DAEDUCK Speed Challenge DAEDUCK Micro via PCB CONFIDENTIAL
DAEDUCK Speed & Challenge DAEDUCK Micro via PCB CONFIDENTIAL
DAEDUCK Build Up Status of DAEDUCK CONFIDENTIAL Speed & Challenge
Speed & Challenge DAEDUCK New Factory for Build-Up Boards (Daeduck Bisuness Unit #2) Inspection PSR RCC Press Image /Etching Cu Plating CONFIDENTIAL AOI Laser drill Gold Plating
DAEDUCK Mass Production Schedule CONFIDENTIAL Speed & Challenge
Speed & Challenge DAEDUCK Laser Micro Via Process Flow Inner Layer Window Etching Stripping Dry Film CONFIDENTIAL RCC Lamination by Hot Press Laser Drilling Dry Film Lamination Desmear (Hall Cleaning) Window Image Developing Copper Plating
DAEDUCK - Manufacturing Flow (Conventional PCB) CONFIDENTIAL Speed & Challenge
DAEDUCK - Manufacturing Flow (Type-A) CONFIDENTIAL Speed & Challenge
DAEDUCK - Manufacturing Flow (Type-B) CONFIDENTIAL Speed & Challenge
DAEDUCK - Manufacturing Flow (TYPE-C) CONFIDENTIAL Speed & Challenge
DAEDUCK Daeduck Bluld-Up Board Types (6 Layer) CONFIDENTIAL Speed & Challenge
DAEDUCK Daeduck Bluld-Up Board Types (8 Layer) CONFIDENTIAL Speed & Challenge
Speed & Challenge DAEDUCK Detailed Design Rule Laser Micro Via Hole Design Rule Schematic Diagram of LVH B A B A D C 1 -2 LVH CONFIDENTIAL C 2 -3 LVH C 1 -2 -3 LVH
DAEDUCK Speed & Challenge Mechanical Hole Design Rule B B C C A A PTH IVH Line Width/Space Design Rule OW OS IW CONFIDENTIAL IS
Speed & Challenge DAEDUCK Daeduck Laser Drilling 1 st shot 2 nd shot 3 rd shot Cross-section of Φ 120㎛ Laser Via mobile phone peaces per month CONFIDENTIAL
Speed & Challenge DAEDUCK Laser Via Hole Reliability Data 1. Thermal Cycle Test 1) Specification Thermal Cycle Test : IPC TM-650 -2. 6. 7. 2, NPS 25001 5. 2. 3. 1 Condition : -55℃/15 min - +125℃/15 min Machine : BOTSCH VI 7012 S 2 / 2 chambers / transfer time less than 10 sec. Evaluation : Resistance change less than 10% Resistance change (%) 2) Result cycle - Resistance change less than 3% : OK CONFIDENTIAL
Speed & Challenge DAEDUCK 2. Hot Oil Dip Test ( Micro Via Reliability ) 1) Specification Daeduck Spec. Evaluation : Have to stand 5 times of Hot Oil Dip Purpose : Laser Via Hole Reliability (Cracked laser via holes result in OPEN’s) 2) Method Step 1 : Prepare PCB’s that passed BBT Step 2 : Dip in 200℃ PEG for 1 min. Step 3 : Cool water quenching Step 4 : Repeat Stpe 2 -3 four times. (total 5 times) Step 5 : Water rinse Step 6 : Re-BBT (Bare Board Test) Bare Board Tester Good Boards 5 times 200℃ PEG 1 min. Cool water quenching Re - Bare Board Tester Test Flow 3) Result - No Open&Short After Hot Oil Dip * Used Oil : Poly Ethylene Glycol (PEG) CONFIDENTIAL Laser Via after Hot Oil Dip
Speed & Challenge DAEDUCK TECHNOLOGY ROADMAP of DAEDUCK Categories: a. Normal product; CONFIDENTIAL b. Build up product with microvia; c. Substrate for package
DAEDUCK CONFIDENTIAL Speed & Challenge
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