Detector Thermal RunawayFacing Thickness Objective for Updating Thermal
Detector Thermal Runaway-Facing Thickness • Objective for Updating Thermal Runaway Prediction • – Assess stave composite facing thickness reduction from 0. 7 mm to 0. 21 mm: 1 m stave length • Reduction permitted in mid-span support concept • Fiber lay-up affects in-plane thermal conductivity – 0. 70 mm thickness: W/m. K • 352 axial, 89 transverse – 0. 21 mm or 0. 28 mm thickness: W/m. K • 221 axial, 221 transverse Result – Insignificant effect, higher transverse 10 layers 0. 7 mm 90/0/0/s versus K’s offset thickness reduction 3 layers 0. 21 mm 90/0/0 or 4 layers 0. 28 mm 90/0/0/90 W. O. Miller i. Ti VG 1
Thermal Model-10 cm Wide Stave • Description – One detector module long (10 cm by 10 cm) – 80 chips @ 250 m. W/chip – Surface heating per Nobu’s curve – Coolant tube surface temp=-22ºC – Number of elements comprising parts and interface contact materials > 1. 1 million – Number of nodes 211123 • Results – Detector temperature nominally minus 15. 7ºC at outer edge for second row chips – Surface heating average 15. 9 m. W/cm 2 W. O. Miller i. Ti VG 2
Thermal Model-10 cm Wide Stave • Description – One detector module long (10 cm by 10 cm) – 80 chips @ 250 m. W/chip – Surface heating per Nobu’s curve – Coolant tube surface temp=-22ºC – Number of elements comprising parts and interface contact materials > 1. 1 million – Number of nodes=211123 • Results – Detector temperature nominally minus 15. 7ºC at outer edge for second row chips – Surface heating average 15. 9 m. W/cm 2 W. O. Miller i. Ti VG 3
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