ECE 300 Microprocessor Project Nick Jones Bibi Morales
ECE 300 Microprocessor Project Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin Group 9
Objectives l l l To learn to use teamwork and communication skills to complete a project. Gain experience with PCBs and surface mount components Learn precision soldering Programming and debugging in C To select a proper temperature sensor that meets the needs of our particular project.
Board Components - Chip l The first component that was soldered onto the board was the MSP 430 chip using the provided microscope. l This was done by aligning the chip with the circuit traces and keeping it stable with a tiny bit of flux. There were 100 solder connections which proved to be difficult at first. l
Board Components-LCD Display l l l 40 pin LCD It was difficult to line up the pins to fit in the slots on the board. The holes on the board sucked the solder down into board.
Board Components – Resistor and Capacitors l These components were placed on the board and held in place by a small amount of solder. l They were then soldered down. C 1 C 2 C 3 C 4 C 5 C 6 C 9 C 10 R 5 0. 1 uf 10 uf (polarized) 1. 0 uf 0. 1 uf 47 kohms
Board Components- Other parts l The components were placed on the board: l l l Push button switch voltage regulator 5 volt input connector slider switch JTAG connector 32. 7 k. Hz crystal
Board Components – Switch l Added switch l Selects between l l On board AD 22103 Off board AD 590
The Completed Board
Sensor Circuit AD 22103 AD 590
Temperature Sensor l AD 590 and AD 22103
Programming the Chip l l l The files provided by Dr. Green, lcd. c, lcd. h, delay. c, delay. h, demo. c, sensor. c, were used in our project. The MSP 430 Flash emulation tool was connected to the board and the computer. Using IAR and C-SPY we programmed the board.
Programming the Board sensor. c
AD 22103 Results
AD 590 Results
Questions? Group 9 Nick Jones Bibi Morales Hadi Choueiry Tyler Griffin
- Slides: 15