Environmental Health and Safety EHS TC Chapter Liaison

Environmental, Health, and Safety (EHS) TC Chapter Liaison Report Rev 1 - Feb 22, 2016

Organization Chart North America Environmental, Health, and Safety Committee Energetic Materials EHS TF Ergonomics (S 8) TF Manufacturing Equipment Safety Subcommittee (MESSC) S 2 Chemical Exposure TF Fire Protection (S 14) TF Device Removal and Shipment TF S 2 Interlock Reliability TF Lifting Equipment TF (Inactive) Flow Limitation TF S 2 Ladders & Steps TF S 6 Revision TF S 10 Revision TF S 22 Revision TF S 23 Global TF S 27 Revision TF S 2 Non-Ionizing Radiation TF Seismic Liaison TF Control of Hazardous Energy (Co. HE) TF

Meeting Information • Last Meeting: – November 5 at the NA Standards Fall 2015 Meetings San Jose, California (SEMI Headquarters) • Next Meeting: – April 7 at the NA Standards Spring 2016 Meetings San Jose, California (SEMI Headquarters)

Task Force Changes • Task Force name change – From • Hazardous Energy Control Isolation Devices Task Force – To • Control of Hazardous Energy (Co. HE) Task Force

Committee Activities Document Review Summary – Fall 2015 Meetings 1 of 2 Cycle 7, 2015 Doc # Description 4316 M Line Item Revision to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S 22 -0715, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision related to Fail-to-safe Equipment Control Systems (FECS) LI 1: Clarification/Improvement of the FECS criteria 4683 G TC Action Passed with editorial changes Line Item Revision to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure LI 1: Delayed Revisions Related to Chemical Exposure Criteria Failed, reballot Update: Ballot 4316 M-LI 1 passed subsequent procedural review.

Committee Activities Document Review Summary – Fall 2015 Meetings 2 of 2 Cycle 7, 2015 Doc # Description 4449 F Line Item Revisions to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders TC Action LI 1: Addition of a Delayed Revisions Section Related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders Passed with editorial changes 5892 Passed with editorial changes Revision to SEMI S 5 -0310 With Title Change From: Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves To: Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gases Update: Ballot 4449 F-LI 1 and 5892 passed subsequent procedural review.

Committee Activities Editorial Changes approved via PIP* – Fall 2015 Meetings Doc # Description SEMI S 10 -0815 Safety Guideline for Risk Assessment and Risk Evaluation Process Table A 1 -1 Severity Groups NOTE 16: This number is if 1 to 2 people are exposed to the risk. The severity group should be reconsidered to a more severity group when 3 or more people are involved. NOTE 17: Although it is not a safety risk it adds value to take in account product (e. g. , wafers, reticles) damage. No descriptions are given due to the fact of the value and number of products on an equipment can vary. Possible descriptions can be: Rework of a wafer, Rework of a batch, Loss of a batch. * Publication Improvement Proposal (PIP)

Committee Activities Ballots for review at NA Spring 2016 Meetings * Cycle 1 or 2, 2016 * Doc # Description TF / SC 5625 Line Item Revisions to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Non-Ionizing Radiation S 2 Non-Ionizing Radiation TF 4683 H Line Item Revisions to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions related to Chemical Exposure S 2 Chemical Exposure TF 5969 Line Item Revision to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Revisions Related to Insertion of screening flowchart and procedure for its use and Restructuring of Sections 14. 5 thru 14. 7 Fire Protection TF 5970 Line Item Revision to SEMI S 14, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment Related to Definitions and Table A 1 -3 Fire Protection TF

Committee Activities New SNARFs • Doc. 5957 Line Item Revision of SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment( Re: Control of Hazardous Energy) – Offers criteria for insertion in SEMI S 2 for guidance on how to control of hazardous energies within § 05 terminology, § 17 and design criteria, in the form of an Related Information or Appendix section. – Responsible TF - Control of Hazardous Energy (Co. HE) TF • Doc. 5958 Line Item Revision of S 27, Safety Guideline for the Contents of Environmental, Safety, and Health (ESH) Evaluation Reports – Covers improvements to S 27 based on industry input. – Responsible TF – S 27 Revision TF

Committee Activities Abolished SNARF • S 6 Revision TF – SNARF 4625, Line Item Revisions to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revisions related to ventilation) – SNARF was approved in July 2008, which exceeds 3 years Project period (Regs 8. 3. 2)

Committee Activities Subcommittee & Task Force Updates [1/13] • MESSC (Manufacturing Equipment Safety Subcommittee) – New Business Discussion • Problem Statement: – How should we address service tasks within SEMI S 2 and S 8? • Should there be a boundary to what needs to be assessed? • How should this boundary be defined? • Expected lifetime of equipment? • Service likely to occur 1 to 5 years beyond installation? • Service likely to occur within the first year of installation? • No boundary • MESSC suggests that S 8 TF continue discussion of incorporating flow chart and task list as an RI

Committee Activities Subcommittee & Task Force Updates [2/13] • S 2 Chemical Exposure TF – Ballot 4683 G-LI failed (Delayed Revisions Related to Chemical Exposure Criteria) • Ballot 4683 H will be issued for Cycle 1 or 2, 2016 • S 2 Ladders & Steps TF – Ballot 4449 F-LI 1 passed (Addition of a Delayed Revisions Section Related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders)

Committee Activities Subcommittee & Task Force Updates [3/13] • S 2 Non-Ionizing Radiation TF – The TF is looking to generate two line item changes to S 2 (via Doc. 5625) • Add the cleaned up tables to RI 7 to demonstrate how we developed the existing published levels • A comparison to the new EU Worker Protection directive for EM fields and 2014 version of ACGIH to demonstrate we have reviewed against the updated external requirements and are still good. – If the directive is found to have lower values, this will be brought back to the TF to discuss. ACGIH - American Conference of Industrial Hygienists

Committee Activities Subcommittee & Task Force Updates [4/13] • S 5 Revision (Flow Limitation) TF – Ballot 5892 passed. TF will consider disbanding at the next meeting. • S 6 Revision TF – Current activities: • 3 potential line item changes presented • Only one was able to be fully discussed within the allotted TF meeting • Additional conference calls will be scheduled • Line items / summary of proposed text is requested to be complete and not taken out of the document context which potentially effects the evaluation of the proposed

Committee Activities Subcommittee & Task Force Updates [5/13] • S 10 Revision TF – Action plan • First solve several small issues by using line item ballots (done) • Major discussion on risk ranking tables – Discussion • Severity – Environmental still needs criteria – Equipment/facility loss move from descriptive to $$$ – Do not add Loss of use of equipment or facilities (from S 14) • Likelihood table – Making an RI with examples for Likelihood – Alignment with S 14 – Spring meeting, possibly to propose for ballot.

Committee Activities Subcommittee & Task Force Updates [6/13] • S 8 Ergonomics TF – Current activities • Line Item Revisions to SEMI S 8. Addition of reference to a manual materialhandling guide in SEMI S 8, Appendix 2, Lifting, Strength, and Materials Handling (#5917) • Working with SEMI Publications on restoring “toe clearance” criteria that went missing between S 8 -0999 and S 8 -1000 • S 22 Revision TF – Ballot 4316 M-LI 1 passed. • LI 1 - Clarification of Fail-to-safe Equipment Control Systems (FECS) criteria

Committee Activities Subcommittee & Task Force Updates [7/13] • S 23 Revision GTF – Ballot 5947, Revision to SEMI S 23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment • Addressing energy efficiency improvements in addition to overall annual energy use reduction • Ballot issued in cycle 8 -15 for review at SEMICON Japan • S 27 Revision TF – New SNARF 5958, Line Item Revision of S 27, Safety Guideline for the Contents of Environmental, Safety, and Health (ESH) Evaluation Reports • S 27 was sent to re-approval ballot, a number of negatives were submitted and found to be persuasive – suggesting the need for changes to S 27. This SNARF will cover improvements to S 27 based on industry input.

Committee Activities Subcommittee & Task Force Updates [8/13] • Energetic Materials EHS TF – Continuing development of ballot 5761 A. • New Standard: Environmental, Safety and Health Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes – Worked through 51 negatives and 50 comments from the First Ballot during weekly Task Force teleconferences – Substantial discussion and work has been conducted to create decision making flowcharts that have sound and defensible logic in defining an energetic material • Ballot will be issued in cycle 1 or 2 for review at NA Spring 2016

Committee Activities Subcommittee & Task Force Updates [9/13] • Fire Protection TF – Current activities: • Section 14 of S 2: – Tiered Approach for Fire Risk Assessment between S 2 and S 14 – Restructuring Section 14 of S 2 • S 14: – – – Alignment with S 10 Application of S 14 to events that involve smoke or charring, but not flame Assessment of smoke risk in fabs Move Fire Detection & Suppression Sections to S 14 Inclusion of FPD equipment in the Scope of S 14 • Alignment with S 10 – Changing Risk of 4 A From “Medium” to “Low” (substantive) – Changing “Slight” to “Very Low” and “Critical” to “Very High” (editorial) – Definitions

Committee Activities Subcommittee & Task Force Updates [10/13] • Fire Protection TF (cont’d) – TF Future Plans / Timeline: • Handle ballot responses • Continue work on topics not yet ready for ballot • Future Line Item or Major Revision Ballot – Future Ballots • Ballot Authorization (2016 C 1 or 2) for S 2: – Insertion of screening flowchart and procedure for its use – Restructuring of Sections 14. 5 through 14. 7 • Ballot Authorization (2016 C 1 or 2) for S 14: – Definitions – Table A 1 -3 » Change Risk assigned to 4 A from “Medium” to “Low” (align with S 10) » Change instances of “Critical” to “Very High” and of “Slight” to “Very Low” (align with S 10)

Committee Activities Subcommittee & Task Force Updates [11/13] • Control of Hazardous Energy (Co. HE) TF – New SNARF 5957 Line Item Revision of S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. ( Re: Control of Hazardous Energy) – Section 17; “Control of Hazardous Energy and LOTO” • Work on finishing wording in Section 17 (estimated 25% through current draft wording) • Work on new SEMI S 2 definitions • Consider RI for visual examples of requirements – Some of the key issues TF is currently dealing with: • “readily accessible” has current definition in SEMI terms, but TF may want to modify current or create new definition specific for LOTO locations… how easy is it to get to perform? ? • “integrated locking capability” – how strict do we want to be about this? • “special considerations for non-electrical”

Committee Activities Subcommittee & Task Force Updates [12/13] • Hazardous Energy Control Isolation Devices TF – Important new definitions need to define: (cont’d) • • • significant risks • • • control reliable: (used in ANSI-RIA robotics standards) • • integral capability to accept a lock • EID – energy isolation device (or HEID? ) hazardous energy isolation may be different than EID? Reference other new standards? ANSI? • • • Control of Hazardous Energy; Co. HE hazardous energy versus hazard Do we need 1 word for inclusion of installation, maintenance and service? ? Padlock Hazardous energy isolation capabilities (to clarify that they are intended by the equipment supplier to be used– does not apply to all possible locations where Co. HE could be done. de-energization / zero energy state durability of control: what is minimum requirements – if I can remove without damage or use of tools - that is not desired! EID – energy isolation device (or HEID? ) hazardous energy isolation may be different than EID? Reference other new standards? ANSI? “readily accessible” expand current definition? More Expected…. (Co. HE = unexpected release)

Committee Activities Subcommittee & Task Force Updates [13/13] • NA Seismic Liaison TF – Ballot 5556 A, Line Item Revisions to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Revisions Related to Section 19 Seismic Protection • Issued in cycle 8 -15 for review at SEMICON Japan – Providing ballot comments for Japan TF.

NA Standards Spring 2016 Meetings April 4 -7, San Jose, CA Sunday 3 Monday Tuesday 4 5 Wednesday 6 Thursday 7 Friday 8 Saturday 9 3 DS-IC EH&S Schedule at-a-glance Facilities & Gases HB-LED Information & Control Liquid Chemicals MEMS/NEMS Metrics Silicon Wafer PV Materials PIC

Thank You! For more information or participate in any NA EHS activities, please contact Kevin Nguyen at SEMI (knguyen@semi. org)