Environmental Health and Safety EHS TC Chapter Liaison

Environmental, Health, and Safety (EHS) TC Chapter Liaison Report September 6, 2016

Meeting Information • Last Meeting: – July 14 at SEMICON West 2016 SF Marriott Marquis, San Francisco, California • Next Meeting: – Nov 10 at the NA Standards Fall 2016 Meetings San Jose, California (SEMI Headquarters)

Organization Chart North America Environmental, Health, and Safety Committee Energetic Materials EHS TF Ergonomics (S 8) TF Fire Protection (S 14) TF Lifting Equipment TF (Inactive) Manufacturing Equipment Safety Subcommittee (MESSC) S 2 Chemical Exposure TF Device Removal and Shipment TF S 2 Interlock Reliability TF S 2 Ladders & Steps TF S 6 Revision TF S 2 Non-Ionizing Radiation TF S 10 Revision TF (Inactive) S 22 Revision TF S 23 Global TF Seismic Liaison TF Control of Hazardous Energy (Co. HE) TF

Committee Activities Document Review Summary – West 2016 Meetings 1 of 2 Cycle 5, 2016 Doc # Description TC Action 4683 I Line Item Revision to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure LI 1: Delayed Revisions Related to Chemical Exposure Criteria Failed, reballot 5969 Failed, reballot New Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes 5970 A Line Item Revisions to SEMI S 14, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment LI 1: Changes to Terminology to Align with SEMI S 10. Passed as balloted

Committee Activities Document Review Summary – West 2016 Meetings 2 of 2 Cycle 5, 2016 Doc # Description 5917 Line Item Revisions to SEMI S 8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment TC Action LI 1: Add a Definition for “hand-object coupling point” in the Terminology Section LI 2: Add a reference to SEMATECH ISMI Manual Material Handling Application Guide LI 3: Revisions and additions to hand/arm clearances Passed superclean LI 4: Add a new Related Information section to assist with determining what tasks are within the scope of an assessment to SEMI S 8 Failed, reballot Passed superclean Failed, reballot

Committee Activities Ballot for review at NA Fall Meetings * Cycle 7, 2016 * Doc # Description TF / SC 4683 I Line Item Revisions to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions related to Chemical Exposure) S 2 Chemical Exposure TF

Committee Activities New SNARF • Doc. 6049 Line-Item Revision to SEMI S 10 -0815 E Safety Guideline for Risk Assessment and Risk Evaluation Process – Make S 10 tables more robust and provide an example where all types of risk are explained • Update the Appendix tables (and align with S 14 to not have conflicting matrices)) • Update/add an RI with much better explanation of all risks • Reference in main body S 10 to the RI • Responsible TF – S 10 Revision TF

Committee Activities Voted to Abolish • Doc. 5623 – Revision to SEMI S 1, Safety Guideline for Equipment Safety Labels • Doc. 5625 – Line Item Revisions to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Non-Ionizing Radiation

Committee Activities Granted a 1 year extension • Doc. 4683 – Line Item Revision to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure • Doc. 4975 – Line Item Revision to SEMI S 6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment • Doc. 5624 – Revision to SEMI S 2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Changes related to representative sampling

Committee Activities Subcommittee & Task Force Updates [1/12] • MESSC (Manufacturing Equipment Safety Subcommittee) – A former Lew Bass associate, Eugene Heil, has created a booklet of references to various International safety standards and guidelines that he is offering via electronic link • If interested, send email to: abstraction@engineering. com – Request SEMI to become an SDO under ANSI

Committee Activities Subcommittee & Task Force Updates [2/12] • S 2 Chemical Exposure TF – Ballot 4683 H-LI failed (Delayed Revisions Related to Chemical Exposure Criteria) • Ballot 4683 J will be issued for Cycle 7, 2016 • S 2 Non-Ionizing Radiation TF – Lack of productivity – To remain inactive

Committee Activities Subcommittee & Task Force Updates [3/12] • S 6 Revision TF – Current activities: • Line Item 1 change to Flow rate definitions -Proposed Separate Ballot, need technical editor. • Line items 2 and 3, release rate determination, internal testing requirement for flammability continued discussion, work in progress.

Committee Activities Subcommittee & Task Force Updates [4/12] • S 10 Revision TF – Alignment of issues should be addressed for next ballot • Problem Statement #1 – Steps to the risk assessment method, while generally understood by EHS professionals and 3 rd parties, but are not well understood by engineering teams and customers. • Proposed Solution#1: – SEMI S 10 can give additional guidance on important things to consider during the risk assessment.

Committee Activities Subcommittee & Task Force Updates [5/12] • S 8 Ergonomics TF – Current activities • Line Item Revision to SEMI S 8. Addition of reference to a manual material-handling guide in SEMI S 8, Appendix 2, Lifting, Strength, and Materials Handling (#5917 A) – To be issued after the NA Fall meeting • Line Item Revision to S 8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment (#5996 New SNARF) – Address 7 additional areas that have been identified as needing some work or new development within the document.

Committee Activities Subcommittee & Task Force Updates [6/12] • Energetic Materials EHS TF – Continuing development of ballot 5761 B. • New Standard: Environmental, Safety and Health Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes – Weekly and bi-weekly Task Force meetings to continue discussion of technical comments, based on first ballot negatives – Substantial discussion and work in the following sections » Rewording and clarification on Hazards Analysis section » Clarification on process chemical information to be provided by suppliers » Clarification on delivery container design criteria » Additional information and examples added to the Material Characterization RI » Rework of RI describing the planning process for opening systems » Addition of notes and related information • Ballot will be issued after the NA Fall meeting

Committee Activities Subcommittee & Task Force Updates [7/12] • Fire Protection TF – Ballot Adjudication • 5970: Line Item Revisions to SEMI S 14 – LI 1: Changes to Terminology to Align with SEMI S 10: Passed (w/ Editorial change to title from “Safety Guidelines” to “Safety Guideline”) – Ballot failed A&R and may need to be reissued after the NA Fall meeting • 5969: Line Item Revisions to SEMI S 2 – LI 1: Addition of criteria to determine which method of assessing fire risk is to be used: Failed, returned to TF for rework and reballot

Committee Activities Subcommittee & Task Force Updates [8/12] • Fire Protection TF (cont’d) – Other Topics • Application of S 14 to events involving smoke or charring, but not flame • Assessment of smoke risk in fabs • Move Fire Detection & Suppression Sections to S 14 • Inclusion of FPD, solar, solid state light sources, et al. equipment in the Scope of S 14 • Further Alignment of S 14 with S 10 • Handle ballot responses • Continue work on topics not yet ready for ballot • Future Line Item or Major Revision Ballot

Committee Activities Subcommittee & Task Force Updates [9/12] • Control of Hazardous Energy (Co. HE) TF – ANSI Z 244. 1 Committee accepted 129 editorial/technical proposals • Annex S “Application of this Standard to the Semiconductor Industry” • It was reported the new version will be published within a month. – New actions moving forward • Complete SEMI White Paper (referenced in ANSI Z 244. 1) • Consider new wording in Section 17 based on ANSI re-write. • Work on finishing previous proposed wording within Section 17 • Work on new SEMI S 2 definitions • Consider RI for visual examples of requirements

Committee Activities Subcommittee & Task Force Updates [10/12] • NA Seismic Liaison TF – Doc. 5556 B, Line Item Revisions to SEMI S 2 -0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revisions Related to Section 19 Seismic Protection) • was approved at Japan’s last meeting. – The Ratification ballot will be issued in cycle 6 -16 to be ratified technical changes. – If the ballot is approved, the TF will be disbanded unless something new comes up.

Committee Activities Subcommittee & Task Force Updates [12/12] • S 22 Revision TF – Asked for questions/suggestions for new work • EMO hand access requirements – button size and shrouding limitations • How necessary is the EMO and actually risk assessing • Service EMOs at strange work locations – is some text for encouraging/allowing these worthwhile • Interlock bypass vs. override vs. defeat – Terminology is used interchangeably and is getting problematic – There is a “new” ISO standard that includes a test/definition of easily overrideable which may be appropriate to use as source material – Activities Going Forward • Plan is to restart teleconferences before Fall meetings

Committee Activities Subcommittee & Task Force Updates [12/12] • S 23 Global TF – Doc. 5947 A, Revision to SEMI S 23 -0813, with title change to "Guide for Energy, Utilities and Materials Use Efficiency of Semiconductor Manufacturing Equipment” • was approved at Japan’s last meeting. – Document 5947 A will also be issued for Ratification ballot in cycle 6 -16.

Thank You! For more information or participate in any NA EHS activities, please contact Kevin Nguyen at SEMI (knguyen@semi. org)