Encapsulation Studies Encapsulation Study February 17 2005 Slide
Encapsulation Studies Encapsulation Study, February 17, 2005 Slide 1
Encapsulation Studies • 100 modules encapsulated with Sylgard 186 • Modules tested before/after encapsulation à No channel failures were found • In order to test the effect of thermal cycling, envorimental chamber acquired xxx-xxx cycles between -30 C and 50 C and then test à Xxx-xxx extreme cycles between -40 C and 80 C and re-test à Encapsulation Study, February 17, 2005 Slide 2
First thermal cycle • 36 modules tested so far à xxx-xxx cycles each between -30 C and 50 C • Only 1 had any new failed channels after cycles à It has 9 new 2 sensor opens (1. 7%) – Opens vary with time Intermittent connections – 1 bond lift-off visible – 2 had scratches on PA which might have caused opens after repeated freezing and baking – Most channels have no visible damage à In total, only 0. 05% channels effected Encapsulation Study, February 17, 2005 Slide 3
Second Extreme Thermal Cycle • 17 modules tested so far à XX cycles between -40 C to 80 C • 7 modules have new failures à à 1 chip acts if the FE is dead 6 other modules have in total 12 new opens – 5 opens at module edges where bonds used to be difficult to make 4 of 6 modules à à In most cases, bond damage not visible 1. 6% of channels effected – 0. 1% if chip failure excluded Encapsulation Study, February 17, 2005 Slide 4
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