doc IEEE 802 11 160914 r 1 Bit
doc. : IEEE 802. 11 -16/0914 r 1 Bit field finalization for HE-SIG-A Date: 2016 -07 -25 Authors: Name Affiliation Address Phone Email Lochan Verma 5775 Morehouse Dr. San Diego, CA, USA lverma@qti. qualcomm. com Sameer Vermani 5775 Morehouse Dr. San Diego, CA, USA svverman@qti. qualcomm. com Bin Tian Youhan Kim Arjun Bharadwaj Submission Qualcomm 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA Slide 1 btian@qti. qualcomm. com youhank@qca. qualcomm. com arjunb@qti. qualcomm. com Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Phone Email Albert Van Zelst Straatweg 66 -S Breukelen, 3621 BR Netherlands allert@qti. qualcomm. com Alice Chen 5775 Morehouse Dr. San Diego, CA, USA alicel@qti. qualcomm. com Alfred Asterjadhi Carlos Aldana George Cherian Gwendolyn Barriac Hemanth Sampath Lin Yang Menzo Wentink Naveen Kakani Raja Banerjea Richard Van Nee Rolf De Vegt Simone Merlin Tevfik Yucek VK Jones Submission Qualcomm 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA Straatweg 66 -S Breukelen, 3621 BR Netherlands 2100 Lakeside Boulevard Suite 475, Richardson TX 75082, USA 1060 Rincon Circle San Jose CA 95131, USA Straatweg 66 -S Breukelen, 3621 BR Netherlands 1700 Technology Drive San Jose, CA 95110, USA 5775 Morehouse Dr. San Diego, CA, USA 1700 Technology Drive San Jose, CA 95110, USA Slide 2 aasterja@qti. qualcomm. com caldana@qca. qualcomm. com gcherian@qti. qualcomm. com gbarriac@qti. qualcomm. com hsampath@qti. qualcomm. com linyang@qti. qualcomm. com mwentink@qti. qualcomm. com nkakani@qti. qualcomm. com rajab@qit. qualcomm. com rvannee@qti. qualcomm. com rolfv@qca. qualcomm. com smerlin@qti. qualcomm. com tyucek@qca. qualcomm. com vkjones@qca. qualcomm. com Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Ron Porat Sriram Venkateswaran Matthew Fischer Phone Email rporat@broadcom. com mfischer@broadcom. com Zhou Lan Leo Montreuil Broadcom Andrew Blanksby Vinko Erceg Thomas Derham Mingyue Ji Submission Slide 3 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Robert Stacey robert. stacey@intel. com Shahrnaz Azizi shahrnaz. azizi@intel. com Po-Kai Huang po-kai. huang@intel. com Qinghua Li Xiaogang Chen Chitto Ghosh Intel 2111 NE 25 th Ave, Hillsboro OR 97124, USA quinghua. li@intel. com +1 -503 -724 -893 xiaogang. c. chen@intel. com chittabrata. ghosh@intel. com Laurent Cariou laurent. cariou@intel. com Yaron Alpert yaron. alpert@intel. com Assaf Gurevitz assaf. gurevitz@intel. com Ilan Sutskover Feng Jiang ilan. sutskover@intel. com feng 1. jiang@intel. com Submission Slide 4 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Phone Hongyuan Zhang Email hongyuan@marvell. com Lei Wang Leileiw@marvell. com Liwen Chu liwenchu@marvell. com Jinjing Jiang jinjing@marvell. com Yan Zhang yzhang@marvell. com Rui Cao ruicao@marvell. com Sudhir Srinivasa Bo Yu Marvell 5488 Marvell Lane, Santa Clara, CA, 95054 Saga Tamhane 408 -222 -2500 sudhirs@marvell. com boyu@marvell. com sagar@marvell. com Mao Yu my@marvel. . com Xiayu Zheng xzheng@marvell. com Christian Berger crberger@marvell. com Niranjan Grandhe ngrandhe@marvell. com Hui-Ling Lou Submission hlou@marvell. com Slide 5 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Jianhan Liu Address Phone Email 2860 Junction Ave, San Jose, CA 95134, USA +1 -408 -526 -1899 jianhan. Liu@mediatek. com Thomas Pare Chao. Chun Wang James Wang thomas. pare@mediatek. com chaochun. wang@mediatek. c om Mediatek USA james. wang@mediatek. com Tianyu Wu tianyu. wu@mediatek. com Russell Huang russell. huang@mediatek. co m James Yee Mediatek No. 1 Dusing 1 st Road, Hsinchu, Taiwan +886 -3 -567 -0766 james. yee@mediatek. com Frank Hsu frank. hsu@mediatek. com Joonsuk Kim joonsuk@apple. com mujtaba@apple. com Aon Mujtaba Guoqing Li Eric Wong guoqing_li@apple. com Apple ericwong@apple. com Chris Hartman chartman@apple. com Jarkko Kneckt jkneckt@apple. com Submission Slide 6 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation David X. Yang Jiayin Zhang Jun Luo Yingpei Lin Jiyong Pang Zhigang Rong Jian Yu Ming Gan Yuchen Guo Yunsong Yang Junghoon Suh Huawei Address F 1 -17, Huawei Base, Bantian, Shenzhen 5 B-N 8, No. 2222 Xinjinqiao Road, Pudong, Shanghai 10180 Telesis Court, Suite 365, San Diego, CA 92121 NA F 1 -17, Huawei Base, Bantian, Shenzhen 10180 Telesis Court, Suite 365, San Diego, CA 92121 NA 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada Peter Loc Edward Au Teyan Chen Yunbo Li Submission Phone Email david. yangxun@huawei. com +86 -18601656691 zhangjiayin@huawei. com jun. l@huawei. com +86 -18665891036 Roy. luoyi@huawei. com linyingpei@huawei. com pangjiyong@huawei. com zhigang. rong@huawei. com ross. yujian@huawei. com ming. gan@huawei. com guoyuchen@huawei. com yangyunsong@huawei. com Junghoon. Suh@huawei. com peterloc@iwirelesstech. com 303 Terry Fox, Suite 400 Kanata, Ottawa, Canada F 1 -17, Huawei Base, Bantian, Shenzhen Slide 7 edward. ks. au@huawei. com chenteyan@huawei. com liyunbo@huawei. com Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Phone Email Jinmin Kim Jinmin 1230. kim@lge. com Kiseon Ryu kiseon. ryu@lge. com Jinyoung Chun jiny. chun@lge. com Jinsoo Choi js. choi@lge. com Jeongki Kim Dongguk Lim LG Electronics 19, Yangjae-daero 11 gil, Seocho-gu, Seoul 137130, Korea jeongki. kim@lge. com dongguk. lim@lge. com Suhwook Kim suhwook. kim@lge. com Eunsung Park esung. park@lge. com Jay. H Park Hyunh. park@lge. com Han. Gyu Cho hg. cho@lge. com #9 Wuxingduan, Xifeng Rd. , Xi'an, China Bo Sun Kaiying Lv Yonggang Fang Ke Yao Weimin Xing Brian Hart Pooya Monajemi Submission ZTE Cisco Systems 170 W Tasman Dr, San Jose, CA 95134 Slide 8 sun. bo 1@zte. com. cn lv. kaiying@zte. com. cn yfang@ztetx. com yao. ke 5@zte. com. cn xing. weimin@zte. com. cn brianh@cisco. com pmonajem@cisco. com Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Phone Email Samsung Innovation Park, Cambridge CB 4 0 DS (U. K. ) Maetan 3 -dong; Yongtong-Gu Suwon; South Korea 1301, E. Lookout Dr, Richardson TX 75070 Innovation Park, Cambridge CB 4 0 DS (U. K. ) 1301, E. Lookout Dr, Richardson TX 75070 Maetan 3 -dong; Yongtong-Gu Suwon; South Korea +44 1223 434633 f. tong@samsung. com +82 -31 -279 -9028 hyunjeong. kang@samsung. com (972) 761 7437 k. josiam@samsung. com +44 1223 434600 m. rison@samsung. com (972) 761 7470 rakesh. taori@samsung. com +82 -10 -8864 -1751 s 29. chang@samsung. com Yasushi Takatori +81 46 859 3135 takatori. yasushi@lab. ntt. co. jp Yasuhiko Inoue +81 46 859 5097 inoue. yasuhiko@lab. ntt. co. jp +81 46 859 5107 Shinohara. shoko@lab. ntt. co. jp +81 46 859 3494 asai. yusuke@lab. ntt. co. jp Koichi Ishihara +81 46 859 4233 ishihara. koichi@lab. ntt. co. jp Junichi Iwatani +81 46 859 4222 Iwatani. junichi@lab. ntt. co. jp +81 46 840 3759 yamadaakira@nttdocomo. com Fei Tong Hyunjeong Kaushik Josiam Mark Rison Rakesh Taori Sanghyun Chang Shoko Shinohara Yusuke Asai Akira Yamada Submission NTT DOCOMO 1 -1 Hikari-no-oka, Yokosuka, Kanagawa 239 -0847 Japan 3 -6, Hikarinooka, Yokosuka-shi, Kanagawa, 239 -8536, Japan Slide 9 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Authors (continued) Name Affiliation Address Phone Email Masahito Mori Masahito. Mori@jp. sony. com Yusuke Tanaka Yusuke. C. Tanaka@jp. sony. com Yuichi Morioka Yuichi. Morioka@jp. sony. com Sony Corp. Kazuyuki Sakoda Kazuyuki. Sakoda@am. sony. com William Carney William. Carney@am. sony. com Sigurd Schelstraete Huizhao Wang Sigurd@quantenna. com Quantenna hwang@quantenna. com Minho Cheong minho. cheong@newracom. com Reza Hedayat reza. hedayat@newracom. com Young Hoon Kwon Yongho Seok Newracom 9008 Research Dr. Irvine, CA 92618 younghoon. kwon@newracom. co m yongho. seok@newracom. com Daewon Lee daewon. lee@newracom. com Yujin Noh yujin. noh@newracom. com Submission Slide 10 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Submission Slide 11 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Introduction • Currently bit field ordering of HE-SIG-A in HE PPDUs is not finalized • Field reordering is required. For e. g. , • Format field should be aligned between HE SU and HE TRIG PPDU • Early occurrence of Beam change, MCS, and DCM fields helpful • PAPR performance of HE-SIG-A is improved by reordering • In these slides we present bit field finalization of HESIG-A in HE SU PPDU, HE_EXT SU PPDU, HE MU PPDU, and HE_TRIG PPDU Submission Slide 12 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Key changes to fields of HE-SIG-A in HE PPDU formats • Reordering of fields • Beam change, MCS, DCM, LTF + CP, and Nsts moved to HE-SIG -A 1 • TXOP Duration moved to HE-SIG-A 2 • PAPR performance examples of proposed bit field ordering of HE-SIG-A in HE PPDU formats is shown in Appendix Submission Slide 13 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Spec. Text on Bit Field Ordering of HESIG-A in HE PPDUs Please refer to 11 -16/0915 -02 -00 ax Submission Slide 14 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 Summary • We presented bit field finalization of HE-SIG-A in HE PPDU formats • HE-SIG-A bit field ordering guided by the following principles • HE-SIG-A 1 and HE-SIG-A 2 symbol boundary is honored • PAPR performance is not degraded Submission Slide 15 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 SP#1 • Do you agree to adopt the spec. text changes proposed in “ 11 -16 -0915 -02 -00 ax”? • Yes • No • Abstain Submission Slide 16 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 APPENDIX Submission Slide 17 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 PAPR of HE-SIG-A in HE SU PPDU/HE EXT All 0's PAPR All 1's Format 1 1 Beam change 1 1 UL/DL 0 0 MCS 0 11 0 0 63 6. 4968 d. B DCM BSS Color A 1 0 6. 6448 d. B Reserved 1 1 SR 0 0 BW 0 3 LTF+CP 0 3 Nsts 0 7 Txop Duration 127 Coding 0 1 LDPC Extra Symbol Segment 1 1 STBC 0 0 Tx. Bf Submission PAPR All 0's. All 1's 0 5. 9703 d. B 1 7. 6236 d. B Packet Extension 0 3 Reserved 1 1 Doppler 0 0 CRC 12 11 Tail 0 0 A 2 Slide 18 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 PAPR of HE-SIG-A in HE MU PPDU/HE EXT All 0's PAPR All 0's. All 1's 0 0 0 1 0 6. 6005 d. B 0 1 0 UL/DL MCS DCM BSS Color SR BW A 1 SIGB Number of symbols SIGB Compression LTF+CP Doppler Txop Duration Reserved number of HE LTFs LDPC Extra Symbol Segment STBC Packet Extension CRC Tail Submission A 2 0 5. 2929 d. B 0 0 13 0 Slide 19 PAPR All 1's 0 5 0 62 0 3 6. 3474 d. B 7 1 3 0 127 1 5. 7398 d. B 0 3 2 0 Lochan Verma, Qualcomm et. al
doc. : IEEE 802. 11 -16/0914 r 1 PAPR of HE-SIG-A in HE Trigger-based PPDU HE TRIG All 0's Format BSS Color SR A 1 PAPR All 1's 0 0 1 62 0 8. 5387 d. B 14 6. 8755 d. B Reserved 1 1 BW 0 3 TXOP Duration 0 127 255 Reserved 0 6. 099 d. B 0 6. 2682 d. B CRC 8 0 Tail 0 0 Doppler Submission PAPR All 0's. All 1's A 2 Slide 20 Lochan Verma, Qualcomm et. al
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