta Seisakusho Supika Mashiro/ TEL FPD System Safety TF Naokatsu Nishiguchi/ Screen Semiconductor Solutions S 23 Revision Global TF George Hoshi / TEL Lauren Crane/ TEL STEP Planning WG Kenji Sugihara/ Panasonic GHG Emission Characterization TF George Hoshi / TEL Seismic Protection TF Naokatsu Nishiguchi/ Screen Semiconductor Solutions SDRCM TF Supika Mashiro/ TEL

Meeting Information • Previous Meetings – April 19, 2016 at SEMI Japan Office – June 28, 2016 at SEMI Japan Office • Next Meeting – 10: 00 -14: 00, December 16, 2016 at Conference Tower, Tokyo Big Site, Tokyo, Japan

Ballot Result on June 28 and Ratification Ballot • Doc. 5556 B: Line Item Revision to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, Revisions to § 19 “Seismic Protection” (In Delayed Effective Date Format) – Passed with editorial changes and technical changes • Ratification Ballot to validate all of the technical changes made by a TC Chapter during adjudication of 5556 B – Ratification Ballot R 5556 B submitted to be voted for Cycle 6 • Clear the condition to pass – Also both 5556 B and R 5556 B passed the A&R process

Ballot Result on June 28 and Ratification Ballot • Doc. 5947 A: Revision to SEMI S 23 -0813, with title change from “GUIDE FOR CONSERVATION OF ENERGY, UTILITIES AND MATERIALS USED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT” to “GUIDE FOR ENERGY, UTILITIES AND MATERIALS USE EFFICIENCY OF SEMICONDUCTOR MANUFACTURING EQUIPMENT” – Passed with editorial changes and technical changes • Ratification Ballot to validate all of the technical changes made by a TC Chapter during adjudication of 5947 A – Ratification Ballot R 5947 A submitted to be voted for Cycle 6 • Clear the condition to pass – Also both 5947 A and R 5947 A passed the A&R process

Upcoming Ballots • NONE

TF/ WG/ SG Reports -1 • S 23 Revision Global Task Force – No special report except Doc. 5947 A at the TC Chapter meeting on June. 29. • Passed the TC Chapter review on June 28, 2016 • Ratification Ballot R 5947 A will be submitted to Cycle 6, 2016 • R 5947 A passed A&R and now during publication process

TF/ WG/ SG Reports -2 • Greenhouse Gas (GHG) Emission Characterization Task Force – No special update from the last report

TF/ WG/ SG Reports -3 • FPD System Safety Task Force – Doc. 5875: Revision to S 26 -0415: Environmental, Health, and Safety Guideline for FPD Manufacturing System (Line Item Revision) • S 26 -0516 was published – No other special update from the last report, but task force disbandment is under consideration.

TF/ WG/ SG Reports -4 • Seismic Protection Task Force – Doc. 5556 B, Line Item Revisions to SEMI S 2 -0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Revisions Related to Section 19 Seismic Protection • Passed the TC Chapter review on June 28, 2016 • Ratification Ballot R 5556 B will be submitted to Cycle 6, 2016 • R 5556 B passed A&R and now during publication process

TF/ WG/ SG Reports -5 • SDRCM (S Documents REG-PG-SM Conformance Maintenance) TF – Doc. 5972: Reapproval of SEMI S 19 -031, Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service Personnel. • Submitted to Cycle 1, 2016 • Super clean

TF/ WG/ SG Reports -6 • STEP Planning Working Group – STEP/ SEMI S 2 is held on November 22 at SEMI Japan Office.

Thank you! Staff contact Junko Collins SEMI Japan jcollins@semi. org