Demands for Producing IPC Class 3! Seminar MITT University 2014 -11 -27 Lars-Olof Wallin IPC European Representative
IPC Part: 7 Introduction to Produce acc to IPC Class 3 How extensive is it to write a specification?
What expectations do you have of this workshop? The answer is? You hope to find some Gold!
I can convert Lead into GOLD!!
Which IPC Standards does is most known? IPC-A-610 E?
Is it OK according to IPC-610 E Class 3?
IPC-A-610 E
It is not OK!!
The board didn't work!
Rev E Will this book solve the problems? NO!!
Questions? ? • Please answer the following questions: • Do you have demands for IPC Class 3 today? • Have you some problems with the solder joint results and or your bare boards?
Why do you have PROBLEMS? The Answer is: Lot of parameters during the entire production chain!
Number of Combinations 4200 000 000 0 Too Many!!
PWB STENCIL PASTE Digital Data COMPONENTS
Let us take some examples!
Offset resist window opening up track and possibly touching BGA pad
Implications of CTE in the Z-direction Copper wall Solder filled via hole Inner layer Crack Greater tendency for cracks betwee inner layer and the wall for wider holes. Greater tendency for barrel crack in thinner via holes (larger aspect ratio)
What can GO WRONG?
I like complicated functions on a small surface!! Is the Electronic Design the ROOT CAUSE? The Electronic Designer
What is IPC-7351 B? My footprints hasn't changed since 1903! Is the CAD the ROOT CAUSE? The CAD People
Is the Bare Board the ROOT CAUSE? Is PCB OK?
What do you see here? How many PTH do you have in your PCB?
PWB STENCIL PASTE Digital Data COMPONENTS
CAM Screen print Is the Screen printing the Loading ROOT CAUSE? Jet printer Loading
Pick & Place Is the Pick & Place the ROOT CAUSE? Pick & Place
AOI Unload Reflow Is the Reflow or Wave Soldering the Unload ROOT CAUSE? Vapor Phase Pick & Place X-Ray Repair of BGA