Electronics Overview H C A L Electronics System
- Slides: 33
Electronics Overview H C A L Electronics • System Overview • Power • Backplane • Readout Module (RM) • Clock and Control Module (CCM) • Calibration Module Theresa Shaw (FNAL) CMS HCAL HB RBX PPR - March, 2001 Electronics 1
FE/DAQ Readout CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 2
RBX Design Critical for Electonics H C A L RBX Provides Power, Cooling, Clock distribution, and Slow Controls Communication RBX Design critical for Connector Choice Backplane development Power/Grounding plans Prototype Work this Summer CMS HCAL HB RBX PPR - March, 2001 Electronics 3
HB RBX 36 HB RBXs CMS HCAL HB RBX PPR - March, 2001 H C A L 4968 Channels Electronics 4
HE Box 36 HE RBXs CMS HCAL HB RBX PPR - March, 2001 H C A L 3672 Channels Electronics 5
Power Consumption HB RBX – 298 W 23 A@6. 5 V 33 A@4. 5 V CMS HCAL HB RBX PPR - March, 2001 H C A L HE RBX – 205 W 17 A@6. 5 V 21 A@4. 5 V Electronics 6
HB Backplane Function H C A L Backplane • ~87 CM LONG • Provides Power • Distributes 40 MHz Clock (3 load max) • Provides path for RBXbus (serial communication bus) • Temperature feedback CMS HCAL HB RBX PPR - March, 2001 Electronics 7
Backplane Low Voltage Power Connector H C A L Product Facts "Inverse-sex" design meets IEC 950 safety requirements Current rated at 7. 8 amperes per contact, 23. 5 amperes per module, fully energized Sequenced right-angle headers available for "make-first/break-last" applications ACTION PIN press-fit contacts on both headers and receptacle Contacts designed for up to 250 mating cycles Recognized to U. S. and Canadian requirements under the Component Recognition Program of Underwriters Laboratories Inc. CMS HCAL HB RBX PPR - March, 2001 Electronics 8
Backplane Connectors H C A L Type C and Enhanced Type C Assemblies Minimum adjacent mounting space required: 12. 7 [. 500] Current Rating: Per DIN 41612* Voltage Rating: 250 VAC Dielectric Rating: 1000 VAC Contact Resistance: 15 milliohms initial at 100 ma and 50 mv, open circuit CMS HCAL HB RBX PPR - March, 2001 Electronics 9
FE Card Pinout CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 10
Backplane Stack-up CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 11
Readout Module Overview CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 12
HPD Interface Board CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 13
Signal Cable CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 14
FE Channels CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 15
QIE Description H C A L QIE Charge Integrator Encoder 4 stage pipelined device (25 ns per stage) charge collection settling readout reset Inverting and Non-inverting Inputs Internal non-linear Flash ADC Outputs 5 bit mantissa 2 bit range exponent 2 bit Cap ID CMS HCAL HB RBX PPR - March, 2001 Electronics 16
H QIE Specification C A L QIE Design Specifications Clock Speed >40 MHz Must accept both polarity of charge input Positive Input gain relative to Negative Input = 2. 67 Charge sensitivity Lowest Range = 1 f. C/LSB In Calibration Mode 1/3 f. C/LSB Range 0 only Linear FADC Maximum Charge = 9670 f. C/25 ns Noise 1. 5 LSBs in calibration mode, gaussian Nominal Pedestal Calibration Mode nominal Ped = 6. 5 Normal Data Mode Ped =. 5 FADC Differential Non-Linearity <. 05 LSBs CMS HCAL HB RBX PPR - March, 2001 Electronics 17
FLASH ADC Quantization CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 18
Channel Control ASIC H C A L The CCA provides the following functions: · The processing and synchronization of data from two QIEs, · The provision of phase-adjusted QIE clocking signals to run the QIE charge integrator and Flash ADC, · Checking of the accuracy of the Capacitor IDs, the Cap IDs from different QIEs should be in synchronization, · The ability to force the QIE to use a given range, · The ability to set Pedestal DAC values, · The ability to issue a test pulse trigger, · The provision of event synchronization checks – a crossing counter will be implemented and checked for accuracy with every beam turn marker, · The ability to send a known pattern to the serial optic link, · The ability to “reset” the QIE at a known and determined time, · And, the ability to send and report on any detected errors at a known and determined time. CMS HCAL HB RBX PPR - March, 2001 Electronics 19
QIE/CCA Process Reliability H C A L AMS 0. 8 u Bi. CMOS Process (QIE) Early Failure rate 0. 05 - 0. 2%; can be reduced to a few ppm by burn-in Predicted MTTF (25 sqmm, 55 C) is 1. 67 E 8 hours Expect less than 1 QIE failure per year HP/Agilent 0. 5 u CMOS Well established Commercial Process CMS HCAL HB RBX PPR - March, 2001 Electronics 20
Radiation Tolerance H C A L • HCAL Radiation Environment • Radiation dose over 10 yrs – 1 k. Rad TID and 4 E 11 n/cm 2 • Electronics • QIE and CCA • QIE – AMS 0. 8 mm bi-CMOS process • Test bi-polars (TID+bulk damage) and MOS circuits (SEU) • CCA – HP 0. 5 mm bulk-CMOS process • Test MOS circuits (SEU) • Serializer – developed in rad hard process • LV regulators – developed in rad hard process • LEDs, other support components – need to test • Studies performed at Indiana U. Cyclotron (200 Me. V protons) • Bulk Damage studies • Bi-polars dosed to fluence equivalent of 5 E 11 n/cm 2 • SEU studies • AMS and HP test registers CMS HCAL HB RBX PPR - March, 2001 Electronics 21
Bi-polar Radiation Studies for QIE H C A L • Bi-polars from AMS 0. 8 mm bi-CMOS process • Beta for npn-transistors dropped by 5 -10% after equivalent of 5 E 11 n/cm 2 Pre-irradiation Post-irradiation (6 weeks) 15 15 0. 0 b = 95. 1 Beta b = 104 15. 0 /div Operating point – 10 m. A 0 Decade/div Current CMS HCAL HB RBX PPR - March, 2001 Operating point – 10 m. A -1 E-02 0 Decade/div -1 E-02 Current Electronics 22
H SEU Studies for QIE and CCA C A L • Test registers (min. feature size, min+guard ring, 2 Xmin+guard ring, SEU tolerant) • Xsec results for AMS and HP processes • (1 -10)E-15 SEU per n/cm 2 per cell (depending on angle) for conservative design using 2 Xmin feature size + guard ring • For a complex ASIC with 1000 cells and a fluence of 4 E 11 n/cm 2 over a 10 yr operating period • Expect. 04 -. 4 of an upset per ASIC per year CMS HCAL HB RBX PPR - March, 2001 Electronics 23
GOL Design Specifications H C A L Synchronous (constant latency) Transmission speed • fast: 1. 6 Gbps , 32 bit data input @ 40 MHz • slow: 0. 8 Gbps , 16 bit data input @ 40 MHz Two encoding schemes • G-Link • Fiber channel (8 B/10 B) Interfaces for control and status registers • I 2 C • JTAG CMS HCAL HB RBX PPR - March, 2001 Electronics 24
Gigabit link (G-Link, 8 B/10 B optional) G-Link Encoder Data[31: 0] 32 Data (15) Interface 16 Clk 40 20 Serializer Laser Driver H C A L (0. 8 Gbps) 1. 6 Gbps G-Link 8 B/10 B Encoder Laser diode I 2 C JTAG Control & Status Registers CMS HCAL HB RBX PPR - March, 2001 PLL 50 Line Driver Out+ Out- Electronics 25
GOL Radiation hardness H C A L Deep submicron (0. 25 um) CMOS Enclosed CMOS transistors Triple voting in state machines Up-sizing of PLL components Auto-error correction in Config. registers CMS HCAL HB RBX PPR - March, 2001 Electronics 26
VCSEL Selection CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 27
VCSEL Mechanics CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 28
Rad Tolerant Voltage Regulator H C A L Developed by ST Microelectronics Specified by CERN RD 49 Shown to be Rad Hard Presently fixing overvoltage protection Prepreduction parts due June 2001 Production parts late 2001 CMS HCAL HB RBX PPR - March, 2001 Electronics 29
Readout Card Dimension CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 30
FE Card Component Area CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 31
Readout Card Component Height CMS HCAL HB RBX PPR - March, 2001 H C A L Electronics 32
Conclusions H C A L Need to finalize RBX design Readout Card connector and mechanics cannot be finalized Backplane production on hold Our Goal is to have a working FE/DAQ slice by Summer ’ 01 We would like to have a production RBX to test clock distribution, noise, … CMS HCAL HB RBX PPR - March, 2001 Electronics 33
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